The L6205 is a DMOS Dual Full Bridge designed for
motor control applications, realized in MultiPower-
0.3Ω TYP. VA LUE @ Tj = 25 °C
DS(ON)
L6205
PowerDIP20
(16+2+2)
BCD technology, which combines isolated DMOS
Power Transistors with CMOS and bipolar c ir cuits on
the same chip. Available in PowerDIP20 (16+2+2),
PowerSO20 and SO20(16+2+2) packages, the
L6205 features a non-dissipative protection of the
high side PowerMOSFETs and thermal shutdown.
(1)Mounted on a multi-layer FR4 PCB with a dissipati ng copper surface on the bottom side of 6cm2 (with a thickness of 35µm).
(2)Mounted on a multi-layer FR4 PCB with a dissipati ng copper surface on the top side of 6cm2 (with a thic kness of 35µm ).
(3)Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm2 (with a thickness of 35µm), 16 via holes
and a groun d l ayer.
(4)Mounted on a multi-layer FR4 PCB without any hea t s i nking surfac e on the board.
PIN CONNECTIONS (Top View)
MaximumThermal Resistance Junction-Pins1214-°C/W
Maximum Thermal Resistance Junction-Case--1°C/W
MaximumThermal Resistance Junction-Ambient
Maximum Thermal Resistance Junction-Ambient
MaximumThermal Resistance Junction-Ambient
Maximum Thermal Resistance Junction-Ambient
1
2
3
4
4051-°C/W
--35°C/W
--15°C/W
567762°C/W
IN1
IN2
SENSE
OUT1
GNDGND
GND
OUT1
SENSE
IN1
IN2
1
A
2
A
3
A
4
A
5
6
7
B
8
B
9
B
10
B
D99IN1093A
20
19
18
17
16
14
13
12
11
EN
A
VCP
OUT2
VS
A
GND15
VS
B
OUT2
VBOOT
EN
B
GNDGND
VS
A
OUT2
VCP
EN
IN1
IN2
B
SENSE
OUT1
GND
PowerDIP20/SO20
(5)The slug is internally connected to pins 1,10,11 and 20 (GND pins).
1
A
A
2
3
4
A
A
A
A
A
5
6
7
8
9
D99IN1092A
PowerSO20
(5)
20
19
18
17
16
15
14
13
12
11
VS
B
OUT2
VBOOT
EN
B
IN2
B
IN1
B
SENSE
OUT1
GND10
B
B
B
3/21
L6205
PIN DESCRIPTION
PACKA GE
SO20/
PowerDIP20
PowerSO20
NameTypeFunction
PIN #PIN #
16IN1
27IN2
38SENSE
A
A
Logic InputBridge A Logic Input 1.
Logic InputBridge A Logic Input 2.
Power Supply Bridge A Source Pin. This pin must be connected to Power
A
Ground directly or through a sensing power resistor.
49OUT1
5, 6, 15, 161, 10, 11,
20
GNDGNDSignal Ground terminals. In PowerDIP and SO packages,
Power Output Bridge A Output 1.
A
these pins are also used for heat dissipation toward the
PCB.
712OUT1
813SENSE
Power Output Bridge B Output 1.
B
Power Supply Bridge B Source Pin. This pin must be connected to Power
B
Ground directly or through a sensing power resistor.
914IN1
1015IN2
1116EN
B
B
B
Logic InputBridge B Logic Input 1.
Logic InputBridge B Logic Input 2.
(6)
Logic Input
Bridge B Enable. LOW logic level switches OFF all Power
MOSFETs of Bridge B. This pin is also connected to the
collector of the Overcurrent and Thermal Protection
transistor to implement over current protection.
If not used, it has to be connected to +5V through a
resistor.
1217VBOOTSupply
Voltage
1318OUT2
1419VS
Power Output Bridge B Output 2.
B
Power Supply Bridge B Power Supply Voltage. It must be connected to
B
Bootstrap Voltage needed for driving the upper
PowerMOSFETs of both Bridge A and Bridge B.
the supply voltage together with pin VS
172VS
Power Supply Bridge A Power Supply Voltage. It must be connected to
A
the supply voltage together with pin VS
183OUT2
Power Output Bridge A Output 2.
A
194VCPOutputCharge Pump Oscillator Output.
205EN
A
Logic Input
(6)
Bridge A Enable. LOW logic level switches OFF all Power
MOSFETs of Bridge A. This pin is also connected to the
collector of the Overcurrent and Thermal Protection
transistor to implement over current protection.
If not used, it has to be connected to +5V through a
resistor.
.
A
.
B
(6) Also connect ed at the output dra i n o f the Overcurren t and Thermal prot ection MOSF E T . Therefore, it has to be driven putting in series a
resistor with a value in the range of 2.2kΩ - 180K Ω , recommend e d 100kΩ