HF/VHF/UHF N-CHANNEL MOSFETs
■ GOLDMETALLIZATION
■ EXCELLENTTHERMAL STABILITY
■ COMMONSOURCE CONFIGURATION
■ POUT = 300W MIN. WITH 12.5 dB GAIN
@175MHz
DESCRIPTION
The SD2922 is a gold metallizedN-Channel MOS
field-effect RF power transistor. The SD2922 is
intended for use in 50V dc large signal
applicationsup to 200 MHz
SD2922
RF POWER TRANSISTORS
M244
epoxy sealed
ORDER CODE BRANDING
SD2922 SD2922
PIN CONNECTION
1. Drain 3. Source
2. Gate
ABSOLUTE MAXIMUM RATINGS (T
Symb o l Para meter Val u e Uni t
V
(BR)DSS
V
V
P
T
Drain S our ce Vo lt age 125 V
Drain-Gate Voltage (RGS=1MΩ)
DGR
Gat e- Source Voltage ±20 V
GS
Drain C urr ent 40 A
I
D
Power Di ss ipation 500 W
DISS
Max. Operating Junction Te mperatur e +200
T
j
Sto rage Temperature -65 to 150
STG
case
=25oC)
125 V
THERMAL DATA
R
th(j-c)
R
th(c-s)
∗ Determined using a flat aluminumor copper heatsink with thermal compound applied (Dow Corning 340 or equivalent).
November 1999
Junct ion-Case Ther mal R esista nce 0.35
Case Heatsink Ther mal Resistance ∗
0.12
o
o
o
C/W
o
C/W
C
C
1/13
SD2922
ELECTRICAL SPECIFICATION (T
case
=25oC)
STATIC (per section)
Symbol Para met e r Mi n . Typ . Ma x. Unit
V
(BR)DSSVGS
I
DSS
I
GSS
V
GS(Q)
V
DS(on)VGS
gfs V
C
ISS
C
OSS
C
RSS
=0V IDS= 1 00 mA 125 V
VGS=0V VDS=50V 5 mA
VGS=20V VDS=0V 5 µA
VDS=10V ID=250mA 1 5 V
=10V ID=10A 3 V
=10V ID=5A 4 mho
DS
VGS=0V VDS= 5 0 V f = 1 MHz 411 pF
VGS=0V VDS= 5 0 V f = 1 MHz 198 pF
VGS=0V VDS=50V f=1MHz 27 pF
REF. 1021306E
DYNAMIC
Symbol Para met e r Mi n . Typ . Ma x. Unit
P
OUT
G
η
Load
Mismatch
f = 175 MHz VDD=50V IDQ= 5 00 mA 300 W
f = 175 MHz VDD=50V P
PS
f = 175 MHz VDD=50V P
D
f = 175 MHz V
DD
=50V P
=300W IDQ= 5 00 mA 12.5 15 dB
out
=300W IDQ= 5 00 mA 50 60 %
out
=300W IDQ=500mA
out
5:1 VSWR
All Phase Angles
IMPEDANCEDATA
Measured Gate to Gate and Drain toDrain, respectively.
FREQ. ZIN(Ω) ZDL(Ω)
175 MHz 0 .92 - j 0.14 3.17 + j 4.34
2/13
SD2922
MaximumThermal Resistancevs Case
Temperature
0.42
0.4
0.38
Rth(j-c)(ºC/W)
0.36
0.34
25 45 65 85
Tc,Case Temperature (°C)
Capacitancevs Drain-SourceVoltage
10000
1000
100
C, CAPACITANCE (pF)
10
0 102030405060
VDS, DRAIN-SOURCE VOLTAGE (VOLTS)
GC81240
Ciss
Coss
Crss
GC83360
DC Safe OperatingArea
100
50
30
20
(1)
10
5
Ids, DRAIN CURRENT (A)
3
2
1
1 2 5 10 20 50 100 200 500 1,000
Vds, DRAIN SOURCEVOLTAGE(V)
(1) Currentinthisareamaybelimited by RDS(on)
Twosides,each sectionequallyloaded
GC81900
Drain Current vs Gate Voltage
12
10
VDS = 10V
8
6
4
ID, DRAIN CURRENT (A)
2
0
1234567
Tc= 25°C
Tc= 80°C
Tc= -20°C
VGS GATE-SOURCE VOLTAGE (VOLTS)
GC81250
Gate Voltage vs Case Temperature
1.15
1.1
1.05
1
0.95
0.9
VGS, GATE-SOURCE VOLTAGE(Normalized)
0.85
-25 0 25 50 75 100
Tc, CASE TEMPERATURE (ºC)
Id= 0.25A
Id= 1A
Id = 2A
GC81260
Id= 5A
Id= 4A
Id= 0.1A
3/13
SD2922
TYPICALPERFORMANCE(175 MHz)
OutputPowervs Input Power
400
Vdd = 50V
300
200
100
Pout, OUTPUT POWER (W)
0
135791113
f=175MHz
IDQ = 500 mA
Pin, INPUT POWER (W)
GC81200
Vdd = 40V
OutputPowervs Supply Voltage
GC81220
Pin = 13W
Pin= 10W
Pin = 5W
Pout, OUTPUTPOWER (W)
400
300
200
100
IDQ = 500mA
f = 175MHz
OutputPower vsInput Power
400
300
200
100
Pout, OUTPUT POWER (W)
0
135791113
Pin, INPUT POWER (W)
Tc = -20°C
Tc =25°C
VDD= 50V
f =175MHz
IDQ= 500 mA
Tc=80°C
OutputPower vsGateVoltage
400
Tc= -20°C
VDD= 50 V
IDQ= 50 0mA
f = 175MHz
Pin = Constant
Tc= 80° C
Pout,OUTPUTPOWER (W)
300
Tc= 25° C
200
100
GC81210
GC812 30
0
25 30 35 40 45 50
VDD, SUPPLY VOLTAGE (VOLTS)
4/13
0
-4-3-2-101234
VGSGATE-SOURCEVOLTAGE(VOLTS)