– Active Current 35mA at 5MHz
– Standby Current 100µA
■ PROGRAMMING VOLTAGE: 12.75V ± 0.25V
■ PROGRAMMING TIME: 50µs/word
■ ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code: 42h
DESCRIPTION
The M27C801 is a n 8 Mbit EPROM of fe red i n the
two ranges UV (ultra violet erase) and OTP (one
time programmable). It is ideally suited for applications where fast turn-around and pattern experimentation are important requirements and is
organized as 1,048,576 by 8 bits.
The FDIP32W (window ceramic frit-seal package)
has transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the
device by following the programming procedure.
For applications where the content is programmed
only one time and erasure is not required, the
M27C801 is offered in PDIP32, PLCC32 and
TSOP32 (8 x 20 mm) packages.
Output Enable / Program Supply
Supply Voltage
Ground
2/16
M27C801
Table 2. Absolute Maximum Ratings
(1)
SymbolParameterValueUnit
T
A
T
BIAS
T
STG
(2)
V
IO
V
CC
(2)
V
A9
V
PP
Note: 1. Except for the ratin g " Operating Temperat ure Range", stresses above th ose listed i n the Tabl e " A bsolute M aximum Ratings" may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions
above those indi cated in t he Opera t in g sections of thi s specifi cation i s not imp l i ed. Exposu re to Ab solute Maxi m um Rati ng condi tions for extended per iods may aff ect device reliabilit y. Refer also to the STMicroel ectronics SURE Program an d other relevan t qual ity docum en ts .
2. Min imum DC volta ge on In put or O utput is –0.5V with possible under shoot t o –2.0V f or a period less th an 20ns. Maximu m DC
voltage on Output is V
3. Depends on range.
Ambient Operating Temperature
Temperature Under Bias–50 to 125 °C
Storage Temperature–65 to 150 °C
Input or Output Voltage (except A9)–2 to 7 V
Supply Voltage–2 to 7 V
A9 Voltage–2 to 13.5V
Program Supply Voltage–2 to 14V
+0.5V with possible overshoot to VCC +2V for a period l ess than 20n s.
CC
(3)
–40 to 125 °C
Table 3. Operating Modes
ModeE
Read
Output Disable
Program
Program Inhibit
Standby
Electronic Signature
Note: X = VIH or VIL, VID = 12V ± 0.5V.
V
IL
V
IL
V
PulseV
IL
V
IH
V
IH
V
IL
GV
V
pp
V
IL
V
IH
PP
PP
A9Q7-Q0
XData Out
XHi-Z
XData In
XHi-Z
XXHi-Z
V
IL
V
ID
Codes
Table 4. Electronic Signature
IdentifierA0Q7Q6Q5Q4Q3Q2Q1Q0Hex Data
Manufacturer’s Code
Device Code
V
IL
V
IH
00100000 20h
01000010 42h
3/16
M27C801
Table 5. AC Measurement Conditions
High SpeedStandard
Input Rise and Fall Times
Input Pulse Voltages0 to 3V0.4 to 2.4V
Input and Output Timing Ref. Voltages1.5V0.8 and 2V
10ns
≤
20ns (10% to 90%)
≤
Figure 3. AC Testing Input Output Waveform
High Speed
3V
1.5V
0V
Standard
2.4V
0.4V
Table 6. Capacitance
SymbolParameterTest ConditionMinMaxUnit
C
IN
C
OUT
Note: 1. Sampled only, not 100% tested.
(1)
(TA = 25 °C, f = 1 MHz)
Input Capacitance
Output Capacitance
2.0V
0.8V
AI01822
Figure 4. AC Testing Load Circuit
1.3V
DEVICE
UNDER
TEST
CL = 30pF for High Speed
CL = 100pF for Standard
CL includes JIG capacitance
V
= 0V
IN
V
= 0V
OUT
1N914
3.3kΩ
CL
6pF
12pF
OUT
AI01823B
DEVICE OPERATION
The operating modes of the M27C801 are listed in
the Operating Modes table. A single power supply
is required in the read mode. All inputs are TTL
levels exce pt for G
VPP and 12V on A9 for Elec-
tronic Signature and Margin Mode Set or Reset.
