SGS Thomson Microelectronics L6234PD, L6234 Datasheet
SUPPLYVOLTAGEFROM 7 TO 52V
5A PEAKCURRENT
R
0.3Ω TYP.VALUE AT25°C
DSON
CROSSCONDUCTION PROTECTION
TTL COMPATIBLEDRIVER
OPERATINGFREQUENCYTO 50KHz
THERMALSHUTDOWN
INTRINSICFAST FREEWHEELINGDIODES
INPUT AND ENABLE FUNCTION FOR
EVERYHALF BRIDGE
10V EXTERNAL REFERENCE AVAILABLE
L6234
THREE PHASE MOTOR DRIVER
POWER DIP (16+2+2)
PowerSO20
DESCRIPTION
The L6234 is a triple half bridge to drive a
brushlessmotor.
It is realized in Multipower BCD technology which
combines isolated DMOS power transistors with
CMOSand Bipolar circuitson thesame chip.
By usingmixed technology ithas been possibleto
optimizethelogic circuitry and the power stage to
achievethe best possibleperformance.
The output DMOS transistors can sustain a very
high current due to the fact that the DMOS structure is not affected by the second breakdown ef-
PIN CONNECTION (Topview)
OUT1
IN1
EN1
GND
GND
EN3
IN3
OUT3 10 VREF11
1
2
3
V
4
S
5
6
V
7
S
8
9 VCP
D98IN848
19
18
17
16
15
14
13
12
OUT220
IN2
EN2
SENSE1
GND
GND
SENSE2
VBOOT
ORDERING NUMBERS: L6234 (POWER DIP 16+2+2)
L6234PD (PowerSO20)
fect, the RMS maximum current is practically limited by the dissipation capability of the package.
All the logic inputs are TTL, CMOS andµP compatible. Each channel is controlled by two separatelogic input.
L6234 is availablein 20 pin POWERDIP package
(16+2+2)and in PowerSO20.
GND
SENSE1
EN2
IN2
OUT2
OUT1
IN1
EN1
V
GND GND
2
3
4
5
6
7
8
9
S
10
D94IN129A
20
19
18
17
16
15
14
13
12
11
GND1
SENSE2
V
BOOT
V
cp
V
REF
OUT3
IN3
EN3
V
S
March 1998
POWER DIP (16+2+2)
PowerSO20
1/10
L6234
BLOCKDIAGRAM
10nF 1µF
0.22µF
IN1
EN1
IN2
EN2
IN3
EN3
CHARGE
PUMP
THERMAL
PROTECTION
VREFVCP
VBOOT 1N4148
V
=
REF
10V
TH1
TL1
TH2
TL2
TH3
TL3
Vs
7
to 52V
OUT1
OUT2
SENSE1
OUT3
SENSE2
0.1
µF
100µF
2/10
GND
D95IN309A
R
SENSE
THERMALDATA
Symbol Parameter DIP16+2+2 PowerSO20 Unit
R
th j-pin
R
thj-amb1
R
thj-amb2
th j-case
R
Thermal Resistance, Junction toPin
Thermal Resistance, Junction toAmbient
(see Thermal Characteristics)
Thermal Resistance, Junction to Ambient (see Thermal
Characteristics)
Thermal Resistance Junction-case
12 –
40 –
50 –
– 1.5 °C/W
L6234
C/W
°
C/W
°
C/W
°
THERMALCHARACTERISTICS
R
th j-pins
DIP16+2+2
. The thermal resistance is referred to
the thermal path from the dissipating region on
the top surface of the silicon chip, to the points
along the four central pins of the package, at a
distanceof 1.5 mm away from the stand-offs.
R
th j-amb1
If a dissipating surface, thick at least 35 µm, and
with a surface similar or bigger than the one
shown, is created making use of the printed circuit.
Such heatsinking surface is considered on the
bottomside of an horizontalPCB (worstcase).
R
th j-amb2
If the power dissipating pins (the four central
Figure1: Printed Heatsink
ones), as well as the others, have a minimum
thermal connection with the external world (very
thin stripsonly) so that the dissipation takes place
throughstill air and throughthe PCB itself.
It is the same situation of point above,without any
heatsinking surface created on purpose on the
board.
Addition al data on th e PowerDip and th e
PowerSO20 package can be foun d i n:
ApplicationNote AN467:
Thermal Characteristicsof the PowerDip
20,24Packages Solderedon 1,2,3 oz.
Copper PCB
ApplicationNote AN668:
A New High Power IC Surface Mount Package:
PowerSO20 Power IC Packaging from Insertion
to SurfaceMounting.
3/10
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