SGS Thomson Microelectronics HCF4572B Datasheet

.VERYLOWQUIESCENTCURRENT

.HIGHNOISEIMMUNITY

.SINGLESUPPLY OPERATION

.SUPPLYVOLTAGE RANGE 3V TO 18V

.HIGH INPUT IMPEDANCE

.PIN LAYOUT OPTIMISED FOR MAXIMUM

FLEXIBILITY

EY

(Plastic Package)

HCC4 57 2B

HCF4572B

HEX GATE

PRODUCT PREVI EW

F

(Ceramic Frit Seal Package)

M1

(Micro Package)

ORDER CODES :

HCC 4572 BF HCF4572 BM1
HCF4572 B EY HCF4572 BC1

PIN CONNE C TI ON (top v iew)

(Plastic Chip Carrier)

C1

DESCRIPTION

The HCC4572BandHCF4572Barea monolithic in­tegrated circuits, available in 16-lead dual-in-line
plastic and ceramic packages and plastic micro
packages.

The HCC4572B andHCF4572Bare hex functional
gates containing one NOR gate, one NAND gate
and four inverters. These devices are intended for
application wherelowpowerdissipation and/or high
noiseimmunity is required.

September 1990

1/6

Plastic DIP16 (0.25) MECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

a1 0.51 0.020

B 0.77 1.65 0.030 0.065

b 0.5 0.020

b1 0.25 0.010

D 20 0.787
E 8.5 0.335

e 2.54 0.100

e3 17.78 0.700

F 7.1 0.280

I 5.1 0.201

L 3.3 0.130

Z 1.27 0.050

mm inch

2/6

P001C