SGS Thomson Microelectronics M14C16_DD Datasheet

DD.M14C16/9811V1.1 1/2

M14C16 DD

M14C16 Die Description

PRODUCT M14C16

■ WAFER SIZE 152 mm (6 inches)

■ DIE IDENTIFICATION M14C16KA_R

■ DIE SIZE (X x Y) 1390 x 2375 µm

■ SCRIBE LINE 101.8 x 102.4 µm

■ PAD OPENING 100 x 100 µm

DIE LAYOUT

■ DI Die Identification (at the position shown in Figure 1)

■ C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)

■ C4, C6, C8 These ISO pins do not appear on the M14C16 die

■ NC This pad, shown in Figure 1, is Not Connected

Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and vertical axis, measured in µm).

Figure 1. M14C16 Die Plot

AI02496

C3: SCL (X= –514.4; Y= –904.4)

C7: SDA (X= –429.0; Y= +1004.3)

NC: TEST

C5: GND (X= +337.7; Y= +1020.6)

C2: WC (X= –349.4; Y= –1004.4)

C1: VCC (X= +514.3; Y= –604.0)

M14C16 DD

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