achieve load sharing of paralleled and independent power supply m odules in distributed power
systems, by adding only few external components.
Current sharing is achieved through a single wire
connection (share bus) common to all of the paralleled modules.
8
8
8
7
7
7
6
6
6
5
5
5
C
C
C
C
C
C
R
R
R
CGA
CGA
CGA
R
R
R
C
C
C
+OUT
+OUT
+OUT
LOAD
LOAD
LOAD
GND
GND
GND
SHARE BU S
SHARE BU S
SHARE BU S
8
8
8
7
7
7
6
6
6
5
5
5
C
C
C
R
R
R
R
R
R
CGA
CGA
C
C
C
C
C
C
CGA
(*) OR-ing FET can
(*) OR-ing FET can
be used to reduce
be used to reduce
power dissipation
power dissipation
July 2003
1/20
L6615
DESCRIPTION (continued)
Load sharing is a technique used in all the systems in which the load requires low vol tage, high current
and/or redundancy; for this reason a modular power syst em is necessary in which t wo or more power supplies or DC-DC converters are paralleled.
The device is able to perform both high side and low side current sensing, that is the sense current resistor
can be placed either in series to the power supplies output or on the ground return.
The L6615 then drives the share bus to a voltage proportional to the output current of the master that is
to the highest amongst the output currents delivered by the paralleled power supplies.
The share bus dynamics is independent of the power supply output voltage and is clamped only by the
device supply voltage (V
The output voltage of the other paralleled power supplies (slaves) is then trimmed by the ADJ pin so that
they can support their amount of load current. The slave power supplies work as current-controlled current
sources.
Sharing the output currents is useful for equalizing also the thermal stress of the different modules and
providing an advantage in term of reliability.
Moreover the paralleled supplies architecture allows achieving redundancy; the failure of one of the modules can be tolerated until the capability of the remaining power supplies is enough to provide the required
load current.
PIN DESCRIPTION
N°PinFunction
1GNDGround.
CC
).
2CS-Input of current sense amplifier; it is connected to the negative side of the sense resistor through
a resistor (R
3CS+Input of current sense amplifier. A resistor (RG1, of the same value as RG2) is placed between
this pin and the positive side of the sense resistor: its value defines the transconductance gain
between I
4ADJOutput of Adjust amplifier; it is connected to both the load (through a resistor R
positive remote sense pin of the power system. This pin is an open collector diverting (from the
feedback path) a current proportional to the difference between the current supplied to the load
by the relevant power supply and the current supplied by the master.
5COMPOutput of the current sharing (transconductance) error amplifier and input of ADJ amplifier.
Typically , a compensation network is placed between this pin and ground. The maximum voltage
is internally clamped to 1.5V (typ.)
6SHShare bus pin. During the power supply
share bus. During power supply
proportional to the load current.
share
The
and GND could be useful to reduce the noise present on the share bus.
7CGACurrent Gain Adjust pin; current sense amplifier output. A resistor connected between this pin
8V
and ground defines the maximum voltage on the share bus and sets the gain of the current
sharing system.
Supply voltage of the IC.
CC
).
G2
and V
CGA
bus connects the SH pins of all the paralleled modules. A capacitor between this pin
SENSE
.
) and to the
ADJ
slave
operation, this pin acts as positive input from
master
operation, it drives the share bus to a voltage
2/20
ABSOLUTE MAXIMUM RATINGS
SymbolPinParameterValueUnit
L6615
V
CC
ICS+, ICS-Sense pin current10mA
VCS-, V
V
(V
All voltages are with re spect to pin 1. C urrents are positive into, negative out of t he specified t erminal.
(*) Maximum package power dissipation limits must be observed
, VSH,
CS+
, V
ADJ
CGA
V
COMP
) - (V
CS+
PtotTotal power dissipation @ Tamb = 70°C
TstgStorage temperature-55 to +150°C
)Differential input voltage (VCS+ from 0V to 22V)-0.7 to 0.7V
CS-
TjJunction temperature range-40 to +125°C
8Supply Voltage (*) (ICC<50mA)selflimitV
2, 3, 6, 4, 7-0.3 to V
5Error amplifier output-0.3 to 1.5V
SO8
DIP8
CC
0.45
0.6
PIN CONNECTION
8
8
VCC
7
7
VCC
CGA
CGA
GND
GND
CS-
CS-
1
1
2
2
V
W
6
CS+
CS+
ADJ
ADJ
3
3
4
4
6
5
5
SH
SH
COMP
COMP
THERMA L D ATA
SymbolParameterMINIDIPSO8Unit
R
th j-amb
Thermal Resistance junction to ambient90120°C/W
3/20
L6615
ELECTRICAL CHARACTERISTCS
(Tj = -40 to 85°C, Vcc=12V, V
V
SENSE
= IL * R
, RG1 = RG2 = 200Ω)
SENS E
SymbolParameterTest ConditionMin.Typ.Max.Unit
Vcc
V
V
CC, ON
V
CC,OFF
V
VzI
Operating range2.722V
cc
Quiescent currentVSH= 1V, V
I
cc
Turn-on voltageVSH= 0.2V, V
Turn-off voltage2.352.52.65V
Hysteresis100mV