SGS Thomson Microelectronics HCF4006B Datasheet

18-STAGESTATIC SHIFT REGISTER
. PERMANENT REGISTER STORAGE WITH
CLOCKLINE ”HIGH”OR ”LOW” ...NO INFOR­MATION RECIRCULATION REQUIRED
.FULLYSTATIC OPERATION
.SHIFTINGRATES UP TO12MHz @ 10V (typ.)
CHARACTERISTICS
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.INPUTCURRENTOF100nA AT18VAND25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.5V, 10V, AND 15V PARAMETRIC RATING
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVESTANDARDN°13A,”STANDARDSPE­CIFICATIONS FOR DESCRIPTION OF ”B” SERIESCMOS DEVICES”
HCC/HCF4006B
EY
(Plastic Package)
M1
(MicroPackage)
ORDERCODES :
HCC4006BF HCF4006BM1 HCF4006BEY HCF4006BC1
(Ceramic FritSeal Package)
F
C1
(Plastic Chip Carrier)
DESC RIPTIO N
TheHCC4006B(extended temperature range) and the HCF4006B (standard temperature range), are monolithic integrated circuits, available in 14-lead dual in-line plastic or ceramic package and plastic micro package. The types are comprised of 4 sep­arate ”shift register” sections ; two sections of four stagesand twosections offivestageswithan output tap at the fourth stage. Each section has an inde­pendent”single rail”datapath.Acommonclocksig­nal is usedfor allstages. Datais shifted to thenext stage on negative-going transitions of the clock. Throughappropriate connectionsof inputsandout­puts, multiple register sections of 4, 5, 8, and 9 stages or single register sections of 10, 12, 13, 14, 16, 17 and 18 can be implemented using one HCC/HCF4006B package. Longer shift register sectionscanbe assembled byusing more than one HCC/HCF4006B. To facilitate cascading stages when clock rise and fall times areslow, an optional output(D1+4’) that is delayed one-half clock-cycle, is provided (see truth tablefor output from pin 2).
PIN CONNEC TI O NS
June1989
1/11
HCC/HCF4006B
FUNCTIONAL DIAGRAM
ABSOLUTE M AXI MUM RATIN G S
Symbol Parameter Value Unit
V
* Supply Voltage : HCC Types
DD
HCF Types
V
Input Voltage – 0.5 to VDD+ 0.5 V
i
I
DC Input Current (any one input) ± 10 mA
I
P
Total Power Dissipation (per package)
tot
– 0.5 to + 20 – 0.5 to + 18
200
V V
mW Dissipation per Output Transistor for Top= Full Package-temperature Range
T
Operating Temperature : HCC Types
op
HCF Types
T
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sec­tions of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability.
Storage Temperature – 65 to + 150 °C
stg
100
– 55 to + 125
–40to+85
mW
°C °C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
V
T
Supply Voltage : HCC Types
DD
HCF Types
V
Input Voltage 0 to V
I
Operating Temperature : HCC Types
op
HCF Types
3to18 3to15
DD
– 55 to + 125
–40to+85
V V
V
°C °C
2/11
LOGI C DI AG R AM AND TRU TH TABLES ( on e re gister st age)
HCC/HCF4006B
TRUTH TABLE FOR OUTPUT FROM PIN 2
– –
/
/ \
D1+4’
NC
D1+4 CL
0 1
X
0 1
TRUTH TABLE FOR SHIFT REGISTER STAGE
DCL
0 1
X
1 = HIGH 0 = LOW NC = NO CHANGE
\
\
– –
/
X = DON’T CARE = LEVEL CHANGE
D+1
0 1
NC
3/11
HCC/HCF4006B
STATIC ELECTRICAL CHARACTERISTICS (overrecommended operating conditions)
Test Conditions Value
Symbol Parameter
I
Quiescent
L
Current
HCC Types
HCF Types
V
OH
Output High Voltage
V
OL
Output Low Voltage
V
IH
Input High Voltage
V
IL
Input Low Voltage
I
OH
Output Drive Current
HCC Types
HCF Types
I
Output
OL
Sink Current
HCC Types
HCF Types
I
IH,IIL
Input Leakage Current
HCC Types
HCF Types
C
Input Capacitance Any Input 5 7.5 pF
I
*T *T
TheNoise Margin for both”1” and ”0” levelis : 1V min.withVDD=5V, 2V min.withVDD= 10V,2.5 V min.with VDD= 15V.
=–55°CforHCC device : – 40°CforHCF device.
Low
= + 125°CforHCC device : + 85°CforHCF device.
High
V
V
O
|IO|V
I
(V) (V) (µA) (V)
DD
T
* 25° CT
Low
Min. Max. Min. Typ. Max. Min. Max.
