SGS Thomson Microelectronics L6206PD, L6206N, L6206D Datasheet

DMOS DUAL FULL BRIDGE DRIVER

■

OPERATING SUPPLY VOLTAGE FROM 8 TO 52V

■ 5.6A OUTPUT PEAK CURRENT (2.8A DC)

■ R

■ OPERATING FREQUENCY UP TO 100KHz

■

PROGRAMMABLE HIGH SIDE OVERCURRENT DETECTION AND PROTECTION

■

DIAGNOSTIC OUTPUT

■

PARALLE LED OPERATION

■ CROSS CONDUCTION PROTECTION

■ THERMAL SHUTDOWN

■ UNDER VOLTAGE LOCKOUT

■

INTEGRATED FAST FREE WHEELING DIODES

0.3Ω TYP. VA LUE @ Tj = 25 °C

DS(ON)

PowerDIP24

(20+2+2)

PowerSO36

ORDERING NUMBERS:

L6206N (PowerDIP24) L6206PD (PowerSO36) L6206D (SO24)

L6206

SO24

(20+2+2)

TYPICAL APPLICATIONS

■ BIPOLAR STEPPER MOTOR

■ DUAL OR QUAD DC MOTOR

DESCRIPTION

The L6206 is a DMOS Dual Full Bridge designed for motor control applications, realized in MultiPower-

BLOCK DIAGRAM

VBOOT

VCP

PROGCL

OCD

EN IN1 IN2

OCD

PROGCL

EN IN1 IN2

A A

A A A

B

B B B

V

BOOT

CHARGE

PUMP

VOLTAGE

REGULA TOR

OCD

THERMAL

PROTECTION

10V 5V

OCD

OVER

A

B

CURRENT

DETECTION

GA TE

LOGIC

OVER

CURRENT

DETECTION

GA TE

LOGIC

BCD technology, which combines isolated DMOS Power Transistors with CMOS and bipolar c ir cuits on the same chip. Available in PowerDIP24 (20+2+2), PowerSO36 and SO24 (20+2+2) packages, the L6206 features thermal shutdown and a non-dis sipative overcurrent detection on the high side Power MOSFETs plus a diagnostic output that can be easily used to implement the overcurrent protection.

VS

V

BOOT

10V 10V

V

BOOT

BRIDGE A

BRIDGE B

D99IN1088A

A

OUT1 OUT2

SENSE

V

S

B

OUT1 OUT2 SENSE

A A

A

B B

B

September 2003

1/23

L6206

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Test conditions Value Unit

V

OD

Supply Voltage

S

Differential Voltage between VSA, OUT1A, OUT2A, SENSEA and VSB, OUT1B, OUT2B, SENSE

VSA =

VSB = V

VSA =

VSB = VS = 60V;

V

SENSEA

B

= V

S

SENSEB

= GND

60 V 60 V

OCDA,OCDBOCD pins Voltage Range -0.3 to +10 V

PROGCLA, PROGCL

V

BOOT

V

IN,VEN

V

SENSEA,

V

SENSEB

I

S(peak)

PROGCL pins Voltage Range -0.3 to +7 V

B

Bootstrap Peak Voltage

VSA =

VSB = V

S

VS + 10 V Input and Enable Voltage Range -0.3 to +7 V Voltage Range at pins SENSEA

and SENSE

B

Pulsed Supply Current (for each

pin), internally limited by the

V

S

VSA = t

PULSE

VSB = VS;

< 1ms

-1 to +4 V

7.1 A

overcurrent protection

I

S

T

, T

stg

RMS Supply Current (for each

pin)

V

S

Storage and Operating

OP

VSA =

VSB = V

S

2.8 A

-40 to 150 °C

Temperature Range

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Test Conditions MIN MAX Unit

V

S

V

OD

V

SENSEA,

V

SENSEB

I

OUT

T

j

f

sw

Supply Voltage Differential Voltage Between

VSA, OUT1A, OUT2A, SENSEA and VSB, OUT1B, OUT2B, SENSE

Voltage Range at pins SENSEA and SENSE

B

RMS Output Current 2.8 A Operating Junction Temperature -25 +125 °C Switching Frequency 100 KHz

VSA = VSA =

V

SENSEA

B

(pulsed tW < trr) (DC)

VSB = V VSB = VS;

= V

SENSEB

S

852V

52 V

-6

-1

6 1

V V

2/23

L6206

THERMA L D ATA

Symbol Description PowerDIP24 SO24 PowerSO36 Unit

R

th-j-pins

R

th-j-case

R

th-j-amb1

R

th-j-amb1

R

th-j-amb1

R

th-j-amb2

(1) Mounted on a multi-layer FR4 PCB with a dissipati ng copper surface on the bottom side of 6 cm2 (with a thickness of 35 µm) . (2) Mounted on a multi-layer FR4 PCB with a dissipati ng copper surface on the top side of 6 cm2 (with a thickness of 35 µm) . (3) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm), 16 via holes

and a groun d l ayer.

