SGS Thomson Microelectronics L9341 Datasheet

L9341

QUAD LOW SIDE DRIVER

AVANCE DATA

DU/DTAND DI/DTCONTROL PWM CONTROLLEDOUTPUT CURRENT SHORT CURRENT PROTECTION AND DI-

AGNOSTIC INTEGRATEDFLYBACKDIODE UNDERVOLTAGESHUTDOWN OVERVOLTAGE AND UNDERVOLTAGE DI-

AGNOSTIC OVERTEMPERATUREDIAGNOSTIC

DESCRIPTION

The L9341 is a monolithic integrated circuit realized in Multipower BCD-II mixed technology. The driver is intended for inductive loads in synchronous PWM applications, especially for valve driv-

BLOCK & APPLICATION DIAGRAM

VCC

10nF

Vcc

10uF

R

12.4k

4

I

cc

REXT

12

ext

Ω

RES1

9

RES2

10

CS

3

SCLK

11

SDI

5

SDO

13

OSC

6

C

OSC

BIAS

GND

UNDERVOLTAGE

SHUTDOWN

THERMAL FLAG

SERIAL

INTERFACE

&

PWM

CONTROLL

8

I

GND

MULTIPOWERBCD TECHNOLOGY

Multiwatt 15

ORDERING NUMBERS: L9341V

L9341H

ers. The output voltage and current rise and fall slopesdu/dt and di/dt are controlled.

V

s

I

CHANNEL 1

DIAGNOSTIC

DRIVER

COMP1

COMP2

di / dt & du / dt

CONTROL

SHORT

CURRENT

PROTECTION

CHANNEL 2

CHANNEL 3

CHANNEL 4

s

VS

7

V

flyth

V

offth

I

220nF

C

BATDBAT

OUT1

2

I

OUT1

10nF

C

outs

O1

OUT2

1

I

OUT2

C

O2

10nF

OUT3

15

I

OUT3

C

O3

10nF

OUT4

14

I

OUT4

C

O4

10nF

March 1994

1/10

This is advanced information on a new productnow in development or undergoing evaluation. Details aresubject to change withoutnotice.

L9341

PIN CONNECTION (Top view)

ABSOLUTE MAXIMUMRATINGS

Symbol Parameter Value Unit

V

CC

V

S

V

spmax

V

st

Vin InputVoltage Range for SDI; SCLK;CS;RES1;RES2 -0.3to V

V

out

I

out

VCCVoltageRange -0.3 to 6 V VSVoltage Range -0.3 to 24 V VS Voltage Range for t ≤ 400ms -2 to 40 V Schaffner Transient Pulses on V

S

see note1 V

+0.3

CC

Output Voltage Range for all Outputs: Negative Positive

intern. clamped to V

– 0.3

S

Output Current for all Outputs: Negative Positive

–2 +2

for Transient witht < 10ms Negative Positive

–5

5

Schaffner Transient Pulses on Output see note2

V

ESD

ESD Voltage Capability (MIL 883 C) 1500 V

THERMAL DATA

Symbol Parameter Value Unit

R

th j-case

R

th j-amb

T

sdh

T

sd

Notes:

1. Schaffner transient specification: DIN 40839 testwaveforms of the following type: 1, 2, 3a, 3b, 5 and 6.

The pulses are applied to the application circuit according to fig. 3.

2. The maximum output current results from theSchaffner pulses specified in note 1.

Thermal Resistance Junction to Case 3 °C/W Thermal Resistance Junction to Ambient mountedon PC Board 35 °C/W Thermal Hysteresis 20 °C Thermal Diagnostic Tj> 150 °C

V V

A A

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L9341

ELECTRICAL CHARACTERISTICS (Unless otherwise specified: 8V ≤ VS≤ 24V; 4.7V ≤ VCC≤ 5.3V; –

40 °C ≤ Tj ≤ 150°C;I R

=12.4KΩ ± 1%).

