SGS Thomson Microelectronics M14C32-DD Datasheet

DD.M14C32/9811V1.1 1/2
M14C32 DD
M14C32 Die Description
PRODUCT M14C32
WAFER SIZE 152 mm (6 inches)
DIE IDENTIFICATION M14C32KA_R
DIE SIZE (X x Y) 2040 x 2355 µm
PAD OPENING 100 x 100 µm
DIE LAYOUT
DI Die Identification (at the position shown in Figure 1)
C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)
C4, C6, C8 These ISO pins do not appear on the M14C32 die
NC This pad, shown in Figure 1, is Not Connected
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and vertical axis, measured in µm).
Figure 1. M14C32 Die Plot
AI02495
C3: SCL
(X= –837.28; Y= –904.24)
C7: SDA (X= –649.92; Y= +993.44)
DI
NC: TEST
NC: TEST
NC: TEST
C5: GND (X= +718.0; Y= +1010.0)
C2: WC (X= –648.48; Y= –993.6)
C1: VCC (X= +650.08; Y= –993.76)
M14C32 DD
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