SGS Thomson Microelectronics HCF40109B Datasheet

HCC/H CF4 01 09B
QUAD LOW-TO-HIGH VOLTAGE LEVEL SHIFTER
.INDEPENDENCE OF POWER SUPPLY SE-
QUENCE CONSIDERATIONS – VCCCAN EX­CEED VDD, INPUT SIGNALS CAN EXCEED BOTHVCCAND V
DD
.UP AND DOWN LEVEL-SHIFTING CAPA-
BILITY
.THREE-STATE OUTPUTS WITH SEPARATE
ENABLECONTROLS
.STANDARDIZED SYMMETRICAL OUTPUT
CHARACTERISTICS
.QUIESCENT CURRENT SPECIFIED AT 20V
FOR HCC DEVICE
.5V, 10V,AND 15VPARAMETRIC RATINGS
.INPUT CURRENTOF100nA AT18VAND25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVE STANDARD N°. 13A, ”STANDARD SPECIFICATIONS FOR DESCRIPTIONOF ”B” SERIESCMOS DEVICES”
DESCRIPTION
The HCC40109B (extended temperature range) and HCF40109B (intermediate temperaturerange) are monolithic integrated circuits, available in 16­lead dual in-line plastic or ceramic package and plastic micropackage. The HCC/HCF40109B con- tains four low-to-high-voltage level-shifting circuits. Eachcircuitwill shift a low-voltagedigital-logic input signal(A, B,C, D) withlogical 1 = VCCand logical 0 =VSStoa higher-voltage output signal(E, F, G, H) with logical 1 = VDDand logical 0 = VSS. The HCC/HCF40109B, unlike other low-to-high level­shiftingcircuits, doesnotrequirethepresence ofthe high-voltage supply (VDD) before the application of eitherthe low-voltage supply (VCC)or the input sig­nals. There are no restrictions on the sequence of application of VDD,VCC, or the input signals. In ad­dition, there are no restrictionson the relative mag­nitudesodthesupplyvoltagesorinput signalswithin the devicemaximumratings ;VCCmayexceedVDD, and input signals may exceed VCC, andVDD. When operated in the mode V HCC/HCF40109B, will operate as a high-to-low level-shifter. The HCC/HCF 40109B also features individual three-state output capability. A low level on any ofthe separately enabledthree-state output
CC
VDD, the
controls produces a high-impedance state in the corresponding output.
EY
(Plastic Package)
C1
(Micropackage)
HCC40109BF HCF40109BM1 HCF40109BEY HCF40109BC1
PIN CON NEC TI ONS
(Ceramic Frit SealPackage)
ORDER CODES :
(Plastic ChipCarrier)
F
C1
June 1989
1/12
HCC/HCF40109B
FUNCTIONAL DIAGRAM
1 of4 units
ABSOLUTE MAXI MU M RA TINGS
Symbol Parameter Val ue Unit
* Supply Voltage :HC C Types
V
DD
HCF Types
V
Input Voltage – 0.5 to VDD+ 0.5 V
i
I
DC Input Current (any one input) ± 10 mA
I
P
Total Power Dissipation (per package)
tot
Dissipation per Output Transistor for T
T
Operating Temperature : HCC Types
op
= Full Package-temperature Range
op
HCF Types
T
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltageare with respect to VSS(GND).
Storage Temperature – 65 to + 150 °C
stg
– 0.5to + 20 – 0.5to + 18
200 100
–55to+125
–40to+85
V V
mW mW
°C °C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
V
T
LOGIC DIAGRAM
2/12
Supply Voltage : HCC Types
DD
HCF Types
V
Input Voltage 0 to V
I
Operating Temperature : HCC Types
op
HCF Types
TRUTH TABLE
Mode
Low to High Level Shift
LOGIC 0 = LOW (VSS) X = Don’t Care.
LOGIC 1 = VCCat INPUTS and VDDat OUTPUTS.
3to18 3to15
DD
– 55 to + 125
–40to+85
Inputs Outputs
Enable
A, B, C , D
A,B,C,D E,F,G,H
01 0 11 1 X0Z
Z = High Impedance.
