The L6226 is a DMOS Dual Full Bridge designed for
motor control applications, realized in MultiPower-
BLOCK DIAGRAM
VBOOT
VCP
PROGCL
OCD
EN
IN1
IN2
OCD
PROGCL
EN
IN1
IN2
A
A
A
A
A
B
B
B
B
B
V
BOOT
CHARGE
PUMP
VOLTAGE
REGULA TOR
OCD
THERMAL
PROTECTION
10V
5V
OCD
OVER
A
B
CURRENT
DETECTION
GA TE
LOGIC
OVER
CURRENT
DETECTION
GA TE
LOGIC
BCD technology, which combines isolated DMOS
Power Transistors with CMOS and bipolar c ir cuits on
the same chip. Available in PowerDIP24 (20+2+2),
PowerSO36 and SO24 (20+2+2) packages, the
L6226 features thermal shutdown and a non-dis sipative overcurrent detection on the high side Power
MOSFETs plus a diagnostic output that can be easily
used to implement the overcurrent protection.
VS
V
BOOT
10V10V
V
BOOT
BRIDGE A
BRIDGE B
D99IN1088A
A
OUT1
OUT2
SENSE
V
S
B
OUT1
OUT2
SENSE
A
A
A
B
B
B
September 2003
1/22
L6226
ABSOLUTE MAXIMUM RATINGS
SymbolParameterTest conditionsValueUnit
V
V
OD
Supply Voltage
S
Differential Voltage between
VSA, OUT1A, OUT2A, SENSEA and
VSB, OUT1B, OUT2B, SENSE
VSA =
VSB = V
VSA =
VSB = VS = 60V;
V
SENSEA
B
= V
S
SENSEB
= GND
60V
60V
OCDA,OCDBOCD pins Voltage Range -0.3 to +10V
PROGCLA,
PROGCL
V
BOOT
V
IN,VEN
V
SENSEA,
V
SENSEB
I
S(peak)
PROGCL pins Voltage Range -0.3 to +7V
B
Bootstrap Peak Voltage
VSA =
VSB = V
S
VS + 10V
Input and Enable Voltage Range -0.3 to +7V
Voltage Range at pins SENSEA
and SENSE
B
Pulsed Supply Current (for each
pin), internally limited by the
V
S
VSA =
t
PULSE
VSB = VS;
< 1ms
-1 to +4V
3.55A
overcurrent protection
I
S
T
, T
stg
RMS Supply Current (for each
pin)
V
S
Storage and Operating
OP
VSA =
VSB = V
S
2.8A
-40 to 150°C
Temperature Range
RECOMMENDED OPERATING CONDITIONS
SymbolParameterTest ConditionsMINMAXUnit
V
S
V
OD
V
SENSEA,
V
SENSEB
I
OUT
T
j
f
sw
Supply Voltage
Differential Voltage Between
VSA, OUT1A, OUT2A, SENSEA and
VSB, OUT1B, OUT2B, SENSE
(1)Mounted on a multi-layer FR4 PCB with a dissipati ng copper surface on the bottom side of 6 cm2 (with a thickness of 35 µm) .
(2)Mounted on a multi-layer FR4 PCB with a dissipati ng copper surface on the top side of 6 cm2 (with a thickness of 35 µm) .
(3)Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm), 16 via holes
and a groun d l ayer.
(4)Mounted on a multi-layer FR4 PCB without any hea t s i nking surfac e on the board.
PIN CONNECTIONS (Top View)
MaximumThermal Resistance Junction-Pins1915-°C/W
Maximum Thermal Resistance Junction-Case--2°C/W
MaximumThermal Resistance Junction-Ambient
Maximum Thermal Resistance Junction-Ambient
MaximumThermal Resistance Junction-Ambient
Maximum Thermal Resistance Junction-Ambient
1
2
3
4
4452-°C/W
--36°C/W
--16°C/W
597863°C/W
IN1
IN2
SENSE
OCD
OUT1
GND
GND
OUT1
OCD
SENSE
IN1
IN2
1
A
2
A
3
A
4
A
5
A
6
7
8
B
9
B
10
B
11
B
12
B
D99IN1089A
24
PROGCL
EN
VCP
OUT2
VS
A
A
A
A
23
22
21
20
GND19
GND
18
VS
17
16
15
14
13
B
OUT2
B
VBOOT
EN
B
PROGCL
B
PowerDIP24/SO24
(5) The slug is internally connected to pins 1,18,19 and 36 (GND pins).
