SGS Thomson Microelectronics STB60NE03L-12 Datasheet

®
N - CHANNEL 30V - 0.009 - 60A - D2PAK
"SINGLE FEATURE SIZE" POWER MOSFET
TYPE V
DSS
STB60NE03L-12 30 V <0.012 60 A
TYPICAL R
AVALANCE RUGGED TECHNOLOGY
100% AVALANCHE TESTED
REPETITIVE AVA LANCHE DATA AT 100
LOW GATE CHARGE
HIGH CURRENT CAPABILITY
o
175
APPLICATION ORIENTED
C OPERATING TEMPERATURE
DS(on)
CHARACTERIZATION
DESCRIPTION
This Power MOSFET is the latest development of STMicroelectronics unique "Single Feature Size" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
R
DS(on)
I
D
o
C
STB60NE03L-12
PRELIMINARY DATA
3
1
D2PAK
TO-263
(Suffix "T4")
INTER NAL SCH E M ATI C DIAG RA M
APPLICATIONS
HIGH CURRENT, HIGH SPE ED SWI TCHING
SOLENOID AND RELAY DRIVER S
DC-DC & DC-AC CONVERT E R
AUTOMOTIVE ENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
V
I
DM
P
dv/dt Peak Diode Recovery voltage slope 7 V/ns
T
(•) Pulse width limited by safe operating area (1) ISD 60 A, di/dt 300 A/µs, VDD V
July 1998
Drain-source Voltage (VGS = 0) 30 V
DS
Drain- gate Voltage (RGS = 20 k)
DGR
Gate-source Voltage ± 20 V
GS
I
Drain Current (continuous) at Tc = 25 oC60A
D
I
Drain Current (continuous) at Tc = 100 oC42A
D
30 V
() Drain Current (pulsed) 240 A
Total Dissipation at Tc = 25 oC100W
tot
Derating Factor 0.67 W/oC
Storage Temperature -65 to 175
stg
T
Max. Operating Junction Temperature 175
j
, Tj T
(BR)DSS
JMAX
o
C
o
C
1/5
STB60NE3L1-16
THERMAL DATA
R
thj-case
Rthj-amb
R
thc-si n k
T
Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose
l
AVALANCHE CHARACTERI S TICS
Symbol Parameter Max Value Unit
I
AR
E
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
Single Pulse Avalanche Energy
AS
(starting T
= 25 oC, ID = IAR, V
j
ma x)
j
DD
= 15 V)
1.5
62.5
0.5
300
60 A
150 mJ
o
C/W
oC/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
= 25 oC unless otherwise specified)
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
I
= 250 µA V
D
GS
= 0
30 V
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
= 0)
= Max Rating
V
DS
V
= Max Rating Tc = 125 oC
DS
V
= ± 20 V
GS
1
10
± 100 nA
ON ()
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold
V
= VGS ID = 250 µA
DS
1 1.7 2.5 V
Voltage
R
DS(on)
I
D(on)
Static Drain-source On Resistance
VGS = 10 V ID = 30 A V
= 5 V ID = 30 A
GS
On State Drain Current VDS > I
V
= 10 V
GS
D(on)
x R
DS(on)max
0.009 0.012
0.018ΩΩ
60 A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
gfs () Forward
Transconductance
C
C
C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS > I
V
DS
x R
D(on)
DS(on)max
= 25 V f = 1 MHz V
ID =30 A 20 30 S
= 0 2200
GS
570 200
2800
750 250
µA µA
pF pF pF
2/5
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