®
■
8 BIT ARCHITECTURE CPU
■
16 KBytes of USER ROM, SECTOR
COMBINATIVE
■
1.5 KByte of SYSTEM R OM
■
384 Bytes of RAM
■
16352 Bytes of EEPROM, SECTOR
COMBINATIVE
– Highly reliable CMOS EEPROM technology
– 10 year data retention
– 300,000 Erase/Write cycle endurance
– Protected One Time Programmable block (32
or 64 bytes)
– 1 to 32 bytes block e ither Erase or Write in
single cycle programming
■
EXTENDED VOLTAGE OPERATION
Range: 2.7V to 5.5V
–V
CC
■
SERIAL ACCESS, ISO 7816-3 COMPATIBLE
■
POWER SAVING STANDBY MODE
■
UP TO 5 MHz I N TERNAL OPERATING
FREQUENCY
■
VERY HIGH SECURITY FEATURES
INCLUDING EEPROM FLASH ERASE
■
CONTACT ASSIGNMENT COMPATIBLE ISO
7816-2
■
ESD PROTECTION GREATER THAN 5000V
■
MEETS GSM 11.11 AND 11.12
SPECIFICATIONS
■
2 OPE RAT ING CONFIG URAT IONS
–ISSUER
– USER
ST16SF4F
Smar tcard MCU
With 16352 Bytes EEPROM
DATA BRIEFING
Micromodule (D4)
Wafer
BD.SF4F/9809V1
This is Brief Data from STMicroelectronics. Details are subject to change without notice. For complete data, please contact
your nearest Sales Office or SmartCard Products Divison, Rousset, France. Fax: (+33) 4 42 25 87 29
1/2
ST16SF4F
DESCRIPTION
The ST16SF4F, a member of the standard ST16
device family, is a serial access microcontroller
especially designed for high volume and cost
competitive Smartcard applications where
firmware security algorithm must be implemented.
The ST16SF4F is based on 8 bit CPU core and includes on chip memories: 384 Bytes of RAM, 16
KBytes of USER ROM, 1.5 KByte of SYSTEM
ROM, and 16352 Bytes of EEPROM.
Both ROM and EEPROM memorie s can be configured into two sectors. Access rules from any
memory section or sector to any other are set-up
by the User’s defined Memory Access Control Matrix (M ACM) .
Reliabilit y data related to the ST16SF 4F product
manufactured using STMicroelectronics advanced CMOS EEPRO M te chnology confirm data
retention up to 10 years and endurance up to
300,000 Erase/Write cycles.
As all other ST16 family members, the ST16SF4F
is fully compatible with the ISO standards for
Smartcard applications.
Software development (ROM code, options) can
be completed by the ST16-19HDS development
system.
The ST16SF4F can be delivered either in unsawn
or sawn wafers, 180 or 275 micron thickness as
well as in micromodule package.
Figure 1. Bloc k D ia gram
8 BIT
CPU
CLK
SERIAL I/0's
INTERFACE
I/O1
I/O2
BYTES
RAM
384
NUMBER
GENERATOR
SYSTEM
ROM
1.5 KBtyt e
SECT.
S
V GENERATION
ROM
1615 KBytes
SECTORS
COMBIN.
SECT. ASECT.
B
MEMORY ACCESS CONTROL MATRIX
INTERNAL BUS
SECURITY
LOGIC
SECTOR
PP
EEPROM
16352 Byt es
SECTORS COMBINATIVE
A
SECTOR
B
RST
V
CC
GND
2/2
SCP 102b/DS