GND
N.C.
N.C.
VS
OUT2
N.C.N.C.
VCP
EN
PROGCL
IN1
IN2
SENSE
OCD
N.C.
OUT1
N.C.
N.C.N.C.
GNDGND
1
2
3
4
A
5
A
6
7
8
A
9
A
1027
A
11
A
12
A
1324
A
14
15
A
16
17
18
D99IN1090A
PowerSO36
36
35
34
33
32
31
30
29
28
26
25
23
22
21
20
19
(5)
GND
N.C.
N.C.
VS
B
OUT2
VBOOT
EN
B
PROGCL
IN2
B
IN1
B
SENSE
OCD
B
N.C.
OUT1
N.C.
B
B
B
B
3/22
L6226
PIN DESCRIPTION
PACKA GE
SO24/
PowerDIP24
PowerSO36
NameTypeFunction
PIN #PIN #
110IN1
211IN2
A
A
312SENSE
413OCD
515OUT1
6, 7,
18, 19
1, 18,
19, 36
GNDGNDSignal Ground terminals. In Power DIP and SO packages,
822OUT1
924OCD
Logic inputBridge A Logic Input 1.
Logic inputBridge A Logic Input 2.
Power Supply Bridge A Source Pin. This pin must be connected to Power
A
Ground directly or through a sensing power resistor.
Open Drain
A
Output
Bridge A Overcurrent Detection and thermal protection pin.
An internal open drain transistor pulls to GND when
overcurrent on bridge A is detected or in case of thermal
protection.
Power Output Bridge A Output 1.
A
these pins are also used for heat dissipation toward the
PCB.
Power Output Bridge B Output 1.
B
B
Open Drain
Output
Bridge B Overcurrent Detection and thermal protection pin.
An internal open drain transistor pulls to GND when
overcurrent on bridge B is detected or in case of thermal
protection.
1025SENSE
1126IN1
1227IN2
1328PROGCL
1429EN
Power Supply Bridge B Source Pin. This pin must be connected to Power
B
B
B
B
Logic InputBridge B Input 1
Logic InputBridge B Input 2
B
R PinBridge B Overcurrent Level Programming. A resistor
Logic InputBridge B Enable. LOW logic level switches OFF all Power
1530VBOOTSupply
Voltage
1632OUT2
1733VS
204VS
215OUT2
Power Output Bridge B Output 2.
B
Power Supply Bridge B Power Supply Voltage. It must be connected to
B
Power Supply Bridge A Power Supply Voltage. It must be connected to
A
Power Output Bridge A Output 2.
A
Ground directly or through a sensing power resistor.
connected between this pin and Ground sets the
programmable current limiting value for the bridge B. By
connecting this pin to Ground the maximum current is set.
This pin cannot be left non-connected.
MOSFETs of Bridge B.
If not used, it has to be connected to +5V.
Bootstrap Voltage needed for driving the upper Power
MOSFETs of both Bridge A and Bridge B.
the supply voltage together with pin VS
the supply voltage together with pin VS
.
A
.
B
4/22
L6226
PIN DESCRIPTION
(continued)
PACKAGE
SO24/
PowerDIP24
PowerSO36
NameTypeFunction
PIN #PIN #
227VCPOutputCharge Pump Oscillator Output.
238EN
A
Logic InputBridge A Enable. LOW logic level switches OFF all Power
MOSFETs of Bridge A.
If not used, it has to be connected to +5V.
249PROGCL
A
R PinBridge A Overcurrent Level Programming. A resistor
connected between this pin and Ground sets the
programmable current limiting value for the bridge A. By
connecting this pin to Ground the maximum current is set.
This pin cannot be left non-connected.