Datasheet HCF4018B Datasheet (SGS Thomson Microelectronics)

PRESETTABLE DIVIDE-BY-N COUNTER
.MEDIUM SPEED OPERATION - 10MHz (typ.)
AT VDD–VSS= 10V
.FULLYSTATIC OPERATION
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.STANDARDIZED SYMMETRICAL OUTPUT
CHARACTERISTICS
.INPUT CURRENTOF100nA AT18VAND25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.5V, 10V,AND 15VPARAMETRIC RATINGS
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVE STANDARD No13A, ”STANDARD SPECIFICATIONS FOR DESCRIPTIONOF ”B” SERIESCMOS DEVICES”
HCC/HCF4018B
EY
(Plastic Package)F(Ceramic FritSealPackage)
M1
(MicroPackage)
ORDERCODES :
HCC4018BF HCF4018BM1 HCF4018BEY HCF4018BC1
(PlasticChip Carrier)
C1
DESCRIPTION The HCC4018B (extendedtemperature range)and
HCF4018B (intermediate temperature range) are
monolithic integrated circuit, available in 16-lead dual in-line plastic or ceramic package and plastic micropackage.
The HCC/HCF4018B types consist of 5 Johnson- Counter stages, buffered Q outputs from each stage, and counter preset control gating. CLOCK, RESET,DATA, PRESETENABLE, and5individual JAM inputs are provided. Divide by10, 8, 6, 4, or 2 counter configurations canbe implementedbyfeed­ing the Q5, Q4, Q3, Q2, Q1 signals, respectively, back to the DATAinput.
Divide-by-9,7,5, or 3 counterconfigurations can be implemented bythe useof aHCC/HCF4011Bgate package to properly gate the feedback connection to the DATA input.Divide-by-functions greaterthan 10 can be achieved by use of multiple HCC/HCF 4018B units. The counterisadvanced onecount at the positive clock-signal transition. Schmitt Trigger action on the clock line permits unlimitedclock rise and fall times. A high RESET signal clears the counter to an all-zero condition. A highPRESENT­ENABLE signal allows information on the JAM in­puts to preset the counter. Anti-lock gating is provided to assurethe proper counting sequence.
PIN CO N NECT I ONS
June1989
1/12
HCC/HFC4018B
FUNCTIONAL DIAGRAM
ABSOLUTE MAX IMU M RATI NG S
Symbol Parameter Val ue Unit
V
* Supply Voltage : HCC Types
DD
HCF Types
V
Input Voltage – 0.5 to VDD+ 0.5 V
i
I
DC Input Current (any one input) ± 10 mA
I
P
Total Power Dissipation (per package)
tot
Dissipation per Output Transistor for T
T
Operating Temperature : HCC Types
op
= Full Package-temperature Range
op
HCF Types
T
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sec­tions of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are refered to VSSpin voltage.
Storage Temperature – 65 to + 150 °C
stg
– 0.5 to + 20 – 0.5 to + 18
200 100
–55to+125
–40to+85
V V
mW mW
°C °C
RECOMMENDED OPERATING C ONDITIONS
Symbol Parameter Value Unit
V
T
2/12
Supply Voltage :HCC Types
DD
HCF Types
V
Input Voltage 0 to V
I
Operating Temperature : HCC Types
op
HCF Types
3to18 3to15
DD
– 55 t o + 125
–40to+85
V V
V
°C °C
LOGIC DIAGRAM
HCC/HCF4018B
TIMING DIAGRAM
3/12
HCC/HFC4018B
STATIC ELECTRICAL CHARACTERISTICS(under recommendedoperating conditions)
Test Conditions Valu e
Symbol Parameter
(V) (V) (µA) (V)
I
L
Quiescent Current
HCC Types
0/ 5 5 5 0.04 5 150 0/10 10 10 0.04 10 300 0/15 15 20 0.04 20 600 0/20 20 100 0.08 100 3000 0/ 5 5 20 0.04 20 150
HCF Types
0/10 10 40 0.04 40 300 0/15 15 80 0.04 80 600
V
OH
Output High Voltage
0/ 5 < 1 5 4.95 4.95 4.95 0/10 < 1 10 9.95 9.95 9.95 0/15 < 1 15 14.95 14.95 14.95
V
OL
Output Low Voltage
5/0 < 1 5 0.05 0.05 0.05 10/0 < 1 10 0.05 0.05 0.05 15/0 < 1 15 0.05 0.05 0.05
V
IH
Input High Voltage
V
IL
Input Low Voltage
I
OH
Output Drive Current
HCC Types
0/ 5 2.5 5 – 2 – 1.6 – 3.2 – 1.15 0/ 5 4.6 5 – 0.64 – 0.51 – 1 – 0.36 0/10 9.5 10 – 1.6 – 1.3 – 2.6 – 0.9 0/15 13.5 15 – 4.2 – 3.4 – 6.8 – 2.4 0/ 5 2.5 5 – 1.53 – 1.36 – 3.2 – 1.1
HCF Types
0/ 5 4.6 5 – 0.52 – 0.44 – 1 – 0.36 0/10 9.5 10 – 1.3 – 1.1 – 2.6 – 0.9 0/15 13.5 15 – 3.6 – 3.0 – 6.8 – 2.4
I
OL
Output Sink Current
HCC Types
0/ 5 0.4 5 0.64 0.51 1 0.36 0/10 0.5 10 1.6 1.3 2.6 0.9 0/15 1.5 15 4.2 3.4 6.8 2.4 0/ 5 0.4 5 0.52 0.44 1 0.36
HCF Types
0/10 0.5 10 1.3 1.1 2.6 0.9 0/15 1.5 15 3.6 3.0 6.8 2.4
I
IH,IIL
Input Leakage Current
HCC Types
HCF
0/18
0/15 15 ± 0.3 ±10
Types
C
Input Capacitance Any Input 5 7.5 pF
I
*T
=–55°CforHCC device : – 40°CforHCF device.
