DD.M14C32/9811V1.1 1/2
M14C32 DD
M14C32 Die Description
PRODUCT M14C32
■ WAFER SIZE 152 mm (6 inches)
■ DIE IDENTIFICATION M14C32KA_R
■ DIE SIZE (X x Y) 2040 x 2355 µm
■ SCRIBE LINE 100.5 x 101.7 µm
■ PAD OPENING 100 x 100 µm
DIE LAYOUT
■ DI Die Identification (at the position shown in Figure 1)
■ C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)
■ C4, C6, C8 These ISO pins do not appear on the M14C32 die
■ NC This pad, shown in Figure 1, is Not Connected
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in µm).
Figure 1. M14C32 Die Plot
AI02495
C3: SCL
(X= –837.28; Y= –904.24)
C7: SDA (X= –649.92; Y= +993.44)
DI
NC: TEST
NC: TEST
NC: TEST
C5: GND (X= +718.0; Y= +1010.0)
C2: WC (X= –648.48; Y= –993.6)
C1: VCC (X= +650.08; Y= –993.76)
M14C32 DD
2/2
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implic ation or otherwise under any patent or patent ri ghts of STM i croelectr oni cs. Specifications mentioned in thi s publicati on are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as cri tical comp onents in life support dev i ces or systems wi thout exp res s written ap proval of STMi croelectr onics.
© 1998 STMicroelectronics - All Rights Reserved
The ST logo is a registered trademark of STMicroelectr oni cs.
All other na m es are the prop erty of their respectiv e owners.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands - Singapo re -
Spain - Sweden - Switze rl and - Taiwan - Thailan d - United Kingdom - U.S. A.
http://www.s t. com