V V
V
°C °C
HCC/HCF40109B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions Value
Symbol Parameter
I
Quiescent
L
Current
HCC Types
V
V
I
(V)
(V)
0/ 5 5 1 0.02 1 30 0/10 10 2 0.02 2 60 0/15 15 4 0.02 4 120
|
V
|I
O
O
(µA)
(V)
CC
V
(V)
DD
0/20 20 20 0.04 20 600
0/ 5 5 4 0.02 4 30
HCF Types
0/10 10 8 0.02 8 60 0/15 15 16 0.02 16 120
V
OH
Output High Voltage
0/ 5 < 1 5 4.95 4.95 4.95 0/10 < 1 10 9.95 9.95 9.95 0/15 < 1 15 14.95 14.95 14.95
V
OL
Output Low Voltage
5/0 < 1 5 0.05 0.05 0.05 10/0 < 1 10 0.05 0.05 0.05 15/0 < 1 15 0.05 0.05 0.05
V
V
I
Input High Voltage 1/9 < 1 5 10 3.5 3.5 3.5
IH
1.5/13.5
Input Low Voltage 1/9 < 1 5 10 1.5 1.5 1.5
IL
1.5/13.5
OH
Output Drive Current
HCC Types
0/ 5 2.5 5 – 2 – 1.6 – 3.2 – 1.15 0/ 5 4.6 5 – 0.64 – 0.51 – 1 – 0.36
0/10 9.5 10 – 1.6 – 1.3 – 2.6 – 0.9
< 1 10 15 7 7 7
< 1 10 15 3 3 3
0/15 13.5 15 – 4.2 – 3.4 – 6.8 – 2.4
0/ 5 2.5 5 – 1.53 – 1.36 – 3.2 – 1.1
HCF Types
0/ 5 4.6 5 – 0.52 – 0.44 – 1 – 0.36 0/10 9.5 10 – 1.3 – 1.1 – 2.6 – 0.9 0/15 13.5 15 – 3.6 – 3.0 – 6.8 – 2.4
I
OL
Output Sink Current
HCC Types
0/ 5 0.4 5 0.64 0.51 1 0.36 0/10 0.5 10 1.6 1.3 2.6 0.9 0/15 1.5 15 4.2 3.4 6.8 2.4
0/ 5 0.4 5 0.52 0.44 1 0.36
HCF Types
0/10 0.5 10 1.3 1.1 2.6 0.9 0/15 1.5 15 3.6 3.0 6.8 2.4
I
IH,IIL
*T
Low
*T
High
TheNoise Margin for both”1” and”0” levelis: 1V min.withVDD=5V, 2V min.with VDD= 10V,2.5V min. withVDD= 15V.
** Forcedoutput disabled.
Input Leakage Current
=–55°C for HCC device : – 40°C for HCF device.
= + 125°C for HCC device : + 85°C for HCF device.
HCC Types
HCF Types
0/18 18 ± 0.1 ± 10
0/15
15 ± 0.3 ± 10
*25°CT
T
Low
Min Max. Min. Typ. Max. Min. Max.
-5
± 0.1 ± 1
-5
± 0.3 ± 1
High
Unit
*
µA
V
V
V
V
mA
mA
µAAny Input
3/12
HCC/HCF40109B
STATIC ELECTRICAL CHARACTERISTICS(continued)
Test Conditions Value
Symbol Parameter
I
,
OH
IOL**
3-State Output Leakage Current
Input Capacitance Any Input 5 7.5 pF
C
I
*T
=–55°C for HCC device : – 40°C for HCF device.
Low
*T
= + 125°C for HCC device : + 85°C for HCF device.
High
TheNoise Margin for both”1” and”0” levelis: 1V min.withVDD=5V, 2V min.with VDD= 10V,2.5V min. withVDD= 15V.
** Forcedoutput disabled.
HCC Types
HCF Types
V
V
I
IO VCCV
O
(V) (V) (V) (V) (V)
T
DD
*25°CT
Low
Min. Max. Min. Typ. Max. Min. Max.