ext

≤ 1A(note 3); IO≤ 1.5A;Vsp=VSfor t ≤ 400ms; V

O

OUTP=VOUT

Symbol Parameter Test Condition Min. Typ. Max. Unit

I

ccq

I

sq

V

ccu

V

ccr

VccQuiescent Current All Outputs Off 1 3 mA VsQuiescent Current All Outputs Off 14 25 mA VccUndervoltage Threshold See Note 4 3 4 4.7 V VccRange for RES1 and RES2

3V

Operation

R

on

I

o off

V

outf

I

gndf

I

outr

V

inH

On Resistance Io=1A Tj= 125°C

T

=25°C

j

Off State Output Current Outputs Off

1.4V ≤ V V

outp=Vsp

≤ V

o

s

= 40V

1 1

Output Voltage During Flyback Io= 1A Output Off

T

=25°C

j

T

= 125°C

j

Current to GND during Flyback (see note 5)

Io= 1A Output Off V

= 24V

s

V

= 40V

sp

Reverse Leakage Current Vsp-Vo= 40V 500 µA High Input Level of SCLK,

0.7*V

cc

SDI, CS, RES1, RES2

V

inL

Low Input Level of SCLK,

– 0.3 0.3*Vcc V

SDI, CS, RES1, RES2

V

REShys

Hysteresis of Reset Inputs

0.3 1 V

RES1, RES2

I

inRESH

I

V

SDOH

V

SDOL

I

SDOZ

PWM

K

V

in

f

flyth

offth

Input Current on RES1,RES2 RESi= H; -2V ≤ Vsp≤ 8V

RES

=H;8V≤Vsp≤ 40V

i

–10

5 Input Current on SCLK,SDI,CS – 2V ≤ Vsp ≤ 40V – 10 10 µA High Level SDO Output Voltage I Low Level SDO Output Voltage I SDO TristateHigh-Z Leakage

Current PWM Duty Cycle 1/16 15/16

duty

= -1mA -2V≤ Vsp≤ 40V 0.9*V

SDO

= 1mA -2V≤ Vsp≤ 40V 0 0.4 V

SDO

0 ≤ V

SDO

≤ V

cc

–10 10 µA

–2V≤Vsp≤ 40V

Frequency Accuracy Constant See Note 6 0.93*KfnK Flyback Diagnostic Comparator

Threshold Off State Diagnostic

40 ≥ Vsp≥ 8V V

≤ 8V

s

–1

V

s

1.5

1.5 2 V

Comparator Threshold

I

outl

t

dpo

S

ov

OutputCurrentLimitationThreshold see Note 7 1.5 2.5 A Delay Time PWM Signal to Out. 5 15 µs Output Voltage Rise andFall

(from 10 to 90% of Vo) Fig. 2 1.0 10 V/µs

Slope | du/dt |

S

oc

Notes:

3. The mean value is Io=

4. The outputs are switced off for Vcc ≤ Vccu. The logic is notreseted. Fora reset,RES1 or RES2 must be used.

5. This currentismeasured in the GND - terminal when one single output is in flybackand consistsof the supply current added to the value

ofthe output current source and the leakage currentof the flyback diode. This leakage current is less than 1% of the nominal flyback current.

6. The PWMfrequency isdefined by an external capacitor.The PWMoscillator frequency is: f therange is: 300Hz ≤ f

7. For I

out

Output Current Rise and Fall Slope |di/dt|

T

1

Io(t) dt

∫

0

T

≤ 3000Hz. The OSC Pin can be alternatively driven by an external TTL / CMOS signal.

≥ I

an internal comparator switches the corresponding output off for the currentPWM cycle.

outl

pwm

;

0.1 ≤ Io ≤ 1.5A (from 10 to 90% of I

)

o

pwm

25 125 mA/µs

f

osc

withf

=

32

osc

for t ≤ 400ms;

750 450

2.5 4

V

s

V

s

17 20

Vcc+0.3 V

1.07*K

fn

Vs– 0.4 V

K

f

=

⋅1A/V and kin=15⋅10-6;

C

osc

10

+1.3 +1.1VV

44 52

10 10

V

cc

fn

mΩ mΩ

mA mA

µA µA

V

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