Datasheet HCF4015B Datasheet (SGS Thomson Microelectronics)

DUAL 4-STAGE STATICSHIFTREGISTER WITH SERIAL

.MEDIUM SPEED OPERATION : 12MHz (typ.)

CLOCKRATE AT VDD-VSS= 10V

.FULLYSTATIC OPERATION

.8 MASTER-SLAVE FLIP-FLOPS PLUS INPUT

AND OUTPUT BUFFERING

.HIGH NOISE IMMUNITY

.QUIESCENT CURRENT SPECIFIED TO 20V

FOR HCC DEVICE

.INPUT CURRENTOF100nA AT18V AND25°C

FOR HCC DEVICE

.100% TESTEDFOR QUIESCENT CURRENT

.5V, 10V,AND 15V PARAMETRIC RATINGS

.MEETSALLREQUIREMENTSOFJEDECTEN-

TATIVE STANDARD NO. 13A, ”STANDARD
SPECIFICATIONS FOR DESCRIPTION OF”B”
SERIESCMOS DEVICES”

HCC/HCF4015B

INPUT/PARALLEL OUTPUT

EY

(Plastic Package)F(Ceramic Frit Seal Package)

M1

(MicroPackage)

ORDERCODES :

HCC4015BF HCF4015BM1
HCF4015BEY HCF4015BC1

(Plastic Chip Carrier)

C1

DESCRIPTION
TheHCC4015B(extended temperature range) and

HCF4015B (intermediate temperature range) are

monolithic integrated circuits, available in 16-lead
dual in-line plastic or ceramic package and plastic
micropackage.

TheHCC/HCF4015Bconsistsof two identical, inde-
pendent,4-stageserial-input/parallel-output registers.
Eachregister has independent CLOCK and RESET
inputsas well asa singleserialDATAinput. ”Q” out­putsareavailablefromeachofthefourstagesonboth
registers.AllregisterstagesareD-type,master-slave
flip-flops. Thelogic level present attheDATA input is
transferredintothefirstregisterstageandshiftedover
onestageateach positive-going clocktransition. Re­settingofallstagesisaccomplishedby ahighlevelon
the reset line. Register expansion to 8 stages using
one HCC/HCF4015B package, or to more than 8
stagesusingadditionalHCC/HCF4015B’sispossible.

PIN CON NECTIONS

June 1989

1/12

HCC/HCF4015B

FUNCTIONAL DIAGRAM

ABSOLUTE MAXIMU M RA TI NGS

Symbol Parame ter Val ue Unit

V

* Supply Voltage : HCC Types

DD

HCF Types

V

Input Voltage – 0.5 to VDD+ 0.5 V

i

I

DC Input Current (any one input) ± 10 mA

I

P

Total Power Dissipation (per package)

tot

Dissipation per Output Transistor
for T

T

Operating Temperature : HCC Types

op

= Full Package-temperature Range

op

HCF Types

T

Stresses above those listed under ”Absolute Maximum Ratings ”may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sec­tions of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device
reliability.
* All voltage values are referred to VSSpin voltage.

Storasge Temperature – 65 to + 150 °C

stg

– 0.5 to + 20
– 0.5 to + 18

200
100

–55to+125

–40to+85

V
V

mW
mW

°C
°C

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Value Unit

V

T

2/12

Supply Voltage : HCC Types

DD

HCF Types

V

Input Voltage 0 to V

I

Operating Temperature : HCC Types

op

HCF Types

3to18
3to15

DD

– 55 to + 125

–40to+85

V
V

V

°C
°C

LOGIC DIAGRAMS AND TRUTH TABLE

HCC/HCF4015B

CL D R Q

–

/

–
–

–

000 Q

–

/

101 Q
X0Q

\

–

1

1

(no. change)

Q

n

n–1

n–1

Qn–

XX10 0

3/12

HCC/HCF4015B

STATIC ELECTRICAL CHARACTERISTICS (overrecommended operating conditions)

