SGS Thomson Microelectronics STB36NF02L Datasheet

STB36NF02L
N-CHANNEL 20V - 0.016
- 36A D2PAK
LOW GATE CHARGE STripFETPOWER MOSFET
TYPICALR
DS(on)
= 0.016
TYPICALQ
g
= 19 nC @ 10V
OPTIMAL R
DS(on)xQg
TRADE-OFF
CONDUCTION LOSSESREDUCED
SWITCHINGLOSSESREDUCED
DESCRIPTION
This applicationspecific Power Mosfet is the third generation of STMicroelectronics unique ”Single Feature Size” strip-based process. The resul­ting transistor shows the best trade-off between on-resistance and gate charge. When used as high and low side in buck regulators, it gives the best performancein termsof both conductionand switching losses. This is extremely important for motherboardswhere fast switching and high effi­ciencyare of paramount importance.
APPLICATIONS
SPECIFICALLYDESIGNEDAND
OPTIMISEDFOR HIGH EFFICIENCY CPU CORE DC/DC CONVERTERS
INTERNAL SCHEMATIC DIAGRAM
October 1999
1
3
D2PAK
TO-263
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
Dra in- sour c e Volt age ( VGS=0) 20 V
V
DGR
Dra in- gate V ol t age ( RGS=20kΩ)20V
V
GS
Gat e-source Voltage
±
20 V
I
D
Dra in C u rr ent (c ontinuous) at Tc=25oC36A
I
D
Dra in C u rr ent (c ontinuous) at Tc=100oC25A
I
DM
() Dra in Current ( p uls ed ) 144 A
P
tot
Tot al Dis s ipation at Tc=25oC75W Der ati ng Fac t or 0.5 W/
o
C
T
stg
St orage Tempe rat ure -65 t o 175
o
C
T
j
Max. O perating Junc t ion T emperat ure 175
o
C
() Pulse width limited by safeoperating area
TYPE V
DSS
R
DS(on)
I
D
ST B36NF02L 20 V < 0.021 36 A
ADD SUFFIX ”T4” FOR ORDERING IN TAPE & REEL
1/6
THERMAL DATA
R
thj-case
R
thj-amb
T
l
Ther mal Resistanc e Junct ion-case Max Ther mal Resistanc e Junct ion-ambient Max Maximum Lead Tem pe ra tur e For Solder ing Purpose
2
62.5 300
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
(T
case
=25oC unless otherwisespecified)
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source Break dow n V o lt age
ID=250µAVGS=0 20 V
I
DSS
Zero Gate Voltage Drain Cur re nt ( V
GS
=0)
V
DS
=MaxRating
V
DS
=MaxRating Tc=125oC
1
10
µA µ
A
I
GSS
Gat e- bod y L eakage Current (V
DS
=0)
V
GS
= ± 20 V ± 100 nA
ON(∗)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Volt age VDS=VGSID= 250 µA12.5V
R
DS(on)
Sta t ic Drain -s ource On Resistance
VGS=10V ID=18A V
GS
=4.5V ID=18A
0.016
0.023
0.021
0.03
Ω Ω
I
D(on)
On State Drain Current VDS>I
D(on)xRDS(on )max
VGS=10V
36 A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
(∗)Forward
Tr ansc on duc tance
VDS>I
D(on)xRDS(on )maxID
=18 A 20 S
C
iss
C
oss
C
rss
Input Capac i t ance Out put Capacitance Reverse Tr ansfer Capacit a nc e
VDS=25V f=1MHz VGS= 0 750
270
60
pF pF pF
STB36NF02L
2/6
Loading...
+ 4 hidden pages