TATIVE STANDARD N. 13A, ” STANDARD
SPECIFICATIONS FOR DESCRIPTION OF B
SERIESCMOS DEVICES ”
HCC4076B
HCF4076B
4 BIT D TYPE REGISTERS
EY
C
(PlasticPackage)
M1
(MicroPackage)
(CeramicPackage)
F
C1
(Chip Carrier)
DESCRIPTION
TheHCC4076B (extended temperature range) and
HCC4076B (intermediate temperature range) are
monolithic integrated circuit, available in 16 lead
dual in line plastic or ceramic package and plastic
micropackage.
The HCC/HCF4076B types are four-bit registers
consisting of D-type flip-flops that feature threestate outputs. Data Disable inputs are provided to
controltheentryofdataintotheflip-flops.Whenboth
DataDisable inputsare low,data attheDinputsare
loaded into their respective flip-flops on the next
positivetransition of the click input. Output Disable
inputs are also provided. Whenthe OutputDisable
inputs are both low, the normal logic states of the
four outputs are available to the load. The outputs
are disabled independently of the clock by a high
logic level at either Output Disable input,and present a high impedance.
ORDER CODES :
HCC4 076BFHCF4076BM1
HCF4076BEYHCF4076BC1
PIN CONNECTIONS
September 1988
1/13
HCC/HCF4076B
FUN CTIONAL DIAG R A M
ABSOLU TE MAXIMU M RAT ING
SymbolParameterValueUnit
V
*Supply Voltage: HCC Types
DD
HCF Types
V
P
Input Voltage-0.5 to VDD+ 0.5V
i
I
DC Input Current (any one input)± 10mA
I
Total Power Dissipation (per package)
tot
Dissipation per Output Transistor
for Top = Full Package Temperature Range
T
Operating Temperature: HCC Types
op
HCF Types
T
Stressesabove those listedunder”AbsoluteMaximum Ratings”maycausepermanent damagetothedevice.Thisisastressratingonlyand functional
operation of the device at these or any otherconditions above thoseindicated in theoperational sections of thisspecificationisnotimplied.Exposure
to absolute maximum ratingconditionsforexternal periods mayaffect device reliability.
* All voltagevalues are referred to VSSpinvoltage.
TheNoiseMargin for both”1” and”0” levelis: 1Vmin.withVDD=5V,2 V min.withVDD=10V,2.5 V min. withVDD=15V
Input CapacitanceAny Input57.5pF
I
=-55oCforHCCdevice: -40oC for HCF device.
=+125oCforHCC device: +85oC for HCF device.
0/18
0/1515±0.3±10
Any Input
18±0.1±10-5±0.1±1µA
0/180/1818±0.4±10
0/150/1515±1.0±10
-5
±0.3±1µA
-4
±0.4±12µA
-4
±1.0±7.5µA
HIGH
Unit
*
µA
V
V
V
V
mA
mA
4/13
HCC/HCF4076B
DYNAMIC ELECTRICAL CHARACTERISTICS (T
=25oC, CL=50pF,RL= 200 KΩ,
amb
typic al tem perat ur e coefficent for all VDDvalues is 03 %/oC, all input ris e and fall times= 20 ns )
SymbolParameter
Propagation Delay Time
(Clock to Q Output)
(R)Propagation Delay Time
t
PHL
t
t
PLH
PHL
(Reset)
t
P(1-H)
t
P(0-H)
t
P(H-1)
t
P(L-1)
t
t
t
setup
t
setup
f
max
t
r,tf
3-State Output 1 or 0 to High ImpedanceRL=1KΩ5150300
3-State High Impedance to 1 or 0 OutputRL=1KΩ5150300
Clock Pulse Width5200100
W
Reset Pulse Width512060
W
Data Setup Time5200100
Data Input Disable Setup Time518090
Maximum Clock Frequency536
Clock Input Rise or Fall Time515µs
Test ConditionsValue
(V)Min.Typ.Max.
V
DD
5300600
10125250
1590180
5230460
10100200
1575150
1075150
1560120
1075150
1560120
1010050
158040
105025
154020
108040
156030
1010050
157035
10612
15816
105
155
Unit
ns
ns
ns
ns
ns
ns
ns
ns
MHz
5/13
HCC/HCF4076B
Typical Output Low (sink) Current Characteristics
Typical Output High (source) Current Characteristics
Minimum Output Low (sink) Current Characteristics
Minimum Output High (source) Current Characteristics
Typical Maximum Clock Input Frequency vs Supply Voltage
6/13
Typical Dynamic Power Dissipation vs Frequency
HCC/HCF4076B
Typical Propagation Delay Time vs Capacitance
WAV EFORMS
Typical Transition Time vs Load Capacitance
7/13
HCC/HCF4076B
TEST CIRCUITS
QuiescentDevice Current.Noise Immunity.
Input Leakage Current.
8/13
Plastic DIP16 (0.25) MECHANICAL DATA
HCC/HCF4076B
DIM.
MIN.TYP.MAX.MIN.TYP.MAX.
a10.510.020
B0.771.650.0300.065
b0.50.020
b10.250.010
D200.787
E8.50.335
e2.540.100
e317.780.700
F7.10.280
I5.10.201
L3.30.130
Z1.270.050
mminch
P001C
9/13
HCC/HCF4076B
Ceramic DIP16/1 MECHANICAL DATA
DIM.
MIN.TYP.MAX.MIN.TYP.MAX.
A200.787
B70.276
D3.30.130
E0.380.015
e317.780.700
F2.292.790.0900.110
G0.40.550.0160.022
H1.171.520.0460.060
L0.220.310.0090.012
M0.511.270.0200.050
N10.30.406
P7.88.050.3070.317
Q5.080.200
mminch
10/13
P053D
SO16 (Narrow) MECHANICAL DATA
HCC/HCF4076B
DIM.
MIN.TYP.MAX.MIN.TYP.MAX.
A1.750.068
a10.10.20.0040.007
a21.650.064
b0.350.460.0130.018
b10.190.250.0070.010
C0.50.019
c145° (typ.)
D9.8100.3850.393
E5.86.20.2280.244
e1.270.050
e38.890.350
F3.84.00.1490.157
G4.65.30.1810.208
L0.51.270.0190.050
M0.620.024
S8°(max.)
mminch
P013H
11/13
HCC/HCF4076B
PLCC20 MECHANICAL DATA
DIM.
MIN.TYP.MAX.MIN.TYP.MAX.
A9.7810.030.3850.395
B8.899.040.3500.356
D4.24.570.1650.180
d12.540.100
d20.560.022
E7.378.380.2900.330
e1.270.050
e35.080.200
F0.380.015
G0.1010.004
M1.270.050
M11.140.045
mminch
12/13
P027A
HCC/HCF4076B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability forthe
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted byimplicationor otherwise under any patentor patent rights ofSGS-THOMSON Microelectronics. Specificationsmentioned
in this publication aresubject to changewithout notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsarenotauthorizedforuse ascriticalcomponentsinlifesupportdevicesorsystemswithoutexpress
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics- All RightsReserved
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