SGS Thomson Microelectronics HCF4094B Datasheet

8–STAGESHIFT-AND-STOREBUS REGISTER

.3-STATE PARALLEL OUTPUTS FOR CON-

NECTIONTO COMMON BUS

.SEPARATE SERIAL OUTPUTS SYN-

CHRONOUSTOBOTH POSITIVEANDNEGA­TIVE CLOCK EDGES FOR CASCADING

.MEDIUM SPEED OPERATION 5MHzAT 10V

.STANDARDIZED SYMMETRICAL OUTPUT

CHARACTERISTICS

.QUIESCENT CURRENT SPECIFIED TO 20V

FOR HCC DEVICE

.5V, 10V,AND 15VPARAMETRIC RATINGS

.INPUT CURRENTOF100nA AT18V AND 25°C

FOR HCC DEVICE

.100% TESTEDFOR QUIESCENTCURRENT

.MEETSALLREQUIREMENTSOFJEDECTEN-

TATIVE STANDARD N°. 13A, ”STANDARD
SPECIFICATIONS FOR DESCRIPTIONOF ”B”
SERIESCMOS DEVICES”

HCC/HCF4094B

EY

(Plastic Package)

M1

(MicroPackage)

ORDERCODES :

HCC4094BF HCF4094BM1
HCF4094BEY HCF4094BC1

(CeramicFritSeal Package)

F

C1

(PlasticChipCarrier)

DESCRIPTION
The HCC4094B (extended temperature range) and

HCF4094B (intermediate temperature range) are

monolithic integrated circuits available in 16-lead
dual in-line plastic or ceramic packageand plastic
micropackage.

The HCC/HCF4094B isan 8-stage serial shiftreg-
ister having a storage latch associated with each
stage for strobing data from the serial input to par­allel buffered 3-state outputs. The parallel outputs
may be connected directly to common bus lines.
Dataisshiftedonpositive clocktransitions.The data
in each shift register stageistransferred to thestor­age register when the STROBEinput is high. Data
in thestorage register appears atthe outputswhen­ever the OUTPUT-ENABLE signal is high.Twoser­ial outputsare available for cascading a numberof
HCC/HCF4094B devices. Data is available at the
QSserialoutput terminal onpositiveclock edges to
allowfor high-speed operation in cascaded systems
in whichthe clockrise time is fast.The sameserial
information,availableatthe Q’Sterminalon thenext
negative clock edge, provides a means for cascad­ing HCC/HCF4094B devices when the clock rise
time isslow.

PIN CON NEC TI O NS

June 1989

1/14

HCC/HCF4094B

FUNCTIONAL DIAGRAM

ABSOLUTE MAXIMUM RATI NG S

Symbol Parameter Valu e Unit

V

* Supply Voltage :HCC Types

DD

HCF Types

V

Input Voltage – 0.5 to VDD+ 0.5 V

i

I

DC Input Current (any one input) ± 10 mA

I

P

Total Power Dissipation (per package)

tot

Dissipation per Output Transistor
for T

T

Operating Temperature : HCC Types

op

= Full Package-temperature Range

op

HCF Types

T

Stresses abovethose listedunder ”Absolute MaximumRatings”may cause permanent damage tothe device. This is a stressrating only and
functionaloperation of the deviceat these or any otherconditions abovethose indicated inthe operational sectionsof this specification is not
implied.Exposure toabsolutemaximum ratingconditions for external periodsmay affectdevice reliability.
*

Allvoltage valuesare referred to VSSpinvoltage.

Storage Temperature – 65 to + 150 °C

stg

– 0.5 to + 20
– 0.5 to + 18

200
100

–55to+125

–40to+85

V
V

mW
mW

°C
°C

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Value Unit

2/14

V

Supply Voltage : HC C Types

DD

HCF Types

V

Input Voltage 0 to V

I

T

Operating Temperature : HCC Types

op

HCF Types

3to18
3to15

DD

– 55 to + 125

–40to+85

V
V

V

°C
°C

LOGIC DIAGRAMS

HCC/HCF4094B

TIMING DIAGRAM

3/14

HCC/HCF4094B

TRUTH TABLE

TRUTH TABLE

∆ Outputs

CL

–

/

–
–

\

–

–

/

–

–

/

–

–

/

–
–

\

–

▲= Level Change Logic1 ≡ High
X = Don’tCare Logic0 ≡ Low
NC = No Change
OC = Open Circuit
*

Atthe positiveclock edgeinformation in the 7th shiftregister stageis transferred to the 8th registerstage and the QSoutput.

