SGS Thomson Microelectronics HCF4511B Datasheet

BCD-TO-SEVEN SEGMENT LATCH/DECODER/DRIVER
. HIGH-OUTPUT-SOURCING CAPABILITY (up
to 25 mA)
.INPUTLATCHES FOR BCD CODE STORAGE
.LAMP TEST AND BLANKING CAPABILITY
.7-SEGMENT OUTPUTS BLANKED FOR BCD
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.STANDARDIZED SYMMETRICAL OUTPUT
CHARACTERISTICS
.5V, 10V, AND 15VPARAMETRIC RATINGS
.INPUTCURRENTOF100mAAT18V AND25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVESTANDARDN°13A,”STANDARDSPE­CIFICATIONS FOR DESCRIPTION OF ”B” SERIESCMOS DEVICES”
HCC/HCF4511B
EY
(Plastic Package)
M1
(MicroPackage)
ORDERCODES :
HCC 4511BF HCF4511BM1 HCF4511BEY HCF4511BC1
(CeramicFrit Seal Package)
C1
(Plastic Chip Carrier)
F
DESCRI PTIO N
TheHCC4511B (extendedtemperature range) and the HCF 4511B (intermediate temperature range) are monolithic integrated circuits available in 16-le­ad dual in-line plastic or ceramic package and pla­stic micro package.
TheHCC/HCF4511B typesareBCD-to-7-segment latch decoder drivers constructed with COS/MOS logic and n-p-n bipolar transistor output deviceson a singlemonolithic structure. These devices combi­ne thelow quiescent powerdissipationandhighnoi­se immunity features of COS/MOS with n-p-n bipolar output transistors capable of sourcingup to 25 mA. This capability allowsthe HCC/HCF4511B typesto drive LED’s and other displays directly.
LampTest(LT), Blanking (BL), and LatchEnableor Strobe inputs are provided to test the display, shut off or intensity-modulate it, and store or strobe a BCD code, respectively. Several different signal may be multiplexed and displayed when external multiplexing circuitry is used.
PIN CONNECTI O NS
November1996
1/16
HCC/HFC4511B
FUN CTIONAL DIAG R A M
ABSOLUTE MAXIMUM RATIN GS
Symbol Parameter Value Unit
* Supply Voltage :HCC Types
V
DD
HCF Types
V
Input Voltage – 0.5 to VDD+ 0.5 V
i
DC Input Current (any one input) ± 10 mA
I
I
P
Total Power Dissipation (per package)
tot
Dissipation per Output Transistor for T
T
Operating Temperature : HCC Types
op
= Full Package-temperature Range
op
HCF Types
T
Stresses abovethose listed under ”Absolute MaximumRatings”may cause permanent damage to the device. This is a stressrating only and functionnal operation of the device at theseor any other conditions abovethose indicatedin theoperationalsections ofthis specification is not implied.Exposure toabsolute maximum ratingconditions for external periods may affectdevice reliability.
*
Allvoltage values are referred to VSSpinvoltage.
Storage Temperature – 65 to + 150 °C
stg
– 0.5 to + 20 – 0.5 to + 18
200 100
– 55 to + 125
–40to+85
V V
mW mW
°C °C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
V
T
2/16
Supply Voltage : HCC Types
DD
HCF Types
V
Input Voltage 0 to V
I
Operating Temperature : HCC Types
op
HCF Types
3to18 3to15
DD
– 55 to + 125
–40to+85
V V
V
°C °C
LOGIC DIAGRAMS
HCC/HCF4511B
3/16
HCC/HFC4511B
TRUTH TABLE
LE BI LT D C B A a b c d e f g Display
XX0X X X 0 1 X X X X 0 0 0 0 0 0 0 Blank
0110 0 0110 0 0110 0 0110 0 0110 1 0110 1 01101 0110 1 0111 0 0111 0
0 1 1 1 0 1 0 0 0 0 0 0 0 0 Blank 0 1 1 1 0 1 1 0 0 0 0 0 0 0 Blank 0 1 1 1 1 0 0 0 0 0 0 0 0 0 Blank 0 1 1 1 1 0 1 0 0 0 0 0 0 0 Blank 0 1 1 1 1 1 0 0 0 0 0 0 0 0 Blank 0 1 1 1 1 1 1 0 0 0 0 0 0 0 Blank 1 1 1 X X X X * *
X X 1 1 1 1 1 1 1
0 0 1 1 1 1 1 1 0 0 1 0 1 1 0 0 0 0 1 0 1 1 0 1 1 0 1 1 1 1 1 1 1 0 0 1 0 0 0 1 1 0 0 1 1 0 1 1 0 1 1 0 1 1 1 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 1 1 1 1 1 1 1 0 1 1 1 1 0 0 1 1
8
0 1 2 3 4 5 6 7 8 9
4/16
HCC/HCF4511B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions Valu e
Symbol Parameter
I
Quiescent
L
Current
HCC Types
HCF Types
V
OH
Output High Voltage
V
OL
Output Low Voltage
V
IH
Input High Voltage
V
IL
Input Low Voltage
V
OH
Output Drive
HCC Types
Voltage
*T
=–55°C for HCC device : – 40°CforHCF device.
