TATIVE STANDARD No. 13A, ”STANDARD
SPECIFICATIONSFOR DESCRIPTIONOF ”B”
SERIESCMOS DEVICES”
HCC/HCF4049UB
HCC/HCF4050B
HEX BUFFER/CONVERTERS
EY
(PlasticPackage)
M1
(MicroPackage)
ORDERCODES :
HCC40XXBFHCF40XXBM1
HCF40XXBEYHCF40XXBC1
(Ceramic Frit Seal Package)
(Plastic ChipCarrier)
F
C1
DESCRI PTIO N
The HCC4049UB/4050B (extended temperature
range) and the HCF4049UB/4050B (intermediate
temperature range) are monolithic integrated circuits available in 16-lead dual in-line plastic or ceramic package andplastic micro package.
The HCC/HCF4049UB/4050B are inverting and
non-inverting hex buffers, respectively, and feature
logic-level conversion usingonlyonesupply voltage
(VDD). Theinput-signal high level(VIH) can exceed
theVDDsupplyvoltage when thesedevicesareused
for logic level conversions. These devices are intendedforuse asCOS/MOSto DTL/TTLconverters
andcandrivedirectlytwoDTL/TTLloads(VDD=5V,
VOL≤ 0.4V, and IOL≥ 3.2mA).
PIN CONNE CT I ON S
4049UB
4050B
June 1989
1/12
HCC/H CF4049UB/4050B
SCHEM ATIC D IA G RA MS ( 1 of 6 ident i c al units)
4049UB4050B
ABSOLUTE M AXI MUM RATI N GS
SymbolParameterValueUnit
V
*Supply Voltage : HCC Types
DD
HCF Types
V
Input Voltage– 0.5 to VDD+ 0.5V
i
I
DC Input Current (any one input)± 10mA
I
P
Total Power Dissipation (per package)
tot
Dissipation per Output Transistor
for Top= Full Package-temperature Range
T
Operating Tem perature : HCC Types
op
HCF Types
T
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device
reliability.