Datasheet HCF4050B, HCF4049UB Datasheet (SGS Thomson Microelectronics)

4049UB INVERT I NG TYPE
4050B NON-INVERT ING TYPE

. HIGH SINK CURRENT FOR DRIVING 2 TTL

LOADS

.HIGH-TO-LOWLEVEL LOGIC CONVERSION

.QUIESCENT CURRENT SPECIFIED TO 20V

FOR HCC DEVICE

.HIGH ”SINK” AND ”SOURCE” CURRENT CA-

PABILITY

.5V, 10VAND 15V PARAMETRIC RATINGS

.INPUTCURRENTOF100 nA AT18V AND25°C

FOR HCC DEVICE

.100% TESTEDFOR QUIESCENTCURRENT

.MEETSALLREQUIREMENTSOFJEDECTEN-

TATIVE STANDARD No. 13A, ”STANDARD
SPECIFICATIONSFOR DESCRIPTIONOF ”B”
SERIESCMOS DEVICES”

HCC/HCF4049UB

HCC/HCF4050B

HEX BUFFER/CONVERTERS

EY

(PlasticPackage)

M1

(MicroPackage)

ORDERCODES :

HCC40XXBF HCF40XXBM1
HCF40XXBEY HCF40XXBC1

(Ceramic Frit Seal Package)

(Plastic ChipCarrier)

F

C1

DESCRI PTIO N

The HCC4049UB/4050B (extended temperature
range) and the HCF4049UB/4050B (intermediate
temperature range) are monolithic integrated cir­cuits available in 16-lead dual in-line plastic or ce­ramic package andplastic micro package.

The HCC/HCF4049UB/4050B are inverting and
non-inverting hex buffers, respectively, and feature
logic-level conversion usingonlyonesupply voltage
(VDD). Theinput-signal high level(VIH) can exceed
theVDDsupplyvoltage when thesedevicesareused
for logic level conversions. These devices are in­tendedforuse asCOS/MOSto DTL/TTLconverters
andcandrivedirectlytwoDTL/TTLloads(VDD=5V,
VOL≤ 0.4V, and IOL≥ 3.2mA).

PIN CONNE CT I ON S

4049UB

4050B

June 1989

1/12

HCC/H CF4049UB/4050B

SCHEM ATIC D IA G RA MS ( 1 of 6 ident i c al units)

4049UB 4050B

ABSOLUTE M AXI MUM RATI N GS

Symbol Parameter Value Unit

V

* Supply Voltage : HCC Types

DD

HCF Types

V

Input Voltage – 0.5 to VDD+ 0.5 V

i

I

DC Input Current (any one input) ± 10 mA

I

P

Total Power Dissipation (per package)

tot

Dissipation per Output Transistor
for Top= Full Package-temperature Range

T

Operating Tem perature : HCC Types

op

HCF Types

T

Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sec­tions of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device
reliability.

*

Allvoltage values are referred to VSSpinvoltage.

Storage Temperature – 65 to + 150 °C

stg

– 0.5 to + 20
– 0.5 to + 18

200
100

– 55 to + 125

–40to+85

V
V

mW
mW

°C
°C

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Value Unit

V

T

2/12

Supply Voltage :HC C Types

DD

HCF Types

V

Input Voltage 0 to V

I

Operating Tem perature : HCC Types

op

HCF Types

3to18
3to15

DD

– 55 to + 125

–40to+85

V
V

V

°C
°C

HCC/HCF4049UB/4050B

STATIC ELECTRICAL CHARACTERISTICS (over recommended operatingconditions)

Test Conditions Value

Symbo l Parameter V

I

L

Quiescent
Supply
Current

HCC
Types

0/ 5 5 1 0.02 1 30
0/10 10 2 0.02 2 60
0/15 15 4 0.02 4 120

(V) (V) (V)

