SGS Thomson Microelectronics M14C04_DD Datasheet

DD.M14C04/9811V1.1 1/2

M14C04 DD

M14C04 Die Description

PRODUCT M14C04

■ WAFER SIZE 152 mm (6 inches)

■ DIE IDENTIFICATION M14C04KA_R

■ DIE SIZE (X x Y) 1465 x 1585 µm

■ SCRIBE LINE 101.6 x 101.6 µm

■ PAD OPENING 100 x 100 µm

DIE LAYOUT

■ DI Die Identification (at the position shown in Figure 1)

■ C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)

■ C4, C6, C8 These ISO pins do not appear on the M14C04 die

■ NC This pad, shown in Figure 1, is Not Connected

Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and vertical axis, measured in µm).

Figure 1. M14C04 Die Plot

AI02497

C3: SCL

(X= –552.0; Y= –509.76)

C7: SDA (X= –532.3; Y= +609.6)

NC: TEST

C5: GND (X= +442.8; Y= +626.0)

C2: WC (X= –386.96; Y= –609.76)

C1: VCC

(X= +551.9; Y= –605.0)

M14C04 DD

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