SGS Thomson Microelectronics STB11NB40 Datasheet

STB11NB40
N - CHANNEL ENHANCEMENT MODE
PowerMESH MOSFET
TYPE V
DSS
R
DS(on)
I
D
ST B11NB40 400 V < 0. 5 5 10.7 A
TYPICALR
EXTREMELY HIGH dV/dt CAPABILITY
100% AVALANCHETESTED
GATECHARGEMINIMIZED
DS(on)
=0.48
DESCRIPTION
Using the latest high voltage MESH OVERLAY process, SGS-Thomson has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company’s proprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switchingcharacteristics.
APPLICATIONS
HIGH CURRENT, HIGH SPEEDSWITCHING
SWITCHMODEPOWER SUPPLIES(SMPS)
DC-ACCONVERTERS FORWELDING
EQUIPMENTAND UNINTERRUPTIBLE POWERSUPPLIESAND MOTORDRIVE
3
2
I2PAK
TO-262
(suffix ”-1”)
1
(suffix ”T4”)
1
D2PAK
TO-263
INTERNAL SCHEMATIC DIAGRAM
3
ABSOLUTE MAXIMUM RATINGS
Symb o l Para meter Value Uni t
V
V
V
I
DM
P
dv/dt(
T
() Pulse width limited by safe operating area (1)ISD≤ 11A, di/dt ≤ 200 A/µs, VDD≤ V
March 1998
Drain-source Volt age (VGS=0) 400 V
DS
Drain- gate Voltage ( RGS=20kΩ)
DGR
Gat e- sourc e Vo lt age ± 30 V
GS
I
Drain C urr ent ( contin uous) at Tc=25oC10.7A
D
I
Drain C urr ent ( contin uous) at Tc=100oC6.7A
D
400 V
() Dra in C urr ent ( pul sed) 42.8 A
Tot al Diss ip at i on at Tc=25oC125W
tot
Derating Factor 1.0 W/
1) Peak Diode Re c overy vo lt age slope 4.5 V/ns
Sto rage Tempe r ature -65 to 150
stg
T
Max. Operatin g J u nct ion T emper at u r e 150
j
,Tj≤T
(BR)DSS
JMAX
o
C
o
C
o
C
1/9
STB11NB40
THERMAL DATA
R
thj-case
Rthj-amb
R
thc-sin k
T
AVALANCHE CHARACTERISTICS
Symbol Para met e r Max Valu e Unit
I
AR
E
Ther mal Resist ance Junctio n- case Max Ther mal Resist ance Junctio n- ambient Max Ther mal Resist ance Case-si nk Typ Maximum Lea d Tempera t u re F or Sold eri ng Purpose
l
Avalanche Curre nt , Repetitive or Not-Repet it ive (pulse w idth limited by T
Single Pulse Avalanche Energy
AS
(starting T
=25oC, ID=IAR,VDD=50V)
j
max, δ <1%)
j
1.0
62.5
0.5
300
10.7 A
530 mJ
o
C/W
oC/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
=25oC unlessotherwisespecified)
case
OFF
Symbol Parameter Test Condition s Min. Typ. Ma x. Unit
V
(BR)DSS
Drain-sourc e
=250µAVGS=0
I
D
400 V
Breakdown Volt age
I
DSS
I
GSS
Zer o Gat e V o lt age Drain Current (V
GS
Gat e-body Leak a ge Current (V
DS
=0)
=0)
=MaxRating
V
DS
V
=MaxRating Tc=125oC
DS
= ± 30 V
V
GS
1
50
± 100 nA
ON ()
Symbol Parameter Test Condition s Min. Typ. Ma x. Unit
V
GS(th )
Gate Threshold
V
DS=VGSID
=250µA
345V
Voltage
R
DS(on)
Stati c Drain-so urce On
VGS=10V ID= 5.3 A 0.48 0.55
Resistance
I
D(on)
On S tate Drain Curr e nt VDS>I
D(on)xRDS(on)max
10.7 A
VGS=10V
DYNAMIC
Symbol Parameter Test Condition s Min. Typ. Ma x. Unit
g
()Forward
fs
Tr ansconduc tanc e
C
C
C
Input Ca pacitan ce
iss
Out put C apa c itanc e
oss
Reverse Trans fer
rss
Capa cit an c e
VDS>I
D(on)xRDS(on)maxID
=5.3A 5 6.5 S
VDS=25V f=1MHz VGS= 0 1115
210
22
1450
280
30
µA µA
pF pF pF
2/9
STB11NB40
ELECTRICAL CHARACTERISTICS (continued)
SWITCHINGON
Symbol Parameter Test Condition s Min. Typ. Ma x. Unit
t
d(on)
Turn-on Time
r
Rise Time
t
VDD=200V ID=5.3A
=4.7 VGS=10V
R
G
17 10
(see test circuit, figure 3)
Q
Q
Q
Total Gate Charge
g
Gat e-Sou rc e Cha rge
gs
Gate-Drain Charge
gd
VDD=320V ID=10.7A VGS= 10 V 29.5
10.6
11.8
SWITCHINGOFF
Symbol Parameter Test Condition s Min. Typ. Ma x. Unit
t
r(Voff)
t
t
Of f - voltag e Rise Time Fall Time
f
Cross-ov er T ime
c
VDD=320V ID=10.7A
=4.7 Ω VGS=10V
R
G
(see test circuit, figure 5)
10 10 17
SOURCE DRAIN DIODE
Symbol Parameter Test Condition s Min. Typ. Ma x. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
() Pulsed: Pulse duration =300 µs, duty cycle1.5 % () Pulse width limited by safe operating area
Source-drain Curre nt
()
Source-drain Curre nt (pulsed)
() For ward On Vo lt age ISD=10.7A VGS=0 1.6 V
Reverse Rec ov er y
rr
Time Reverse Rec ov er y
rr
= 10. 7 A di/dt = 100 A /µs
I
SD
=100V Tj=150oC
V
DD
(see test circuit, figure 5)
400
3.4 Charge Reverse Rec ov er y
17
Current
25 15
43 nC
14 14
25
10.7
42.8
ns ns
nC nC
ns ns ns
A A
ns
µC
A
Safe Operating Area ThermalImpedance
3/9
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