0/ 5 5 5 0.04 5 150 0/10 10 10 0.04 10 300 0/15 15 20 0.04 20 600 0/20 20 100 0.08 100 3000
0/ 5 5 20 0.04 20 150 0/10 10 40 0.04 40 300 0/15 15 80 0.04 80 600
0/ 5 < 1 5 4.95 4.95 4.95 0/10 < 1 10 9.95 9.95 9.95 0/15 < 1 15 14.95 14.95 14.95
5/0 < 1 5 0.05 0.05 0.05 10/0 < 1 10 0.05 0.05 0.05 15/0 < 1 15 0.05 0.05 0.05
0.5/4.5 < 1 5 3.5 3.5 3.5 1/9 < 1 10 7 7 7
1.5/13.5 < 1 15 11 11 11
4.5/0.5 < 1 5 1.5 1.5 1.5 9/1 < 1 10 3 3 3
13.5/1.5 < 1 15 4 4 4
0/ 5 2.5 5 – 2 – 1.6 – 3.2 –1.15
0/ 5 4.6 5 – 0. 64 – 0. 51 – 1 – 0.36 0/10 9.5 10 – 1.6 – 1.3 – 2.6 – 0.9 0/15 13.5 15 – 4.2 – 3.4 – 6.8 – 2.4
0/ 5 2.5 5 – 1. 53 – 1. 36 – 3.2 – 1. 1
0/ 5 4.6 5 – 0. 52 – 0. 44 – 1 – 0.36 0/10 9.5 10 – 1.3 – 1.1 – 2.6 – 0.9 0/15 13.5 15 – 3.6 – 3.0 – 6.8 – 2.4
0/ 5 0.4 5 0.64 0.51 1 0.36 0/10 0.5 10 1.6 1.3 2.6 0.9 0/15 1.5 15 4.2 3.4 6.8 2.4
0/ 5 0.4 5 0.52 0.44 1 0.36 0/10 0.5 10 1.3 1.1 2.6 0.9 0/15 1.5 15 3.6 3.0 6.8 2.4
0/18
Any Input
0/15 15 ± 0.3 ±10
18 ± 0.1 ± 10–5± 0. 1 ± 1
–5
± 0. 3 ± 1
High
Unit
*
µA
V
V
V
V
mA
mA
µA
4/11
HCC/HCF4006B
DYNAMIC ELECTRICAL CHARACTERISTICS (T
=25°C, CL= 50pF, RL= 200kΩ,
amb
typical temperature coefficient forall VDDvalues is 0.3%/°C, all input rise and fall times = 20ns)
Symbol Parameter
t
PLH,tPHL
Propagation Delay Time 5 200
Test Conditions
V
(V) Min. Typ. Max.
DD
10 100 15 80
t
THL,tTLH
Transition Time 5 100
10 50 15 40
t
Clock Pulse Width 5 100
w
10 45 15 30
t
r,tf
Clock Input Rise or Fall Time* 5 15
10 15 15 15
t
se tu p
Data Setup Time 5 50
10 25 15 20
f
max
Maximum Clock Input Frequency 5 5
10 12 15 16
*
If more than unit is cascaded trCLshould be made less thanor equal to the sum ofthe transition timeand the fixed propagation delay of the outputof the drivingstagefor the estimatedcapacitive load.
Value
Unit
MHz
ns
ns
ns
µs
ns
TypicalOutput Low (sink) Current Characteristics.
Minimum Output Low(sink) Current Charac­teristics.
5/11
HCC/HCF4006B
TypicalOutput High (source) Current Charac­teristics.
TEST CIR CUI TS
QuiescentDevice Current.
Minimum Output High (source)Current Charac­teristics.
Input Voltage.
Input Current.
6/11
Plastic DIP14 MECHANICAL DATA
HCC/HCF4006B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 1.39 1.65 0.055 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 15.24 0.600
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 2.54 0.050 0.100
mm inch
P001A
7/11
HCC/HCF4006B
Ceramic DIP14/1 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787 B 7.0 0.276
D 3.3 0.130
E 0.38 0.015
e3 15.24 0.600
F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012 M 1.52 2.54 0.060 0.100 N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
mm inch
8/11
P053C
SO14 MECHANICAL DATA
HCC/HCF4006B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068 a1 0.1 0.2 0.003 0.007 a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45° (typ.)
D 8.55 8.75 0.336 0.344
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 7.62 0.300
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.68 0.026
S8°(max.)
mm inch
P013G
9/11
HCC/HCF4006B
PLCC20 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015 G 0.101 0.004 M 1.27 0.050
M1 1.14 0.045
mm inch
10/11
P027A
HCC/HCF4006B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability forthe consequences of useof such information nor forany infringement of patents or other rightsof third parties which may results from its use. No license isgranted byimplication or otherwise underany patent or patent rights ofSGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to changewithout notice. This publication supersedes andreplaces all information previously supplied. SGS-THOMSON Microelectronicsproductsare notauthorized for use ascritical componentsinlife supportdevices orsystemswithout express written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics- All RightsReserved
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11/11
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