Test Conditions Value

Symbol Parameter

Quiescent

I

L

Current

HCC
Types

HCF
Types

V

OH

Output High
Voltage

V

OL

Output Low
Voltage

V

IH

Input High
Voltage

V

IL

Input Low
Voltage

I

OH

Output
Drive
Current

HCC
Types

HCF
Types

I

OL

Output
Sink
Current

HCC
Types

HCF
Types

I

IH,IIL

Input
Leakage
Current

HCC
Types

HCF
Types

C

Input Capacitance Any Input 5 7.5 pF

I

*T

=–55°CforHCC device : – 40°CforHCF device.

Low

*T

=+125°C for HCC device : + 85°C for HCF device.

High

The NoiseMargin forboth ”1” and ”0” level is: 1V min.with VDD=5V, 2V min.with VDD= 10V,2.5 V min.with VDD= 15V.

V

V

O

|IO|V

I

(V) (V) (µA) (V)

DD

T

* 25° CT

Low

Min. Max. Min. Typ. Max. Min. Max.

0/ 5 5 5 0.04 5 150
0/10 10 10 0.04 10 300
0/15 15 20 0.04 20 600
0/20 20 100 0.08 100 3000

0/ 5 5 20 0.04 20 150
0/10 10 40 0.04 40 300
0/15 15 80 0.04 80 600

0/ 5 < 1 5 4.95 4.95 4.95
0/10 < 1 10 9.95 9.95 9.95
0/15 < 1 15 14.95 14.95 14.95

5/0 < 1 5 0.05 0.05 0.05
10/0 < 1 10 0.05 0.05 0.05
15/0 < 1 15 0.05 0.05 0.05

0.5/4.5 < 1 5 3.5 3.5 3.5
1/9 < 1 10 7 7 7

1.5/13.5 < 1 15 11 11 11

4.5/0.5 < 1 5 1.5 1.5 1.5
9/1 < 1 10 3 3 3

13.5/1.5 < 1 15 4 4 4
0/ 5 2.5 5 – 2 – 1.6 – 3.2 –1.15
0/ 5 4.6 5 – 0.64 – 0. 51 –1 –0.36

0/10 9.5 10 – 1.6 – 1.3 – 2.6 – 0.9
0/15 13.5 15 – 4.2 – 3.4 – 6.8 – 2.4

0/ 5 2.5 5 – 1.53 – 1. 36 –3.2 –1.1
0/ 5 4.6 5 – 0.52 – 0.44 –1 –0.36

0/10 9.5 10 – 1.3 – 1.1 – 2.6 – 0.9
0/15 13.5 15 – 3.6 – 3.0 – 6.8 – 2.4

0/ 5 0.4 5 0.64 0.51 1 0.36

0/10 0.5 10 1.6 1.3 2.6 0.9
0/15 1.5 15 4.2 3.4 6.8 2.4

0/ 5 0.4 5 0.52 0.44 1 0.36

0/10 0.5 10 1.3 1.1 2.6 0.9
0/15 1.5 15 3.6 3.0 6.8 2.4
0/18

Any Input

0/15 15 ± 0.3 ±10

18 ± 0.1 ±10–5± 0. 1 ± 1

–5

± 0. 3 ± 1

High

Unit

*

µA

V

V

V

V

mA

mA

µA

4/12

HCC/HCF4015B

DYNAMIC ELECTRICAL CHARACTERISTICS (T

=25°C, CL= 50 pF, RL= 200kΩ,

amb

typical temperature coefficient forall VDDvalues is 0.3 %/°C, all inputrise and fall times = 20ns)

Symbol Paramet e r

Test Conditions

V

(V) Min. Typ. Max.

