SGS Thomson Microelectronics M74HC368, M74HC367 Datasheet

HC367 NON INVERTING, HC368 INVERTING
.HIGH SPEED
tPD= 11 ns(TYP.) AT VCC=5V
.LOWPOWERDISSIPATION
ICC=4µA(MAX.) AT TA=25°C
.HIGH NOISEIMMUNITY
V
NIH=VNIL
=28%VCC(MIN.)
.OUTPUT DRIVE CAPABILITY
15 LSTTL LOADS
.SYMMETRICALOUTPUT IMPEDANCE
|IOH|=IOL=6 mA(MIN.)
.BALANCEDPROPAGATION DELAYS
t
PLH=tPHL
.WIDE OPERATINGVOLTAGERANGE
VCC(OPR)= 2V TO 6 V
.PIN AND FUNCTION COMPATIBLE WITH
54/74LS367/368
M54/M74HC367 M54/M74HC368
HEX BUS BUFFER(3-STATE)
B1R
(PlasticPackage)
M1R
(MicroPackage)
ORDER CODES :
F1R
(CeramicPackage)
C1R
(Chip Carrier)
DESCRIPTION
The M54/74HC367 andtheM54/74HC368are high speedCMOS HEXBUS BUFFER (3-STATE) fabri­catedin silicongateC2MOStechnology. Theyhave the same high speed performance of LSTTL com­bined with true CMOS low power consumption. These devices contain six buffers, fourbuffers are controlledbyan enableinput (G1)and theother two buffers are controlled by the other enable input (G2); theoutputs of each buffer groupare enabled when G1 and/or G2 inputs are held low, and when held high these outputs are disabled to be high-impedance.
Theseoutputs arecapable ofdrivingupto15LSTTL loads. The designer has a choice of non-inverting outputs (HC367) and inverting outputs (HC368).
All inputs are equipped with protection circuits against static discharge and transient excess volt­age.
PIN CONNECTIONS(top view)
HC368
HC367
October 1992
1/11
M54/M74HC367/368
INPUT AND OUTPUT EQUIVALENT CIRCUIT
CHIP CARRIER
HC367 HC368
TRUTH TABLE
INPUTS OUTPUTS
G An Y n (367) Yn (368)
LLLH LHHL
HXZZ
X = DON’T CARE Z =HIGH IMPEDANCE
PIN DESCRIPTION (HC367)
PIN No SYMBOL NAME AND FUNCTION
1, 15 G1, G2 Output Enable Inputs
2, 4, 6, 10,
12, 14
3, 5, 7, 9,
11, 13
8 GND Ground (0V)
16 V
1A to 6A Data Inputs
1Y to 6Y Data Outputs
CC
Positive Supply Voltage
NC = No Internal Connection
PIN DESCRIPTION (H C 3 68 )
PIN No SYMBOL NAME AND FUNCTION
1, 15 G1, G2 Output Enable Inputs
2, 4, 6, 10,
12, 14
3, 5, 7, 9,
11, 13
8 GND Ground (0V)
16 V
1A to 6A Data Inputs
1Y to 6Y Data Outputs
CC
Positive Supply Voltage
2/11
M54/M74HC367/368
IEC LOGIC SYMBOL
HC367 HC368
ABSOLU TE MAXI MUM RAT I NG S
Symbol Parameter Value Unit
V
CC
V
V
O
I
IK
I
OK
I
O
or I
I
CC
P
D
T
stg
T
AbsoluteMaximumRatingsarethosevalues beyondwhichdamagetothedevice mayoccur.Functionaloperationunder theseconditionisnotimplied. (*)500 mW: 65oC derateto300 mWby 10mW/oC: 65oCto85oC
Supply Voltage -0.5 to +7 V DC Input Voltage -0.5 to VCC+ 0.5 V
I
DC Output Voltage -0.5 to VCC+ 0.5 V DC Input Diode Current ± 20 mA DC Output Diode Current ± 20 mA DC Output Source Sink CurrentPer OutputPin ± 35 mA DC VCCor Ground Current ± 70 mA
GND
Power Dissipation 500 (*) mW Storage Temperature -65 to +150 Lead Temperature (10 sec) 300
L
o
C
o
C
RECO MM ENDED OPERATIN G CONDITI O NS
Symbol Parameter Value Unit
V
T
t
V
V
r,tf
Supply Voltage 2 to 6 V
CC
Input Voltage 0 to V
I
Output Voltage 0 to V
O
Operating Temperature: M54HC Series
op
M74HC Series
CC CC
-55 to +125
-40 to +85
Input Rise and Fall Time VCC= 2 V 0 to 1000 ns
V
= 4.5 V 0 to 500
CC
= 6 V 0 to 400
V
CC
V V
o
C
o
C
3/11
M54/M74HC367/368
DC SPECIFICA TIONS
Symbol Parameter
V
V
V
V
I
I
High Level Input
IH
Voltage
Low Level Input
IL
Voltage
High Level
OH
Output Voltage
Low Level Output
OL
Voltage
I
Input Leakage
I
Current 3 State Output
OZ
Off State Current Quiescent Supply
CC
Current
Test Conditions Value
V
(V)
CC
=25oC
A
54HC and 74HC
Min. Typ. Max. Min. Max. Min. Max.
-40 to 85oC 74HC
-55 to 125oC 54HC
Unit
T
2.0 1.5 1.5 1.5
4.5 3.15 3.15 3.15
6.0 4.2 4.2 4.2
2.0 0.5 0.5 0.5
4.5 1.35 1.35 1.35
6.0 1.8 1.8 1.8
2.0
4.5 4.4 4.5 4.4 4.4
6.0 5.9 6.0 5.9 5.9
4.5 I
6.0 I
2.0
4.5 0.0 0.1 0.1 0.1
6.0 0.0 0.1 0.1 0.1
4.5 I
6.0 I
6.0
6.0
=
V
I
IO=-20 µA
V
IH
or
V
IL
=-6.0 mA 4.18 4.31 4.13 4.10
O
=-7.8 mA 5.68 5.8 5.63 5.60
O
=
V
I
IO=20µA
V
IH
or
V
IL
= 6.0 mA 0.17 0.26 0.33 0.40
O
= 7.8 mA 0.18 0.26 0.33 0.40
O
VI=VCCor GND ±0.1 ±1 ±1 µA
VI=VIHor V
VO=VCCor GND
1.9 2.0 1.9 1.9
0.0 0.1 0.1 0.1
IL
±0.5 ±5 ±10 µA
6.0 VI=VCCor GND 4 40 80 µA
V
V
V
V
4/11
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