.VERYLOWQUIESCENTCURRENT
.HIGHNOISEIMMUNITY
.SINGLESUPPLY OPERATION
.SUPPLYVOLTAGE RANGE 3V TO 18V
.HIGH INPUT IMPEDANCE
.PIN LAYOUT OPTIMISED FOR MAXIMUM
FLEXIBILITY
EY
(Plastic Package)
HCC4 57 2B
HCF4572B
HEX GATE
PRODUCT PREVI EW
F
(Ceramic Frit Seal Package)
M1
(Micro Package)
ORDER CODES :
HCC 4572 BF HCF4572 BM1
HCF4572 B EY HCF4572 BC1
PIN CONNE C TI ON (top v iew)
(Plastic Chip Carrier)
C1
DESCRIPTION
The HCC4572BandHCF4572Barea monolithic integrated circuits, available in 16-lead dual-in-line
plastic and ceramic packages and plastic micro
packages.
The HCC4572B andHCF4572Bare hex functional
gates containing one NOR gate, one NAND gate
and four inverters. These devices are intended for
application wherelowpowerdissipation and/or high
noiseimmunity is required.
September 1990
1/6
Plastic DIP16 (0.25) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
mm inch
2/6
P001C
Ceramic DIP16/1 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787
B 7 0.276
D 3.3 0.130
E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012
M 0.51 1.27 0.020 0.050
N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
mm inch
P053D
3/6
SO16 (Narrow) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.2 0.004 0.007
a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45° (typ.)
D 9.8 10 0.385 0.393
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.62 0.024
S8°(max.)
mm inch
4/6
P013H
PLCC20 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015
G 0.101 0.004
M 1.27 0.050
M1 1.14 0.045
mm inch
P027A
5/6
Information furnished is believed tobe accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted byimplicationor otherwise under any patentor patent rights ofSGS-THOMSONMicroelectronics. Specificationsmentioned
in this publication are subject to changewithout notice.This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsarenotauthorizedforuse ascriticalcomponentsinlifesupportdevicesorsystemswithoutexpress
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics- All Rights Reserved
6/6
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SGS-THOMSON Microelectronics GROUP OF COMPANIES
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