TECHNOLOGY: BCD ”OFF-LINE”
FLOATINGSUPPLY VOLTAGEUPTO600V
GND REFERRED SUPPLY VOLTAGE UP TO
18V
DRIVER CURRENT CAPABILITY:
- SINK CURRENT = 270mA
- SOURCECURRENT=170mA
VERYLOW START UP CURRENT:150µA
VERYLOW OPERATINGCURRENT:<2mA
UNDERVOLTAGELOCKOUT
PROGRAMMABLEOSCILLATOR
FREQUENCY
dV/dtIMMUNITY UP TO ±50V/ns
DESCRIPTION
The device is a high voltage half bridge driver
with built-in oscillator.The frequency of the oscillator can be programmed using external resistor
L6571B
HIGH VOLTAGE HALF BRIDGE
DRIVER WITH OSCILLATOR
MinidipSO8
ORDERING NUMBERS:
L6571AL6571AD
L6571BL6571BD
and capacitor.
The output drivers are designed to drive external
n-channel power MOSFET and IGBT. The internal logic assures a minimum dead time to avoid
cross-conductionof thepower devices.
BLOCK DIAGRAM
F
R
F
C
F
C
F
GND
C
VS
REGULATOR
BUFFERR
COMP
COMP
BIAS
S
V
S
LOGIC
R
HV
LEVEL
SHIFTER
H.V.
BOOTV
V
S
LOW
HIGH
SIDE
DRIVER
SIDE
DRIVER
HVG
OUT
LVG
C
BOOT
LOAD
June 2000
D96IN433
1/7
L6571A - L6571B
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
(*)
I
S
V
CF
V
LVG
V
OUT
HVGHigh Side Switch Gate Output-1 to VBOOTV
V
BOOTFloating Supply Voltage618V
V
BOOT/OUTFloating Supply vs OUT Voltage18V
V
dV
BOOT
/dtV
dV
OUT
T
stg
T
j
T
amb
(*)
The device has an internal zener clamp between GND andVS(typical 15.6V).
Therefore the circuit should not be driven by a DC low impedance power source.
Note: ESD immunity for pins 6, 7 and 8is guaranteed up to900 V (Human Body Model)
Supply Current25mA
Oscillator Resistor Voltage18V
Low Side Switch Gate Output14.6V
High Side Switch Source Output-1 to V
/dtV
Slew Rate (Repetitive)
BOOT
Slew Rate (Repetitive)
OUT
BOOT
50V/ns
±
50V/ns
±
Storage Temperature-40 to 150
Junction Temperature-40 to 150
Ambient Temperature (Operative)-40 to 125°C
-18V
C
°
C
°
THERMAL DATA
SymbolParameterMinidipSO8Unit
R
th j-amb
Thermal ResistanceJunction-AmbientMax100150
RECOMMENDED OPERATINGCONDITIONS
SymbolParameterMin.Max.Unit
Supply Voltage10V
CL
Floating Supply Voltage-500V
High Side Switch Source Output-1V
BOOT-VCL
Oscillation Frequency200kHz
V
V
V
S
BOOT
OUT
f
out
PIN CONNECTION
V
RF
C
GND
S
F
1
2
3
4LVG
7
6
5
BOOT8
HVG
OUT
C/W
°
V
V
2/7
D94IN059
L6571A - L6571B
ELECTRICALCHARACTERISTICS
(V
S
=12V;V
BOOT-VOUT
=12V;Tj =25°C;unlessotherwisespecified.)
SymbolPinParameterTest ConditionMin.Typ.Max.Unit
V
SUVP
V
SUVN
V
SUVH
V
CL
I
SU
I
q
I
BOOTLK
1VSTurn On Threshold8.399.7V
VSTurn Off Threshold7.388.7V
VSHysteresis0.711.3V
VSClamping VoltageIS= 5mA14.615.616.6V
Start Up CurrentVS<V
Quiescent CurrentVS>V
8LeakageCurrent BOOT pinvs
SUVN
SUVP
V
= 580V5µA
BOOT
150250µA
500700µA
GND
I
OUTLK
I
HVG SO
I
HVG SI
I
LVGSO
I
LVGSI
V
RFON
V
RF OFF
V
CFU
V
CFL
t
d
D
C
6Leakage CurrentOUTpinvs GNDV
7High Side Driver Source CurrentV
High Side Driver Sink CurrentV
5Low Side Driver Source CurrentV
Low Side Driver Sink CurrentV
= 562V5
OUT
= 6V110175mA
HVG
= 6V190275mA
HVG
= 6V110175mA
LVG
= 6V190275mA
LVG
2RF High LevelOutput VoltageIRF= 1mAVS-0.05VS-0.2V
RF Low Level Output VoltageIRF= -1mA50200mV
3CF Upper Threshold7.77.958.2V
CF Lower Threshold3.804.054.3V
Internal Dead TimeL6571A
L6571B
Duty Cycle, Ratio Between
0.85
0.50
1.25
0.72
1.65
0.94
0.450.50.55
Dead Time + Conduction Time
of High Side and Low Side
Drivers
I
AVE
fout6Oscillation FrequencyRT = 12k
1Average Current from VsNo Load, fs = 60KHz1.21.5mA
576063kHz
CT = 1nF
µ
µ
µs
A
s
OSCILLATORFREQUENCY
The frequency of the internal oscillator can be
programmedusingexternalresistorand capacitor.
The nominal oscillator frequency can be calculated using the following equation:
Figure 2:
WAVEFORMS
V
S
V
CF
LVG
T1
T
f
OSC
=
2⋅R
1
⋅ C
F
F
⋅
In 2
=
1.3863⋅R
1
⋅
F
where RFand CFare the external resistor and capacitor
V
SUVP
C
D96IN434
C
F
3/7
L6571A - L6571B
Figure 3: TypicalDead Time vs.Temperature
Dependency(L6571A).
Dead time [µsec]
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1
0.9
-50050100150
Temperature [C]
Figure 5:
Typicaland Theoretical Oscillator
D96IN378A
Frequencyvs ResistorValue
f (KHz)
150
100
90
80
70
C=1nF
60
50
30
20
56789101520304050
C=330pF
C=560pF
Resistor Value (Kohm)
D96IN380
Theoretical
Figure4:
TypicalFrequency vs Temperature
Dependency
Frequency [KHz]
65
64
63
62
61
60
59
58
57
56
55
-50-250255075100125
Temperature [C]
Figure8:
TypicalRise andFall Times vs. Load
Capacitance
time [nsec]
300
250
Tr
200
150
100
50
0
0123456
C [nF]
For both high andlow side buffers @25°C Tamb
Tf
D96IN379A
D96IN417
Figure 9: QuiescentCurrent vs. Supply Voltage.
D96IN418
4/7
Iq (µA)
4
10
3
10
2
10
10
02468101214VS(V)
L6571A - L6571B
DIM.
D (1)4.85.00.1890.197
F (1)3.84.00.150.157
(1) D andF do not include moldflash or protrusions. Mold flash or
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumesno responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change withoutnotice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
2000 STMicroelectronics – Printed in Italy – AllRights Reserved
STMicroelectronics GROUP OF COMPANIES
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