Enable

0XXOCOCQ7NC
0XXOCOCNCQ7
1 0 X NCNCQ7NC
1100Q
1111Q
1 1 1 NCNCNCQ7

Strobe Dat a

Parallel Outputs Serial Outputs

Q1 QN QS* Q’S

-1 Q7 NC

N

-1 Q7 NC

N

4/14

HCC/HCF4094B

STATIC ELECTRICAL CHARACTERISTICS(over recommended operating conditions)

Test Conditions Value

T

V

Symbol Parameter

I

Quiescent

L

Current

HCC
Types

V

I

(V) (V) (µA) (V)

0/ 5 5 5 0.04 5 150
0/10 10 10 0.04 10 300
0/15 15 20 0.04 20 600

O

|IO|V

DD

Min. M ax. Min. Typ. M ax. Min. Max.

0/20 20 100 0.08 100 3000

HCF
Types

OH

Output High

V

Voltage

0/ 5 5 20 0.04 20 150
0/10 10 40 0.04 40 300
0/15 15 80 0.04 80 600
0/ 5 < 1 5 4.95 4.95 4.95
0/10 < 1 10 9.95 9.95 9.95
0/15 < 1 15 14.95 14.95 14.95

OL

Output Low

V

Voltage

5/0 < 1 5 0.05 0.05 0.05
10/0 < 1 10 0.05 0.05 0.05
15/0 < 1 15 0.05 0.05 0.05

IH

Input High

V

Voltage

0.5/4.5 < 1 5 3.5 3.5 3.5
1/9 < 1 10 7 7 7

1.5/13.5 < 1 15 11 11 11

IL

Input Low

V

Voltage

4.5/0.5 < 1 5 1.5 1.5 1.5
9/1 < 1 10 3 3 3

13.5/1.5 < 1 15 4 4 4

I

OH

Output
Drive
Current

HCC
Types

0/ 5 2.5 5 – 2 – 1.6 – 3.2 – 1.15
0/ 5 4.6 5 – 0.64 – 0.51 – 1 – 0.36
0/10 9.5 10 – 1.6 – 1.3 – 2.6 – 0.9
0/15 13.5 15 – 4.2 – 3.4 – 6.8 – 2.4
0/ 5 2.5 5 – 1.53 – 1.36 – 3.2 – 1.1

HCF
Types

0/ 5 4.6 5 – 0.52 – 0.44 – 1 – 0.36
0/10 9.5 10 – 1.3 – 1.1 – 2.6 – 0.9
0/15 13.5 15 – 3.6 – 3.0 – 6.8 – 2.4

OL

Output
Sink
Current

HCC
Types

I

HCF
Types

I

IH,IIL

Input
Leakage
Current

HCC
Types

HCF
Types

I

OH,IOL

*T

Low

*T

High

TheNoise Margin for both”1” and”0” levelis : 1V min. withVDD=5V, 2V min.withVDD= 10V,2.5V min. withVDD= 15V.

3-state
Output
Leakage
Current

Input Capacitance Any Input 5 7.5 pF

C

I

=–55°CforHCC device : – 40°C for HCFdevice.

= +125°C for HCC device: + 85°C for HCF device.

HCC
Types

HCF
Types

0/ 5 0.4 5 0.64 0.51 1 0.36
0/10 0.5 10 1.6 1.3 2.6 0.9
0/15 1.5 15 4.2 3.4 6.8 2.4
0/ 5 0.4 5 0.52 0.44 1 0.36
0/10 0.5 10 1.3 1.1 2.6 0.9
0/15 1.5 15 3.6 3.0 6.8 2.4

0/18

18 ± 0.1 ±10

Any Input

0/15

15 ± 0.3 ±10

0/18 0/18 18 ± 0.4 ± 10

0/15 0/15 15 ± 1.0 ± 10

* 25°CT

Low

–5

± 0.1 ± 1

–5

± 0.3 ± 1

-4

± 0.4 ± 12

-4

± 1.0 ± 7.5

High

*

Unit

µA

V

V

V

V

mA

mA

µA

µA

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HCC/HCF4094B

DYNAMIC ELECTRICAL CHARACTERISTICS(T

=25°C, CL= 50pF,RL= 200kΩ,

amb

typical temperature coefficient for all VDD= 0.3%/°C values , all input rise and fall time = 20ns)

Symbol Parameter

t

PLH,tPHL

t

PLH,tPHL

t

PLH,tPHL

Propagation Delay Time Clock to
Serial Output Q

S

Propagation Delay Time Clock to
Serial Output Q’

S

Propagation Delay Time Clock to
Parallel Output

t

PLH,tPHL

Propagation Delay Time Strobe
to Parallel Output

t

PHZ

Propagation Delay Time Output
Enable to Parallel Output :
Output High to High Impedance

t

PL Z

t

t

t

se tu p

t

TL H,tTHL

t

r,tf

f

max

Out Low to High Impedance 5 225 450

Strobe Pulse Width 5 200 100

W

Clock Pulse Width 5 200 100

W

Data Setup Time 5 125 60

Transition Time 5 100 200

Clock Input Rise or Fall Time 5 15

Maximum Clock Input Frequency 5 1.25 2.5

Test Conditions Value

V

(V) Min. Typ. Max.