Low
*T
= +125°CforHCC device : + 85°CforHCF device.
High
The NoiseMargin for both ”1” and”0” levelis : 1V min. withVDD= 5V,2V min.with VDD= 10V, 2.5 V min.withVDD=15V.
V
V
I
O
|IO|V
DD
T
* 25°CT
Low
Min. Max. Min. Typ. Max. Min. Max.
0.5/4.5 < 1 5 3.5 3.5 3.5 1/9 < 1 10 7 7 7
1.5/13.5 < 1 15 11 11 11
4.5/0.5 < 1 5 1.5 1.5 1.5 9/1 < 1 10 3 3 3
13.5/1.5 < 1 15 4 4 4
18 ± 0.1 ±10–5± 0.1 ± 1
Any Input
–5
± 0.3 ± 1
High
Unit
*
µA
V
V
V
V
mA
mA
µA
4/12
HCC/HCF4018B
DYNAMIC ELECTRICAL CHARACTERISTICS (T
=25°C, CL= 50pF, RL= 200kΩ,
amb
typical temperature coefficientfor all VDDvalues is 0.3%/°C, all input rise and fall times = 20ns)
Symbol Parameter
t
PL H,tPHL
t
THL,tTL H
f
CL
t
t
r,tf
t
setup
t
Propagation Delay Time 5 200 400
Transition Time 5 100 200
Maximum Clock Input Frequency 5 3 6
Clock Input Width 5 160 80
W
Clock Input Rise or Fall Time 5
Data Input Set-up Time 5 40 20
Data Input Hold-time 5 140 70
H
PRESET* O R RESET OPERATION
t
PL H,tPHL
Propagation Delay Time (reset or reset to Q)
t
t
re m
Preset or Reset Pulse Width 5 160 80
W
Preset or Reset Removal Time 5 80 40
Test Conditions
V
(V) Min. Typ. Max.
DD
10 90 180 15 65 130
10 50 100 15 40 80
10 7 14 15 8.5 17
10 70 35 15 50 25
10 15
10 12 6 15 6 3
10 80 40 15 60 30
5 275 550 10 125 250 15 90 180
10 70 35 15 50 25
10 30 15 15 20 10
Value
Unlimited µs
At PRESET ENABLE OR JAM inputs
Unit
ns
ns
MHz
ns
ns
ns
ns
ns
ns
5/12
HCC/HFC4018B
TypicalOutputLow (sink) Current Characteristics. Typical Output high(source) Current Charac-
teristics.
Minimum Output High (source) Current Charac­teristics.
typical Output low (sink) Current Characteristics.
6/12
TYPICAL APPLICATIONS
External connections fordivide by 10, 9, 8, 7, 6, 5, 4, 3, 2 operation. DIVIDEBY 10 Q DIVIDEBY 8 Q DIVIDEBY 6 Q DIVIDEBY 4 Q DIVIDEBY 2 Q
5 4 3 2 1
CONNECTED BACKTO ”DATA”
NO CONNECTED
HCC/HCF4018B
NO EXTERNAL COMPONENTS REQUIRED
7/12
HCC/HFC4018B
Plastic DIP16 (0.25) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787 E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
mm inch
8/12
P001C
Ceramic DIP16/1 MECHANICAL DATA
HCC/HCF4018B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787 B 7 0.276 D 3.3 0.130 E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012 M 0.51 1.27 0.020 0.050 N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
mm inch
P053D
9/12
HCC/HFC4018B
SO16 (Narrow) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068 a1 0.1 0.2 0.004 0.007 a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45° (typ.)
D 9.8 10 0.385 0.393
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.62 0.024
S8°(max.)
mm inch
10/12
P013H
PLCC20 MECHANICAL DATA
HCC/HCF4018B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015 G 0.101 0.004 M 1.27 0.050
M1 1.14 0.045
mm inch
P027A
11/12
HCC/HFC4018B
Information furnished is believed tobe accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringementofpatents orother rights of third parties which may results from its use. No license isgrantedby implication orotherwiseunder any patentorpatent rights ofSGS-THOMSONMicroelectronics. Specificationsmentioned in this publication are subject to changewithout notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproductsare notauthorized foruse ascritical componentsin life supportdevices orsystemswithout express written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics - All RightsReserved
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12/12
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