V

I

0/20 20 20 0.04 20 600

0/ 5 5 4 0.02 4 30
0/10 10 8 0.02 8 60
0/15 15 16 0.02 16 120

0/ 5 5 4.95 4.95 4.95
0/10 10 9.95 9.95 9.95

V

OH

HCF
Types

Output High
Voltage

0/15 15 14.95 14.95 14.95

V

OL

Output Low
Voltage

5/0 5 0.05 0.05 0.05
10/0 10 0.05 0.05 0.05
15/0 15 0.05 0.05 0.05

Input High

V

IH

Voltage (4049UB)

0.5 5 4 4 4
1108 8 8
21512 12 12

V

IH

Input High
Voltage (4050B)

4.5 5 3.5 3.5 3.5
9107 7 7

13.5 16 11 11 11

Input Low

V

IL

Voltage (4049UB)

4.5 5 1 1 1
910 2 2 2

13 15 3 3 3

V

IL

Input Low
Voltage (4050B)

0.5 5 1.5 1.5 1.5
110 3 3 3

1.5 15 4 4 4

Output

I

OH

Drive
Current

HCC
Types

0/ 5 2.5 5 1.6 –1.25 – 6.4 – 0.9

0/ 5 4.6 5 0.64 –0.51 – 1.6 –0.36
0/10 9.5 10 1.6 –1.30 – 3.6 – 0.9
0/15 13.5 15 4.7 –3.75 – 12 – 2.7

0/ 5 2.5 5 1.5 –1.25 – 6.4 – 1

HCF
Types

0/ 5 4.6 5 0.61 –0.51 – 1.6 –0.42
0/10 9.5 10 1.5 –1.25 – 3.6 – 1
0/15 13.5 15 4.5 –3.75 – 12 – 3

Output

I

OL

Sink
Current

HCC
Types

HCF
Types

I

IH,IIL

Input
Leakage
Current

HCC
Types

HCF
Types

C

Input

I

Capacitance

(*) T

=–55°C for HCC device : – 40°CforHCF device.

Low

T

= + 125°CforHCC device : + 85°CforHCF device.

High

The Noise Margin (only HCC/HCF4050B type) for both ”1” and ”0” level is : 1V min. with VDD= 5V, 2V min. with VDD= 10V,

2.5V min. with VDD= 15V.

4049UB
4050B

0/ 5 0.4 5 3.75 3.2 6.4 2.2
0/10 0.5 10 10 8 16 5.6
0/15 1.5 15 30 24 48 17

0/ 5 0.4 5 3.6 3.2 6.4 2.6
0/10 0.5 10 9.6 8 16 6.6
0/15 1.5 15 28 24 48 19

0/18 18 ± 0.1 ±10

0/15 15 ± 0.3 ±10

Any Input

V

O

DD

T

* 25° CT

Low

High

* Unit

Min. Max. Min. Typ. Max. Min. Max.

µA

V

V

V

V

V

V

mA

mA

–5

± 0. 1 ± 1

–5

± 0. 3 ± 1

15522.5

7.5

µA

pF

3/12

HCC/H CF4049UB/4050B

DYNAMIC ELECTRICAL CHARACTERISTICS (T

=25°C, CL= 50pF, RL= 200kΩ,

amb

typical temperature coefficient for all VDDvalues is 0.3%/°C, all input rise andfall times = 20ns)

Symbol Parameter

t

PL H

Propagation Delay Time
(4049UB)

t

PL H

Propagation Delay Time
(4050B)

t

PHL

Propagation delay Time
(4049UB)

t

PHL

Propagation Delay Time
(4050B)

t

t

TLH

THL

Transition Time 5 5 80 160

Transition Time 5 5 30 60

Test Conditions Value

V

(V) VDD(V) Min. Typ. Max.

I

5 5 60 120
10 10 32 65
10 5 45 90
15 15 25 50
15 5 45 90

5 5 70 140
10 10 40 80
10 5 45 90
15 15 30 60
15 5 40 80

55 3265
10 10 20 40
10 5 15 30
15 15 15 30
15 5 10 20

5 5 55 110
10 10 22 55
10 5 50 100
15 15 15 30
15 5 50 100

10 10 40 80
15 15 30 60

10 10 20 40
15 15 15 30

Unit

ns

ns

ns

ns

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HCC/HCF4049UB/4050B

Minimum and Maximum Voltage Transfer Charac­teristicsfor 4049UB.