DD

5300600
10 125 250
15 95 190

5230460
10 110 220
15 75 150

5420840
10 195 390
15 135 270

5290580
10 145 290
15 100 200

5140280
10 75 150
15 55 110

10 95 190
15 70 140

10 80 40
15 70 35

10 100 50
15 83 40

10 55 30
15 35 20

10 50 100
15 40 80

10 5
15 5

10 2.5 5
15 3 6

Unit

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

µs

MHz

6/14

HCC/HCF4094B

TypicalOutputLow (sink)Current Characteristics. Minimum Output Low(sink) Current Charac-

teristics.

TypicalOutputHigh (source) Current Charateris­tics.

Clock-to-serial OutputQSPropagation Delay vs.
CL.

Minimum Output High(source)Current Charac­teristics.

Clock-to-serial Output Q’SPropagation Delay vs.
CL.

7/14

HCC/HCF4094B

Clock-to-parallel OutputPropagation Delay vs. CL. Strobe-to-parallel OutputPropagation Delayvs.CL.

OutputEnable-to-parallel Output Propagation
Delay vs.

TypicalMaximum-clock Frequency vs. Supply
Voltage.

TypicalTransition Timevs. LoadCapacitance.

Dynamic Power Dissipation vs. InputClock Fre­quency.

8/14

TYPICAL APPLICATION

REMOTECONTROL HOLDINGREGISTER

HCC/HCF4094B

TEST CIRCUITS

QuiescentDevice Current. Noise Immunity.

Input Leakage Current.

9/14

HCC/HCF4094B

Plastic DIP16 (0.25) MECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

a1 0.51 0.020

B 0.77 1.65 0.030 0.065

b 0.5 0.020

b1 0.25 0.010

D 20 0.787
E 8.5 0.335

e 2.54 0.100

e3 17.78 0.700

F 7.1 0.280

I 5.1 0.201

L 3.3 0.130

Z 1.27 0.050

mm inch

10/14

P001C

Ceramic DIP16/1 MECHANICAL DATA

HCC/HCF4094B

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 20 0.787
B 7 0.276
D 3.3 0.130
E 0.38 0.015

e3 17.78 0.700

F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060

L 0.22 0.31 0.009 0.012

M 0.51 1.27 0.020 0.050

N 10.3 0.406

P 7.8 8.05 0.307 0.317
Q 5.08 0.200

mm inch

P053D

11/14

HCC/HCF4094B

SO16 (Narrow) MECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 1.75 0.068

a1 0.1 0.2 0.004 0.007
a2 1.65 0.064

b 0.35 0.46 0.013 0.018

b1 0.19 0.25 0.007 0.010

C 0.5 0.019

c1 45° (typ.)

D 9.8 10 0.385 0.393

E 5.8 6.2 0.228 0.244

e 1.27 0.050

e3 8.89 0.350

F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208

L 0.5 1.27 0.019 0.050

M 0.62 0.024

S8°(max.)

mm inch

12/14

P013H

PLCC20 MECHANICAL DATA

HCC/HCF4094B

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 9.78 10.03 0.385 0.395

B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180

d1 2.54 0.100
d2 0.56 0.022

E 7.37 8.38 0.290 0.330

e 1.27 0.050

e3 5.08 0.200

F 0.38 0.015
G 0.101 0.004

M 1.27 0.050

M1 1.14 0.045

mm inch

P027A

13/14

HCC/HCF4094B

Information furnished is believed tobe accurate and reliable.However, SGS-THOMSON Microelectronicsassumes no responsability forthe
consequences of useof such information nor for any infringement of patents orother rights of third partieswhich may results from its use. No
license isgranted by implication or otherwise under any patent orpatent rights ofSGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to changewithout notice. This publication supersedesand replaces all information previously supplied.
SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin lifesupport devicesor systemswithout express
written approval of SGS-THOMSONMicroelectonics.

 1994 SGS-THOMSON Microelectronics - All RightsReserved

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