Read Mode
The M27C801 has two cont rol functions, both of
which must be logically ac tive in order to obtain
data at the output s. Chip Enable (E
) is the power
control and should be used for device selection.
Output Enable (G
) is the output control and should
be used to gate data to the output pins, independent of device selection. Assuming that the ad-
4/16
dresses are stable, the address access time
) is equal to the delay from E to output
(t
AVQV
(t
). Data is available at the output after a delay
ELQV
of t
has been low and the addresses have been sta-
E
ble for at least t
from the falling edge of G, assum ing that
GLQV
AVQV-tGLQV
.
Standby Mode
The M27C801 has a standby mode which reduces
the supply current from 35mA to 100µA.
The M27C801 is placed in the standby mode by
applying a CMOS high signal to the E
input. When
in the standby mode, the outputs are in a high impedance state, independent of the G
VPP input.
M27C801
Table 7. Read Mode DC Characteristics
(1)
(TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 10%)
SymbolParameterTest ConditionMinMaxUnit
I
LI
I
LO
I
CC
I
CC1
I
CC2
I
PP
V
V
IH
V
OL
Input Leakage Current
Output Leakage Current
Supply Current
Supply Current (Standby) TTL
Supply Current (Standby) CMOS
Program Current
Input Low Voltage–0.30.8V
IL
(2)
Input High Voltage2
Output Low Voltage
Output High Voltage TTL
V
OH
Note: 1. VCC must be ap pl i e d simultaneously with or before VPP and removed simultaneously or af ter VPP.
2. Max imum DC voltage on Output i s V
Table 8A. Read Mode AC Characteristics
Output High Voltage CMOS
CC
+0.5 V.
(1)
0V ≤ V
0V ≤ V
E
= VIL, GVPP = VIL,
I
OUT
E
I
≤ V
IN
CC
≤ V
OUT
CC
= 0mA, f = 5MHz
E
= V
IH
> VCC – 0.2V
V
= V
PP
CC
I
= 2.1mA
OL
I
= –1mA
OH
= –100µAV
OH
±10
±10
35mA
1mA
100
10
V
+ 1
CC
0.4V
3.6V
– 0.7
CC
(TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 10%)
M27C801
SymbolAltParameter
t
AVQVtACC
t
ELQV
t
GLQV
(2)
t
EHQZ
(2)
t
GHQZ
t
AXQX
Note: 1. VCC must be ap pl i e d simultaneously with or before VPP and removed simultaneously or af ter V
2. Sampled only, not 100% tested.
3. Speed obtained with High Speed AC meas urement conditions.
Address Valid to Output Valid
t
Chip Enable Low to Output Valid
CE
t
Output Enable Low to Output Valid
OE
t
Chip Enable High to Output Hi-Z
DF
t
Output Enable High to Output Hi-Z
DF
Address Transition to Output
t
OH
Transition
Test
Condition
E
= VIL,
G
VPP = V
G
VPP = V
E
= V
IL
G
VPP = V
E
= V
IL
= VIL,
E
G
VPP = V
IL
IL
IL
IL
-45
(3)
-60-70
MinMaxMinMaxMinMax
456070ns
456070ns
253035ns
025025030ns
025025030ns
000ns
PP.
A
µ
A
µ
A
µ
A
µ
V
V
Unit
Two Line Outp ut C ontrol
Because EPROMs are usually used in larger
memory arrays, the product feat ures a 2 line control function which accommodates the use of multiple memory connection. The two line control
function allows:
a. the lowest possible memory power dissipation,
b. complete assurance tha t output bus contention
will not occur.
For the most efficient use of these two control
lines, E
ry device selecting function, while G
should be decoded and used as the prima-
should be
made a common connectio n to all devices in the
array and connected to the READ
line from the
system control bus. This ensures that all deselected memory devices are in their low power standby
mode and that the output pins are only active
when data is required from a particular memory
device.
5/16
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