The SD2921is a gold metallizedN-ChannelMOS
field-effect RF power transistor. The SD2921 is
intended foruse in50Vdc large signal
applicationsup to 200 MHz
SD2921
RF POWER TRANSISTORS
M174
epoxy sealed
ORDER CODEBRANDING
SD2921SD2921
PIN CONNECTION
1. Drain3.Gate
2. Source4. Source
ABSOLUTE MAXIMUM RATINGS (T
Symb o lParameterVal u eUni t
V
(BR)DSS
V
V
P
T
Drain So urc e Volt age125V
Drain-G at e Voltage (RGS=1MΩ)125V
DGR
Gat e- Source V olt age±20V
GS
Drain Cur re nt16A
I
D
Power Diss ipation292W
DISS
Max. Oper ating J unct ion T emperatu re200
T
j
Storage T emperature-65 to 150
STG
case
=25oC)
THERMAL DATA
R
th(j-c)
R
th(c-s)
* Determined using a flat aluminum or copperheatsink with thermal compound applied (Dow Corning340 or equivalent).
November 1999
Junct ion- Ca se Therm al Resist anc e
Case-Heat s i nk Therm al R esis tance ∗
0.6
0.2
o
o
o
C/W
o
C/W
C
C
1/10
SD2921
ELECTRICAL SPECIFICATION (T
case
=25oC)
STATIC
Symb o lPara met erMi n .Typ .Max.Unit
V
(BR)DSSVGS
I
DSS
I
GSS
V
GS(Q)
V
DS(ON)VGS
G
FS
C
ISS
C
OSS
C
RSS
=0VIDS= 100 m A125V
VGS=0VVDS=50V5mA
VGS= 20VVDS=0V5µA
VDS= 10VID= 250 m A1.05.0V
= 10VID=10A3.0V
VDS= 10VID=5A4mho
VGS=0VVDS= 50 Vf = 1 M H z411pF
VGS=0VVDS= 50 Vf = 1 M H z198pF
VGS=0VVDS=50Vf=1MHz27pF
DYNAMIC
Symb o lPara met erMi n .Typ .Max.Unit
P
OUT
G
η
Load
Mismatch
f = 175 M H zVDD=50VIDQ= 250 mA150W
f = 175 M H zVDD=50VP
PS
f = 175 M H zVDD=50VP
D
f = 175 M H zV
DD
=50VP
=150WIDQ= 250 m A12.514dB
out
=150WIDQ= 250 mA5565%
out
=150WIDQ=250mA
out
10:1VSWR
All Phase Angles
REF. 1021304K
IMPEDANCEDATA
2/10
FREQ.ZIN(Ω)Z
DL
(Ω)
30 M Hz1. 7 - j 5.76.8 + j 0.9
175MHz1.2-j2.02.0+j2.4
TYPICALPERFORMANCE
SD2921
OutputPowervs Input Power
250
200
150
100
50
Pout, OUTPUT POWER (W)
0
14710131619
Pin, INPUT POWER (W)
Vdd = 50V
OutputPowervs SupplyVoltage
200
150
100
50
Pout, OUTPUT POWER (WATTS)
0
24283236404448
VDD, SUPPLY VOLTAGE (VOLTS)
Pin = 9W
Vdd =40V
Tc = 25°C
f =175 MHz
IDQ = 250mA
Pin = 6W
Pin = 3W
IDQ = 250mA
f =175MHz
OutputPower vs Input Power
300
250
200
150
100
50
Pout, OUTPUT POWER (W)
0
1 3 5 7 9 1113151719
Pin, INPUT POWER (W)
OutputPower vs GateVoltage
200
VDD = 50V
150
IDQ = 250mA
f = 175MHz
Pin = Constant
100
50
Pout, OUTPUT POWER (W)
0
-3-2-10123
VGS, GATE-SOURCE VOLTAGE (VOLTS)
T = -20°C
Tcase =-20°C
Tcase = 25°C
Tcase = 80°C
IDQ = 250 mA
VDD = 50V
f =175MHz
T=80°C
T=25°C
Capacitancevs Drain-SourceVoltage
10000
1000
100
C, CAPACITANCE(pF)
10
0 1020304050
VDS,DRAIN-SOURCEVOLTAGE(VOLTS)
Crss
Ciss
Coss
Drain Current vs Gate Voltage
15
10
5
ID, DRAIN CURRENT (A)
0
22.533.544.555.56
VGS,GATE-SOURCEVOLTAGE(VOLTS )
T = -20°C
T=25°C
T=80°C
VDS= 10V
3/10
SD2921
TYPICALPERFORMANCE
Gate-SourceVoltagesvs Case Temperature
OutputPower vs GateVoltage
200
1.1
1.05
1
0.95
0.9
0.85
VGS, GATE-SOURCE VOLTAGE (NORMALIZED
-250255075100
VDS = 10V
Tc, CASE TEMPERATURE (°C)
Id = 5A
Id = 4A
Id = .25A
Id = .1A
Id = 2A
Id = 1A
150
VDD= 50 V
IDQ= 250 mA
f = 30MHz
100
Pout, OUTPUT POWER(W)
FixedPin
50
0
012345 6
VGSGATE-SOURCE VOLTAGE (V)
PowerGainvs Output PowerOutputPower vs Input Power
T19:1 Transformer, 25 ohm Flexible Coax with extra shield.090 OD 15” Long
T21:4 Transformer, 50 ohm Flexible Coax .225 OD 15” Long
FB1Toroid, 1.7” OD.30” ID 220u4 Turns
FB2SurfaceMount EMI Shield Bead
FB3Toroid, 1.7” OD.300” ID 220u3 Turns
RFC1Toroid, 0.5” OD 0.30” ID, 125u4 turns 12 awg wire
PCB0.062” WovenFiberglass, 1 oz. Copper,2 Sides, er= 2.55
C1, C4, C6, C7, C8, 0.01uF ATCChip CapC5470pF ATCChip Cap
C9, C11, C12, C13 0.01 uF ATCChip CapC1010 uF 63V Electrolytic Capacitor
C2, C3750 pF ATCChipCapC14100 uF 63V Electrolytic Capacitor
R1, R31K ohm 1W Chip ResistorR2680ohm 3W WirewoundResistor
6/10
175 MHz Test Circuit Schematic (ProductionTestCircuit)
V
G+50V
SD2921
Note : All dimensions in inches
REF. 1021579C
175 MHz Test Circuit Component Part List
T14:1 Transformer, 25 ohm Flexible Coax .090 OD 6 ” Long
T21:4 Transformer, 25 ohm Semi-RigidCoax .141 OD 6 ” Long
FB1Toroid X2, 0.5” OD .312” ID 850u 2 Turns
FB2, FB3VK200
FB4Shield Bead, 1” OD 0.5” ID 850u 3 Turns
L11/4Wave Choke, 50 ohm Semi-Rigid Coax .141 OD 12 ” Long
Information furnished isbelieved tobe accurate and reliable. However, STMicroelectronics assumes no responsibility for theconsequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes andreplaces allinformation previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
1999 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronicsGROUP OF COMPANIES
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.
10/10
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