HC367 NON INVERTING, HC368 INVERTING
.HIGH SPEED
tPD= 11 ns(TYP.) AT VCC=5V
.LOWPOWERDISSIPATION
ICC=4µA(MAX.) AT TA=25°C
.HIGH NOISEIMMUNITY
V
NIH=VNIL
=28%VCC(MIN.)
.OUTPUT DRIVE CAPABILITY
15 LSTTL LOADS
.SYMMETRICALOUTPUT IMPEDANCE
|IOH|=IOL=6 mA(MIN.)
.BALANCEDPROPAGATION DELAYS
t
PLH=tPHL
.WIDE OPERATINGVOLTAGERANGE
VCC(OPR)= 2V TO 6 V
.PIN AND FUNCTION COMPATIBLE WITH
54/74LS367/368
M54/M74HC367
M54/M74HC368
HEX BUS BUFFER(3-STATE)
B1R
(PlasticPackage)
M1R
(MicroPackage)
ORDER CODES :
M54HC X XXF 1 R M74H CXXXM1 R
M74HC X XXB1R M74H CXXXC1R
F1R
(CeramicPackage)
C1R
(Chip Carrier)
DESCRIPTION
The M54/74HC367 andtheM54/74HC368are high
speedCMOS HEXBUS BUFFER (3-STATE) fabricatedin silicongateC2MOStechnology. Theyhave
the same high speed performance of LSTTL combined with true CMOS low power consumption.
These devices contain six buffers, fourbuffers are
controlledbyan enableinput (G1)and theother two
buffers are controlled by the other enable input
(G2); theoutputs of each buffer groupare enabled
when G1 and/or G2 inputs are held low, and
when held high these outputs are disabled to be
high-impedance.
Theseoutputs arecapable ofdrivingupto15LSTTL
loads. The designer has a choice of non-inverting
outputs (HC367) and inverting outputs (HC368).
All inputs are equipped with protection circuits
against static discharge and transient excess voltage.
PIN CONNECTIONS(top view)
HC368
HC367
October 1992
1/11
M54/M74HC367/368
INPUT AND OUTPUT EQUIVALENT CIRCUIT
CHIP CARRIER
HC367 HC368
TRUTH TABLE
INPUTS OUTPUTS
G An Y n (367) Yn (368)
LLLH
LHHL
HXZZ
X = DON’T CARE Z =HIGH IMPEDANCE
PIN DESCRIPTION (HC367)
PIN No SYMBOL NAME AND FUNCTION
1, 15 G1, G2 Output Enable Inputs
2, 4, 6, 10,
12, 14
3, 5, 7, 9,
11, 13
8 GND Ground (0V)
16 V
1A to 6A Data Inputs
1Y to 6Y Data Outputs
CC
Positive Supply Voltage
NC = No Internal Connection
PIN DESCRIPTION (H C 3 68 )
PIN No SYMBOL NAME AND FUNCTION
1, 15 G1, G2 Output Enable Inputs
2, 4, 6, 10,
12, 14
3, 5, 7, 9,
11, 13
8 GND Ground (0V)
16 V
1A to 6A Data Inputs
1Y to 6Y Data Outputs
CC
Positive Supply Voltage
2/11
M54/M74HC367/368
IEC LOGIC SYMBOL
HC367 HC368
ABSOLU TE MAXI MUM RAT I NG S
Symbol Parameter Value Unit
V
CC
V
V
O
I
IK
I
OK
I
O
or I
I
CC
P
D
T
stg
T
AbsoluteMaximumRatingsarethosevalues beyondwhichdamagetothedevice mayoccur.Functionaloperationunder theseconditionisnotimplied.
(*)500 mW: ≅ 65oC derateto300 mWby 10mW/oC: 65oCto85oC
Supply Voltage -0.5 to +7 V
DC Input Voltage -0.5 to VCC+ 0.5 V
I
DC Output Voltage -0.5 to VCC+ 0.5 V
DC Input Diode Current ± 20 mA
DC Output Diode Current ± 20 mA
DC Output Source Sink CurrentPer OutputPin ± 35 mA
DC VCCor Ground Current ± 70 mA
GND
Power Dissipation 500 (*) mW
Storage Temperature -65 to +150
Lead Temperature (10 sec) 300
L
o
C
o
C
RECO MM ENDED OPERATIN G CONDITI O NS
Symbol Parameter Value Unit
V
T
t
V
V
r,tf
Supply Voltage 2 to 6 V
CC
Input Voltage 0 to V
I
Output Voltage 0 to V
O
Operating Temperature: M54HC Series
op
M74HC Series
CC
CC
-55 to +125
-40 to +85
Input Rise and Fall Time VCC= 2 V 0 to 1000 ns
V
= 4.5 V 0 to 500
CC
= 6 V 0 to 400
V
CC
V
V
o
C
o
C
3/11
M54/M74HC367/368
DC SPECIFICA TIONS
Symbol Parameter
V
V
V
V
I
I
High Level Input
IH
Voltage
Low Level Input
IL
Voltage
High Level
OH
Output Voltage
Low Level Output
OL
Voltage
I
Input Leakage
I
Current
3 State Output
OZ
Off State Current
Quiescent Supply
CC
Current
Test Conditions Value
V
(V)
CC
=25oC
A
54HC and 74HC
Min. Typ. Max. Min. Max. Min. Max.
-40 to 85oC
74HC
-55 to 125oC
54HC
Unit
T
2.0 1.5 1.5 1.5
4.5 3.15 3.15 3.15
6.0 4.2 4.2 4.2
2.0 0.5 0.5 0.5
4.5 1.35 1.35 1.35
6.0 1.8 1.8 1.8
2.0
4.5 4.4 4.5 4.4 4.4
6.0 5.9 6.0 5.9 5.9
4.5 I
6.0 I
2.0
4.5 0.0 0.1 0.1 0.1
6.0 0.0 0.1 0.1 0.1
4.5 I
6.0 I
6.0
6.0
=
V
I
IO=-20 µA
V
IH
or
V
IL
=-6.0 mA 4.18 4.31 4.13 4.10
O
=-7.8 mA 5.68 5.8 5.63 5.60
O
=
V
I
IO=20µA
V
IH
or
V
IL
= 6.0 mA 0.17 0.26 0.33 0.40
O
= 7.8 mA 0.18 0.26 0.33 0.40
O
VI=VCCor GND ±0.1 ±1 ±1 µA
VI=VIHor V
VO=VCCor GND
1.9 2.0 1.9 1.9
0.0 0.1 0.1 0.1
IL
±0.5 ±5 ±10 µA
6.0 VI=VCCor GND 4 40 80 µA
V
V
V
V
4/11