Low
*T
= +125°C for HCC device: + 85°C for HCF device.
High
TheNoise Marginfor both ”1” and”0” level is : 1V min. with VDD= 5V,2V min. withVDD=10V, 2.5 V min. withVDD= 15V.
V
V
O
|IO|V
I
(V) (V) (µA) (V)
T
DD
* 25°CT
Low
Min. Max. Min. Ty p. Max. Min. Max .
High
0/ 5 5 5 0.04 5 150 0/10 10 10 0.04 10 300 0/15 15 20 0.04 20 600 0/20 20 100 0.08 100 3000 0/ 5 5 20 0.04 20 150 0/10 10 40 0.04 40 300 0/15 15 80 0.04 80 600
0/ 5 5 4 4.1 4.55 4.2
0/10 10 9 9.1 9.55 9.2 0/15 15 14 14.1 14.55 14.2
5/0 5 0.05 0.05 0.05 10/0 10 0.05 0.05 0.05 15/0 15 0.05 0.05 0.05
0.5/3.8 5 3.5 3.5 3.5 1/8.8 10 7 7 7
1.5/13.8 15 11 11 11
3.8/0.5 5 1.5 1.5 1.5
8.8/1 10 3 3 3
13.8/1.5 15 4 4 4 0
4.1 4.10 4.55 4.20
5 4.25
10 3.80 3.90 4.10 3.90
5
15 3.95 20 3.55 3.40 3.75 25 3.40 3.10 3.55
0
9 9.10 9.55 9.20
5 9.25
10 8.85 9 9.15
10
15 9.05 20 8.70 8.60 8.90 8.40 25 8.60 8.30 8.75
0
14 14.10 14.55 14.20
5 14.30
10 13.90 14 14.20 14
15
15 14.10 20 13.75 13.70 13.95 13.50 25 13.65 13.50 13.80 13.10
Unit
*
µA
V
V
V
V
V
V
V
5/16
HCC/HFC4511B
STATIC ELECTRICAL CHARACTERISTICS (continued)
Test Conditions Valu e
Symbol Parameter
V
OH
Output Drive Voltage
HCF
Types
I
OL
Output Sink Current
HCC Types
HCF Types
I
IH,IIL
Input Leakage Current
HCC Types
HCF Types
C
Input Capacitance Any Input 5 7.5 pF
I
*T
=–55°C for HCC device : – 40°CforHCF device.
Low
*T
= +125°C for HCC device: + 85°C for HCF device.
High
TheNoise Marginfor both ”1” and”0” level is : 1V min. with VDD= 5V,2V min. withVDD=10V, 2.5 V min. withVDD= 15V.
V
V
O
|IO|V
I
(V) (V) (µA) (V)
0
T
DD
* 25°CT
Low
Min. Max. Min. Ty p. Max. Min. Max .
4.1 4.1 4.57 4.1
5 4.24
10 3.6 3.6 4.12 3.3
5
15 3.94 20 2.8 2.8 3.75 2.5 25 3.54
0
9.1 9.1 9.58 9.1
5 9.26
10 8.75 8.75 9.17 8.45
10
15 9.04 20 8.1 8.1 8.90 7.8 25 8.75
0
14.1 14.1 14.59 14.1
5 14.27
10 13.75 13.75 14.18 13.45
15
15 14.07 20 13.1 13.1 13.95 12.8
25 13.80 0/ 5 0.4 5 0.64 0.51 1 0.36 0/10 0.5 10 1.6 1.3 2.6 0.9 0/15 1.5 15 4.2 3.4 6.8 2.4 0/ 5 0.4 5 0.52 0.44 1 0.36 0/10 0.5 10 1.3 1.1 2.6 0.9 0/15 1.5 15 3.6 3 6.8 2.4
0/18
18 ± 0.1 ±10
–5
± 0.1 ±1
Any Input
0/15
15 ±0.3 ±10
–5
± 0.3 ± 1
High
Unit
*
V
V
V
mA
µA
6/16
HCC/HCF4511B
DYNAMIC ELECTRICAL CHARACTERISTICS (T
=25oC, CL=50pF,RL= 200 K,
amb
typic al temperature coeffic ent for all VDDvalues is 03 %/oC, all input rise and fall tim es = 20 ns)
Symbol Parameter
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
t
t
setup
t
Propagation Delay Time (data) 5 520 1040
Propagation Delay Time (data) 5 660 1320
Propagation Delay Time (BL) 5 350 700
Propagation Delay Time (BL) 5 400 800
Propagation Delay Time (LT) 5 250 500
Propagation Delay Time (LT) 5 150 300
Transition Time 5 40 80
TLH
Transition Time 5 125 310
THL
Setup Time 5 150 75
Hold Time 5 0 -75
hold
Strobe Pulse Width 5 400 200
t
W
Test Conditions Value
(V) Min. Typ. Max.