TypicalVoltage Transfer Characteristics as a Func­tion ofTemperature for 4049UB.

Minimum and Maximum VoltageTransfer Charac­teristicsfor 4050B.

TypicalVoltage TransferCharacteristics asa Func­tion ofTemperature for 4050B.

TypicalOutputLow (sink)Current Characteristics. MinimumOutputLow(sink) CurrentCharacteristics.

5/12

HCC/H CF4049UB/4050B

Typical Output High (source) Current Charac­teristics.

Typical Power Dissipation per Buffer/Inverter vs.
Frequency.

Minimum Output High (source) Current Charac­teristics.

TypicalPower Dissipation vs.InputTransition Time
per Inverter for 4049UB.

TypicalPower Dissipation vs.Input Transition Time
perInverter for 4050B.

6/12

Logic-Level Conversion Application.

TEST CIRCUITS

QuiescentDevice Current. Input Voltage.

Input Current.

HCC/HCF4049UB/4050B

7/12

HCC/H CF4049UB/4050B

Plastic DIP16 (0.25) MECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

a1 0.51 0.020

B 0.77 1.65 0.030 0.065

b 0.5 0.020

b1 0.25 0.010

D 20 0.787
E 8.5 0.335

e 2.54 0.100

e3 17.78 0.700

F 7.1 0.280

I 5.1 0.201

L 3.3 0.130

Z 1.27 0.050

mm inch

8/12

P001C

HCC/HCF4049UB/4050B

Ceramic DIP16/1 MECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 20 0.787
B 7 0.276
D 3.3 0.130
E 0.38 0.015

e3 17.78 0.700

F 2.29 2.79 0.090 0.110

G 0.4 0.55 0.016 0.022

H 1.17 1.52 0.046 0.060

L 0.22 0.31 0.009 0.012

M 0.51 1.27 0.020 0.050

N 10.3 0.406
P 7.8 8.05 0.307 0.317

Q 5.08 0.200

mm inch

P053D

9/12

HCC/H CF4049UB/4050B

SO16 (Narrow) MECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 1.75 0.068
a1 0.1 0.2 0.004 0.007
a2 1.65 0.064

b 0.35 0.46 0.013 0.018

b1 0.19 0.25 0.007 0.010

C 0.5 0.019
c1 45° (typ.)

D 9.8 10 0.385 0.393

E 5.8 6.2 0.228 0.244

e 1.27 0.050

e3 8.89 0.350

F 3.8 4.0 0.149 0.157

G 4.6 5.3 0.181 0.208

L 0.5 1.27 0.019 0.050

M 0.62 0.024

S8°(max.)

mm inch

10/12

P013H

PLCC20 MECHANICAL DATA

HCC/HCF4049UB/4050B

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 9.78 10.03 0.385 0.395

B 8.89 9.04 0.350 0.356

D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022

E 7.37 8.38 0.290 0.330

e 1.27 0.050

e3 5.08 0.200

F 0.38 0.015

G 0.101 0.004
M 1.27 0.050

M1 1.14 0.045

mm inch

P027A

11/12

HCC/H CF4049UB/4050B

Information furnished is believed tobe accurate and reliable.However, SGS-THOMSON Microelectronicsassumes no responsability forthe
consequences of useof such information nor for any infringement of patents orother rights of third partieswhich may results from its use. No
license isgranted by implication or otherwiseunder any patent or patent rights ofSGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to changewithout notice. This publication supersedesand replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorized foruse ascriticalcomponentsin life support devices orsystems withoutexpress
written approval of SGS-THOMSONMicroelectonics.

 1994 SGS-THOMSON Microelectronics - All RightsReserved

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