SGS Thomson Microelectronics STB40NF10-1 Datasheet

STP40NF10
STB40NF10 - STB40NF10-1
N-CHANNEL 100V - 0.024Ω - 50A TO-220/D2PAK/I2PAK
TYPE V
STP40NF10 STB40NF10 STB40NF10-1
TYPICAL R
EXCEPTIONA L dv/d t CAPABILITY
100% AVALANCHE TESTED
APPLICATION ORIENTED
DS
DSS
100 V 100 V 100 V
(on) = 0.024
R
DS(on)
< 0.028 < 0.028 < 0.028
I
D
50 A 50 A 50 A
CHARACTERIZATION
ADD SUFFIX “T4” FOR ORDERING IN TAPE &
REEL
DESCRIPTION
This Power MOSFET series realized with STM icro­electronics unique STripFET process has specifical­ly been designed to minimize input capacitance and gate charge. It is therefore suitable as primary switch in advanced high-efficiency isolated D C-DC converters for T el ecom and Computer application. It is also intended for any application with low gate charge drive requirements.
APPLICATIONS
HIGH-EFFICIENCY DC-DC CONVERTERS
UPS AND MOTOR CONTROL
3
2
1
1
D2PAK
TO-220
3
2
1
I2PAK
INTERNAL SCHEMATIC DIAGRAM
3
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
I
(*) Drain Current (continuous) at TC = 25°C
D
I
D
I
DM
P
TOT
dv/dt (1) Peak Diode Recovery voltage slope 20 V/ns
E
AS
T
stg
T
j
() Pulse width limited by safe operating area (*) Limited by Package
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 k)
100 V 100 V
Gate- source Voltage ± 20 V
50 A
Drain Current (continuous) at TC = 100°C
(l)
Drain Current (pulsed) 200 A Total Dissipation at TC = 25°C
35 A
150 W
Derating Factor 1 W/°C
(2)
Single Pulse Avalanche Energy 150 mJ Storage Temperature Operating Junction Temperature
(1) ISD 40A, di/dt ≤600A/µs, VDD V (2) Starting Tj = 25°C, ID = 40A, VDD = 50V
– 55 to 175 °C
(BR)DSS
, Tj T
JMAX.
1/11September 2002
STP40NF10 - STB40NF10 - STB40NF10-1
THERMA L D ATA
Rthj-case Thermal Resistance Junction-case Max 1 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose 300 °C
ELECTRICAL CHARACTERISTICS (T
= 25 °C UNLESS OTHERWISE SPECIFIED)
CASE
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID = 250 µA, VGS = 0 100 V
Breakdown Voltage
V
= Max Rating
DS
V
= Max Rating, TC = 125 °C
DS
V
= ± 20V ±100 nA
GS
A
10 µA
ON
I
I
GSS
(1)
DSS
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
= 0)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
= VGS, ID = 250µA
DS
VGS = 10V, ID = 20 A
2 2.8 4 V
0.024 0.028
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS = 25V, ID= 20 A 20 S
g
fs
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance 265 pF Reverse Transfer
Capacitance
V
= 25V, f = 1 MHz, VGS = 0
DS
1780 pF
112 pF
2/11
STP40NF10 - STB40NF10 - STB40NF10-1
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time 63 ns Total Gate Charge VDD = 80V, ID =40A,VGS = 10V 60
Gate-Source Charge 10 nC Gate-Drain Charge 23 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
f
Turn-off-Delay Time Fall Time
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pu l se duration = 300 µs, duty c ycle 1.5 %.
2. Pulse width li mited by safe operating area.
Source-drain Current 40 A
(2)
Source-drain Current (pulsed) 160 A Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
= 50 V, ID = 20 A
DD
R
= 4.7 VGS = 10V
G
(see test circuit, Figure 3)
VDD = 50 V, ID = 20 A, RG=4.7Ω, V
GS
= 10V
(see test circuit, Figure 3)
ISD = 40 A, VGS = 0
= 40 A, di/dt = 100A/µs,
I
SD
VDD = 25V, Tj = 150°C (see test circuit, Figure 5)
28 ns
80
84 28
1.3 V
114 456
8
nC
ns ns
ns
nC
A
Thermal Impedance Safe Operating Area
3/11
STP40NF10 - STB40NF10 - STB40NF10-1
Output Characteristics
Transfer Characteristics
Static Drain-source On ResistanceTransconductanc e
Gate Charge vs Gate-source Voltage
4/11
Capacitance Variations
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