0/18 0/18 18 ± 0.4 ±10
0/15 0/15 15 ± 1.0 ±10
-4
± 0.4 ± 12
-4
± 1.0 ± 7.5
High
Unit
*
µA
DYNAMIC ELECTRICAL CHARACTERISTICS(T
=25°C, CL= 50pF, RL= 200k,
amb
typical temperature coefficient for all VDDvalues is 0.3%/°C, all input rise and fall time = 20ns)
Symbol Parameter Shifting Mode
,
t
t
PHL PLH
Propagation Delay Time (data input to output) High to Low Level
L-H
H-L
Low to High Level
L-H
H-L
t
PHZ
3-State Disable Delay Time Output High to High Impedance
L-H
H-L
t
PZ H
High Impedance to Output High
L-H
H-L
t
PLZ
Output Low to High Impedance
L-H
H-L
Test Conditions Value V
(V) VDD(V) Min. Typ. Max.
CC
5 10 300 600
5 15 220 440 10 15 180 360 10 5 850 1600 15 5 850 1600 15 10 290 580
5 10 130 260
5 15 120 240 10 15 70 140 10 5 230 460 15 5 230 460 15 10 80 160
5 10 60 120
5 15 50 100 10 15 35 70 10 5 120 240 15 5 120 240 15 10 40 80
5 10 320 640
5 15 230 460 10 15 180 360 10 5 800 1500 15 5 800 1500 15 10 280 560
5 10 370 740
5 15 300 600 10 15 250 500 10 5 850 1600 15 5 850 1600 15 10 350 700
Unit
ns
ns
ns
ns
ns
4/12
HCC/HCF40109B
DYNAMIC ELECTRICAL CHARACTERISTICS(continued)
Symbol Parameter Shifting Mode
t
PZL
High Impedance to Output Low
L-H
H-L
,
t t
THL TLH
Transition Time
L-H
H-L
OutputLow (sink)Current Characteristics. Output High(source) Current Characteristics.
Test Conditions Value V
(V) VDD(V) Min. Typ. Max.
CC
5 10 100 200
5 15 80 160 10 15 40 80 10 5 120 240 15 5 120 240 15 10 40 80
5 10 50 100
515 4080 10 15 40 80 10 5 100 200 15 5 100 200 15 10 50 100
Unit
ns
ns
Typical Transition Timevs. LoadCapacitance. Typical High-to-low Propagation DelayTime vs.
Load Capacitance.
5/12
HCC/HCF40109B
TypicalLow-to-high Propagation Delay Timevs. Load Capacitance.
High-level Supply Voltage vs. Low-level Supply Voltage.
TypicalInput Switching vs. High-level SupplyVolt­age.
Typical Dynamic Power Dissipation vs. Input Fre­quency.
TEST CIRCUITS
OutputEnable Delay Times Test Circuit and Waveforms.
6/12
TEST CIRCUITS (continued) QuiescentDevice Current. Input Voltage.
Input Leakage Current. Dynamic Power Dissipation.
HCC/HCF40109B
7/12
HCC/HCF40109B
Plastic DIP16 (0.25) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787 E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
mm inch
8/12
P001C
Ceramic DIP16/1 MECHANICAL DATA
HCC/HCF40109B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787 B 7 0.276 D 3.3 0.130 E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012 M 0.51 1.27 0.020 0.050 N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
mm inch
P053D
9/12
HCC/HCF40109B
SO16 (Narrow) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068 a1 0.1 0.2 0.004 0.007 a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45° (typ.)
D 9.8 10 0.385 0.393
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.62 0.024
S8°(max.)
mm inch
10/12
P013H
PLCC20 MECHANICAL DATA
HCC/HCF40109B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015 G 0.101 0.004 M 1.27 0.050
M1 1.14 0.045
mm inch
P027A
11/12
HCC/HCF40109B
Information furnished is believed tobe accurateand reliable.However, SGS-THOMSON Microelectronicsassumes no responsability forthe consequences of use of such information nor for any infringementof patents or other rights of third partieswhich mayresults from its use.No license isgranted by implicationor otherwise underany patent or patentrights of SGS-THOMSONMicroelectronics. Specificationsmentioned in this publication are subject to changewithout notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproductsare notauthorizedforuse ascritical componentsinlife supportdevices orsystems withoutexpress written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics - All RightsReserved
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