(4) Mounted on a multi-layer FR4 PCB without any hea t s i nking surfac e on the board.

PIN CONNECTIONS (Top View)

MaximumThermal Resistance Junction-Pins 18 14 - °C/W Maximum Thermal Resistance Junction-Case - - 1 °C/W

MaximumThermal Resistance Junction-Ambient Maximum Thermal Resistance Junction-Ambient MaximumThermal Resistance Junction-Ambient Maximum Thermal Resistance Junction-Ambient

1

2

3

4

43 51 - °C/W

--35°C/W

--15°C/W

58 77 62 °C/W

IN1 IN2

SENSE

OCD

OUT1

GND GND

OUT1

OCD

SENSE

IN1 IN2

1

A

2

A

3

A

4

A

5

A

6 7 8

B

9

B

10

B

11

B

12

B

D99IN1089A

24

PROGCL EN VCP OUT2 VS

A

23 22 21 20

GND19 GND

18

VS

17 16 15 14 13

B

OUT2

B

VBOOT EN

B

PROGCL

B

PowerDIP24/SO24

(5) The slug is internally connected to pins 1,18,19 and 36 (GND pins).

GND

N.C. N.C.

VS

OUT2

N.C. N.C. VCP

EN

PROGCL

IN1 IN2

SENSE

OCD

N.C.

OUT1

N.C. N.C. N.C.

GND GND

1 2 3 4

A

5

A

6 7 8

A

9

A

10 27

A

11

A

12

A

13 24

A

14 15

A

16 17 18

D99IN1090A

PowerSO36

36 35 34 33 32 31 30 29 28

26 25

23 22 21 20 19

(5)

GND N.C. N.C. VS

B

OUT2

VBOOT EN

B

PROGCL IN2

B

IN1

B

SENSE OCD

B

N.C. OUT1 N.C.

B

3/23

L6206

PIN DESCRIPTION

PACKA GE

SO24/

PowerDIP24

PowerSO36

Name Type Function

PIN # PIN #

1 10 IN1 2 11 IN2

A

3 12 SENSE

413OCD

5 15 OUT1

6, 7,

18, 19

1, 18,

19, 36

GND GND Signal Ground terminals. In Power DIP and SO packages,

8 22 OUT1 9 24 OCD

Logic input Bridge A Logic Input 1. Logic input Bridge A Logic Input 2.

Power Supply Bridge A Source Pin. This pin must be connected to Power

A

Ground directly or through a sensing power resistor.

Open Drain

A

Output

Bridge A Overcurrent Detection and thermal protection pin. An internal open drain transistor pulls to GND when overcurrent on bridge A is detected or in case of thermal protection.

Power Output Bridge A Output 1.

A

these pins are also used for heat dissipation toward the PCB.

Power Output Bridge B Output 1.

B

Open Drain

Output

Bridge B Overcurrent Detection and thermal protection pin. An internal open drain transistor pulls to GND when overcurrent on bridge B is detected or in case of thermal protection.

10 25 SENSE

11 26 IN1 12 27 IN2 13 28 PROGCL

14 29 EN

Power Supply Bridge B Source Pin. This pin must be connected to Power

B

Logic Input Bridge B Input 1 Logic Input Bridge B Input 2

B

R Pin Bridge B Overcurrent Level Programming. A resistor

Logic Input Bridge B Enable. LOW logic level switches OFF all Power

15 30 VBOOT Supply

Voltage 16 32 OUT2 17 33 VS

20 4 VS

21 5 OUT2

Power Output Bridge B Output 2.

B

Power Supply Bridge B Power Supply Voltage. It must be connected to

B

Power Supply Bridge A Power Supply Voltage. It must be connected to

A

Power Output Bridge A Output 2.

A

Ground directly or through a sensing power resistor.

connected between this pin and Ground sets the programmable current limiting value for the bridge B. By connecting this pin to Ground the maximum current is set. This pin cannot be left non-connected.

MOSFETs of Bridge B. If not used, it has to be connected to +5V.

Bootstrap Voltage needed for driving the upper Power MOSFETs of both Bridge A and Bridge B.

the supply voltage together with pin VS

.

A

.

