TATIVESTANDARDN°13A,”STANDARD SPECIFICATIONS FOR DESCRIPTION OF ”B”
SERIESCMOS DEVICES”
=
EY
(Plastic Package)F(CeramicFrit Seal Package)
M1
(MicroPackage)
ORDER CODES :
HCC4030BFHCF4030BM1
HCF4030BEYHCF4030BC1
PIN CONNECTIONS
(PlasticChipCarrier)
C1
DESCRIPTION
The HCC4030B (extendedtemperature range) and
HCF4030B (intermediate temperature range) are
monolithic integrated circuit, available in 14-lead
dual in-line plastic or ceramic package and plastic
micro package.
The HCC/HCF4030B types consist of four inde-
pendent exclusive-OR gates integrated on a single
monolithic siliconchip. Eachexclusive-OR gate consistsof four n-channel andfour p-channel enhancement-type transistors. All inputs and outputs are
protected against electrostatic effects.
November1996
1/12
HCC/HCF4030B
FUNCTIONALDIAGRAM
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
*Supply Voltage : HCC Types
V
DD
HCF Types
V
Input Voltage– 0.5 to VDD+ 0.5V
i
DC Input Current (any one input)± 10mA
I
I
P
Total Power Dissipation (per package)
tot
Dissipation per Output Transistor
for T
= Full Package-temperature Range
op
T
Operating Temperature : HCC Types
op
HCF Types
T
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device
reliability.