From6.8Vto 440 V.
UNI AND BIDIRECTIONALTYPES.
LOW CLAMPINGFACTOR.
FASTRESPONSETIME.
UL RECOGNIZED.
DESCRIPTION
Transildiodes provide high overvoltageprotection
by clamping action. Their instantaneousresponse
to transient overvoltages makes them particularly
suitedto protectvoltage sensitivedevices such as
MOSTechnologyand low voltagesupplied IC’s.
ABSOLUTE MAXIMUMRATINGS
(Tamb= 25°C)
CB417
TRANSIL
TM
SymbolParameterValueUnit
P
PP
P
I
FSM
T
stg
T
j
T
L
Peak pulsepower dissipation (seenote 1)Tj initial =T
Powerdissipationon infiniteheatsinkT
Non repetitivesurge peakforward current
For Unidirectionaltypes.
=75°C
amb
Tj initial =T
tp =10 ms
Storagetemperaturerange
Maximumjunction temperature
Maximumlead temperaturefor solderingduring 10s at 5mm
amb
amb
600W
5W
100A
- 65 to + 175
175
230°C
fromcase
Note 1 : Fora surge greater than themaximum values,the diode will fail in short-circuit.
Fig.2 : Peakpulse power versusexponentialpulse duration.
Ppp
(W)
0.0010.010.1110100
Fig.3 : Clampingvoltage versuspeak pulse current.
exponentialwaveform: t p= 20 µs________
t p = 1 ms-------------
t p =10 ms ...............
Note:
Thecurves of the figure 3 arespecifiedfor a junctiontemperatureof 25 °C beforesurge.
Thegiven results maybe extrapolatedfor otherjunction temperaturesby usingthe following formula:
∆V
(BR)
= αT
(V(BR)) *[Ta
-25]*V
(BR)
.
Forintermediatevoltages, extrapolatethe given results.
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P6KExx
Fig. 4a :
Capacitanceversus reverseapplied
voltagefor unidirectionaltypes (typicalvalues).
Fig. 5 :
Peakforwardvoltage drop versus peak
forward current (typical values for unidirectional
types).
Note : multiply by 2 for units with VBR> 220 V.
Fig.4b :
Capacitanceversus reverseapplied
voltagefor bidirectionaltypes(typical values).
Fig.6 :
Transientthermalimpedancejunction-ambient versus pulse duration (For FR4 PC Board
withL
=10mm).
lead
Fig.7 : Relative variation of leakage current
versus junction temperature.
Packaging: standardpackagingis intapeand reel.
Weight= 0.65 g.
Informationfurnishedis believed tobe accurate and reliable. However, STMicroelectronics assumesno responsIbility fortheconsequences of
use of such informationnor for any infringementof patentsor otherrights of thirdparties which may result fromits use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replacesall information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1998 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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