DD

CLOCKED OPERATION

t

PLH,tPHL

Propagation Delay Time
(carry out or decoded out lines)

5160320
10 80 160
15 60 120

t

THL,tTLH

Transition Time
(carry out or decoded out lines)

5100200
10 50 100
15 40 80

f

CL

Maximum Clock Input Frequency 5 3 6

10 6 12
15 8.5 17

t

Clock Pulse Width 5 180 90

W

10 80 40
15 50 25

t

* Clock Input Rise or Fall Time 5 15

r,tf

10 15
15 15

t

se tu p

Data Setup Time 5 70 35

10 40 20
15 30 15

RESET OPERATION

t

PLH,tPHL

Propagation Delay Time 5 200 400

10 100 200
15 80 160

t

Reset Pulse Width 5 200 100

W

10 80 40
15 60 30

* Ifmorethan unitis cascaded inthe parallelclocked application, trCLshould bemade less thanorequal tothe sumof thefixed propagation delay
at 15pFand the transition time of the carry output driving stagefor the estimated capacitive load.

Value

Unit

ns

ns

MHz

ns

µs

ns

ns

ns

5/12

HCC/HCF4015B

TypicalOutputLow (sink)Current Characteristics. MinimumOutputLow(sink)CurrentCharacteristics.

Typical Output High (source) Current Charac­teristics.

TypicaltransitionTime vs. LoadCapacitance.

Minimum Output High (source) Current Charac­teristics.

Typical propagation Delay Time vs. Load Capacit­ance..

6/12

TypicalDynamic PowerDissipation vs. Frequency.

TEST CIRCUITS

HCC/HCF4015B

QuiescentDevice Current.

Input Voltage.

Input current.

Power Dissipation.

7/12

HCC/HCF4015B

Plastic DIP16 (0.25) MECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

a1 0.51 0.020

B 0.77 1.65 0.030 0.065

b 0.5 0.020

b1 0.25 0.010

D 20 0.787
E 8.5 0.335

e 2.54 0.100

e3 17.78 0.700

F 7.1 0.280

I 5.1 0.201

L 3.3 0.130

Z 1.27 0.050

mm inch

8/12

P001C

Ceramic DIP16/1 MECHANICAL DATA

HCC/HCF4015B

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 20 0.787
B 7 0.276
D 3.3 0.130
E 0.38 0.015

e3 17.78 0.700

F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060

L 0.22 0.31 0.009 0.012
M 0.51 1.27 0.020 0.050
N 10.3 0.406

P 7.8 8.05 0.307 0.317

Q 5.08 0.200

mm inch

P053D

9/12

HCC/HCF4015B

SO16 (Narrow) MECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 1.75 0.068
a1 0.1 0.2 0.004 0.007
a2 1.65 0.064

b 0.35 0.46 0.013 0.018

b1 0.19 0.25 0.007 0.010

C 0.5 0.019

c1 45° (typ.)

D 9.8 10 0.385 0.393

E 5.8 6.2 0.228 0.244

e 1.27 0.050

e3 8.89 0.350

F 3.8 4.0 0.149 0.157

G 4.6 5.3 0.181 0.208

L 0.5 1.27 0.019 0.050

M 0.62 0.024

S8°(max.)

mm inch

10/12

P013H

PLCC20 MECHANICAL DATA

HCC/HCF4015B

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 9.78 10.03 0.385 0.395

B 8.89 9.04 0.350 0.356

D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022

E 7.37 8.38 0.290 0.330

e 1.27 0.050

e3 5.08 0.200

F 0.38 0.015
G 0.101 0.004
M 1.27 0.050

M1 1.14 0.045

mm inch

P027A

11/12

HCC/HCF4015B

Information furnished is believed tobe accurate and reliable.However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringementof patents or other rights of third parties which may results from its use. No
license isgranted by implicationor otherwise underany patent or patentrights of SGS-THOMSON Microelectronics.Specificationsmentioned
in this publication are subject to changewithout notice. This publication supersedes andreplaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorizedforuse ascritical componentsin life supportdevices orsystems withoutexpress
written approval of SGS-THOMSON Microelectonics.

 1994 SGS-THOMSON Microelectronics - All RightsReserved

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