SATELLITE COMM UNICATI ON S APPLICATI ONS
CLASS C
.
1.6 GHz
.
COMMON BASE
.
REFRACTORY/GOLD METALLIZATION
.
EFFICIENCY = 50% MIN.
.
P
.
= 4.5 W MIN. WITH 10 dB GAIN
OUT
SD1894
RF & MICROWAVE TRANSISTORS
.250x.3202LFL(M170)
epoxy sealed
ORDER CODE
SD1894
PIN CONNECTION
DESCRIPTION
The SD1894 is a common base silicon NPN bipolar
device optimized for 1.6 GHz SATCOM applications.
The SD1894 offers superior gain and collector efficiency, making it an ideal choice for Class C power
amplifiers used in portable as well as fixed SATCOM terminals.
ABSOL UTE MA XI MUM RATI NGS (T
Symbol Parameter Valu e Unit
V
V
V
P
T
CBO
CES
EBO
I
C
DISS
T
J
STG
Collector-Base Voltage 45 V
Collector-EmitterVoltage 45 V
Emitter-Base Voltage 3.0 V
Device Current 375 mA
Power Dissipation 12.5 W
Junction Temperature +200
Storage Temperature
case
=
25°C)
1. Collector 3. Base
2. Emitter
− 65 to +150
BRANDING
SD1894
°
C
°
C
THERMAL DATA
R
TH(j-c)
February 4, 1997
Junction-CaseThermal Resistance 14.0 °
C/W
1/4
SD 1894
ELECTRICAL SPECIFICATIONS (T
case
STATIC
Symbol Test Conditions
BV
CBO
BV
BV
EBO
I
CBO
h
FE
IC= 1 mA IE=0mA
IC= 1 mA VBE=0V
CES
IE= 1 mA IC=0mA
VCB=28V IE=0mA
VCE=5V IC=.2A
DYNAMIC
Symbol Test Conditions
P
η
P
Load
f = 1650 MHz VCC=28V P
IN
f = 1650 MHz V
c
f = 1650 MHz VCC=28V P
G
=28V P
V
CC
=28V P
CC
= 4.5 W VSWR = 20:1
OUT
Mismatch
=
25°C)
OUT
OUT
OUT
= 4.5 W
= 4.5 W
= 4.5 W
Value
Min. Typ. Max.
Unit
45 — — V
45 — — V
3.0 — — V
——.25mA
15 — 150 —
Value
Min. Typ. Max.
Unit
— .35 .45 W
50 55 — %
10.0 11.1 — dB
No Degradation in
Output Power
INPUT POWER vs OUTPUT POWER
2/4
IMPED ANCE DATA
TYPICAL INPUT
IMPEDANCE
Z
IN
TYPICAL COLLECTOR LOAD
IMPEDANCE
TEST CI RCUIT
SD 1894
FREQ.
1600 MHz 31.6 + j 21.4 5.2 + j 14.7
1620 MHz 38.0 + j 15.0 5.6 + j 14.55
1635 MHz 38.8 + j 11.3 5.85 + j 14.45
1650 MHz 36.0 + j 9.1 6.1 + j 14.3
Z
CL
1665 MHz 34.3 + j 8.77 6.37 + j 14.2
Z
(Ω)Z
IN
CL
(Ω)
C1: .6 - 4.5 pf Johanson
C2: 39pf ATC Chip Capacitor
µ
C3: .1
f Ceramic
L1 : 10 Turns, AWG #28, .080”I.D.
L2 : 4 Turns, AWG #28, .)80” I.D.
Board Material: Er
=10.2, Thickness .050”
3/4
SD 1894
PACKAG E MECHANICAL DATA
Ref.: Dwg. No.12-0170
UDCS No. 1010996 rev B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
1997 SGS-THOMSON Microelectronics - All Rights Reserved
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SGS-THOMSON Microelectronics GROUP OF COMPANIES
Taiwan - Thailand - United Kingdom - U.S.A.
4/4
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