V
DD
10 210 420 15 150 300
10 260 520 15 180 360
10 175 350 15 125 250
10 175 350 15 150 300
10 125 250 15 85 170
10 75 150 15 50 100
10 30 60 15 20 40
10 75 185 15 65 160
10 70 35 15 40 20
10 0 -35 15 0 -20
10 160 80 15 100 50
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
7/16
HCC/HFC4511B
TypicalOutputLow (sink) Current Characteristics. Typical data-to-output, low-to-high-level propaga-
tion delay time as a function of load capacitance.
Typicaldata-to-output, high-to-low-level propaga­tion delay time as a function of loadcapacitance.
Typical high-to-low level transition ime as a func­tion of load capacitance.
Typicallow-to-high level transitionime as a func­tion of load capacitance.
TypicalVoltage drop (VDDtooutput) vs. Output source Current as a Function of Supply.
8/16
HCC/HCF4511B
TypicalDynamic Power Dissipation Charac-
Derated Static Output Current PerOutput.
teristics.
Maximumcontinuous derated output currentIOH appliesto a single outputwith allother outputs sourcing an equalamount of currentat the supplyvoltages shown. Operationabove the deratingcurve is not recommenced.
TYPICAL APPLICA TI ONS (inter faci ng w ith variou s disp lays) DRIVINGCOMMON-CATHODE 7-SEGMENT LED DISPLAYS
9/16
HCC/HFC4511B
TYPICAL APPLICA TI ONS (cont inued)
Driving Low-voltage Fluorescent Displays. Driving Incandescent Displays.
Amedium-brightness intensitydisplay can be obtained withlow­voltagefluorescent displays such as the Tung-Sot Digivac S/G series.
TEST CIRCUITS
QuiescentDevice Current.
Input Leakage Current.
2 of 7 SegmentsShownConnected
Resistors R from VDD VDD to each 7-segment driver output arechoosen to keep allNumitronsegments slightlyon and warm.
Noise Immunity.
Data Propagation Delay.
10/16
TEST CIRCUITS (contin ue d) Dynamic Power dissipation.
HCC/HCF4511B
11/16
HCC/HFC4511B
Plastic DIP16 (0.25) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787 E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
mm inch
12/16
P001C
Ceramic DIP16/1 MECHANICAL DATA
HCC/HCF4511B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787 B 7 0.276 D 3.3 0.130 E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012 M 0.51 1.27 0.020 0.050 N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
mm inch
P053D
13/16
HCC/HFC4511B
SO16 (Narrow) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068 a1 0.1 0.2 0.004 0.007 a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45° (typ.)
D 9.8 10 0.385 0.393
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.62 0.024
S8°(max.)
mm inch
14/16
P013H
PLCC20 MECHANICAL DATA
HCC/HCF4511B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015 G 0.101 0.004 M 1.27 0.050
M1 1.14 0.045
mm inch
P027A
15/16
HCC/HFC4511B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSONMicroelectronics assumes no responsability for the consequences of use of such informationnor for any infringement of patents or other rights of third partieswhich may results from its use. No licenseis grantedby implication or otherwise under any patent or patent rights of SGS-THOMSONMicroelectronics. Specifications mentioned in this publication are subject to changewithoutnotice. Thispublication supersedes andreplacesall information previously supplied. SGS-THOMSONMicroelectronics products are notauthorizedfor use ascriticalcomponents in lifesupport devices or systems without express writtenapproval ofSGS-THOMSONMicroelectonics.
1996 SGS-THOMSONMicroelectronics -Printedin Italy- AllRightsReserved
Australia- Brazil -Canada - China - France- Germany- Hong Kong - Italy - Japan- Korea- Malaysia - Malta - Morocco- The Netherlands -
Singapore - Spain - Sweden- Switzerland-Taiwan - Thailand- UnitedKingdom - U.S.A
SGS-THOMSONMicroelectronics GROUPOF COMPANIES
.
16/16
Loading...