B

4/23

L6206

PIN DESCRIPTION

(continued)

PACKAGE

SO24/

PowerDIP24

PowerSO36

Name Type Function

PIN # PIN #

22 7 VCP Output Charge Pump Oscillator Output. 23 8 EN

A

Logic Input Bridge A Enable. LOW logic level switches OFF all Power

MOSFETs of Bridge A. If not used, it has to be connected to +5V.

24 9 PROGCL

A

R Pin Bridge A Overcurrent Level Programming. A resistor

connected between this pin and Ground sets the programmable current limiting value for the bridge A. By connecting this pin to Ground the maximum current is set. This pin cannot be left non-connected.

ELECTRICAL CHARACTERISTICS

(T

= 25 °C, Vs = 48V, unless otherwise specified)

amb

Symbol Parameter Test Conditions Min Typ Max Unit

V

Sth(ON)

V

Sth(OFF)

Turn-on Threshold 6.6 7 7.4 V Turn-off Threshold 5.6 6 6.4 V

I

Quiescent Supply Current All Bridges OFF;

S

T

j(OFF)

Thermal Shutdown Temperature 165 °C

Output DMOS Transistors

R

DS(ON)

High-Side Switch ON Resistance Tj = 25 °C 0.34 0.4 Ω

Low-Side Switch ON Resistance T

I

DSS

Leakage Current EN = Low; OUT = V

Source Drain Diodes

V

Forward ON Voltage ISD = 2.8A, EN = LOW 1.15 1.3 V

SD

t

Reverse Recovery Time If = 2.8A 300 ns

rr

t

Forward Recovery Time 200 ns

fr

Logic Input

V

Low level logic input voltage -0.3 0.8 V

IL

High level logic input voltage 2 7 V

IH

= -25°C to 125°C

T

j

=125 °C

T

j

= 25 °C 0.28 0.34 Ω

j

T

=125 °C

j

(6)

0.53 0.59 Ω

0.47 0.53 Ω

S

2mA

EN = Low; OUT = GND -0.15 mA

510mA

I

Low Level Logic Input Current GND Logic Input Voltage -10 µA

IL

5/23

L6206

ELECTRICAL CHARACTERISTICS (continued)

(T

= 25 °C, Vs = 48V, unless otherwise specified)

amb

Symbol Parameter Test Conditions Min Typ Max Unit

I

High Level Logic Input Current 7V Logic Input Voltage 10 µA

IH

V

th(ON)

V

th(OFF)

V

th(HYS)

Turn-on Input Threshold 1.8 2.0 V Turn-off Input Threshold 0.8 1.3 V Input Threshold Hysteresis 0.25 0.5 V

Switching Characteristics

t

D(on)EN

t

D(on)IN

t

RISE

t

D(off)EN

t

D(off)IN

t

FALL

f

Enable to out turn ON delay time Input to out turn ON delay time I

Output rise time Enable to out turn OFF delay time

Input to out turn OFF delay time Output Fall Time

Dead Time Protection 0.5 1 µs

t

dt

CP

Charge pump frequency

Over Current Detection

I

s over

Input Supply Over Current DetectionThreshold

(7)

I

=2.8A, Resistive Load 100 250 400 ns

LOAD

=2.8A, Resistive Load

LOAD

1.6 µs

(dead time included)

I

=2.8A, Resistive Load 40 250 ns

LOAD

(7)

I

=2.8A, Resistive Load 300 550 800 ns

LOAD

I

=2.8A, Resistive Load 600 ns

LOAD

I

=2.8A, Resistive Load 40 250 ns

LOAD

-25°C<Tj <125°C 0.6 1 MHz

-25°C<Tj <125 °C; RCL= 39 kΩ

-25°C<Tj <125 °C; RCL= 5 kΩ

-25°C<Tj <125 °C; RCL= GND

-10%

-30%

0.57

4.42

5.6

+10% +10% +30%

A A A

R

OPDR

t

OCD(ON)

t

OCD(OFF)

(6) Tested at 25°C in a restricted range and guaranteed by characterization. (7) See Fig. 1. (8) See Fig. 2.

Open Drain ON Resistance I = 4mA 40 60 Ω OCD Turn-on Delay Time (8) I = 4mA; CEN < 100pF 200 ns OCD Turn-off Delay Time (8) I = 4mA; CEN < 100pF 100 ns

6/23

Figure 1. Switching Characteristic Definition

EN

V

th(ON)

V

th(OFF)

I

OUT

90%

10%

D01IN1316

t

D(OFF)EN

Figure 2. Ove rcurrent Detect i on Timi ng Definition

I

OUT

t

FALL

t

D(ON)EN

t

RISE

L6206

t

OCD

Threshold

V

OCD

90%

10%

t

OCD(ON)

t

OCD(OFF)

D01IN1222

t

7/23