SGS Thomson Microelectronics ETL9444 Datasheet

4-BIT NMOS MICROCONTROLLERS
.LOWCOST
.POWERFUL INSTRUCTIONSET
.2k x8 ROM, 128 x 4 RAM
.23 I/OLINES (ETL9444)
TART
.THREE-LEVELSUBROUTINESTACK
.16µs INSTRUCTIONTIME
.SINGLESUPPLYOPERATION(4.5-6.3V)
.LOWCURRENT DRAIN(13mA max.)
.INTERNALTIME-BASECOUNTER FORREAL-
TIMEPROCESSING
.INTERNAL BINARY COUNTER REGISTER
WITHMICROWIRESERIALI/O CAPABILITY
.GENERALPURPOSE AND TRI-STATE
PUTS
OUT-
.LSTTL/CMOSCOMPATIBLEIN AND OUT
.DIRECTDRIVEOFLEDDIGITAND SEGMENT
LINES
.SOFTWARE/HARDWARE COMPATIBLE
WITHOTHER MEMBERSOF ET9400 FAMILY
.EXTENDED TEMPERATURE RANGE DE-
VICES ETL9344/L9345 (– 40°Cto+85°C)
.WIDERSUPPLYRANGE (4.5 – 9.5V)
OPTIONALLY AVAILABLE
.SOIC 24/28 AND PLCC 28 PACKAGES AVAI-
LABLE
DESCRIPTION
The ETL9444/L9445 and ETL9344/L9345 Single­Chip N-Channel Microcontrollers are fully compati­ble with the COPSfamily, fabricated using N-channel,silicongateXMOStechnology. Theyare complete microcomputers containing all system ti­ming, internal logic,ROM, RAMand I/O necessary to implement dedicated control functionsin avariety of applications. Featuresinclude single supply ope­ration,avarietyof outputconfiguration options, with an instruction set, internal architecture and I/O scheme designed to facilitate keyboard input, dis­play output and BCD data manipulation. The ETL9445isidenticalto theETL9444, exceptwith19 I/O lines instead of 23 : They are an appropriate choicefor use innumerous humaninterface control environments. Standard test procedures and relia­ble high-density fabrication techniques provide the medium to large volume customerswith a customi-
ETL9444/ETL9445 ETL9344/ETL9345
ETL9444/ETL9344
N
(PlasticPackage)
ETL93 45/ETL9345
N
(PlasticPackage)
PIN CONNECTION
May1989
1/27
ETL9444/9445–ETL9344/9345
zed controller oriented processor at a low end-pro­duct cost.
Figure 1 : BlockDiagram (28-pin version).
The ETL9344/L9345 are exact functional equiva­lents, but extended temperature range versions of theETL9444/L9445 respectively.
2/27
ETL9444/9445–ETL9344/9345
ETL944 4/L9445
ABSOLUTE M AXI MUM RATI NG S
Symbol Paramet e r Valu e Unit
Voltage at any Pin Relative to GND – 0.5 to + 10 V Ambient Operating Temperature 0 to + 70 °C Ambient Storage Temperature – 65 to + 150 °C Lead Temperature (soldering, 10 seconds) 300 °C Power Dissipation 0.75W at 25°C
0.4W at 70°C Total Source Current 120 mA Total Sink Current 120 mA
Absolute maximum ratings indicate limits beyond whichdamage to the device mayoccur. DC and AC electrical specifications are not en­sured when operating the device at absolute maximum ratings.
DC ELECTRICAL CHARACTERISTICS 0°C TA≤ +70°C, 4.5V VCC≤ 9.5V (unless otherwise specified)
Parameter Test Conditions Min. Max. Unit
Standard Operating Voltage (V Optional Operating Voltage (V Power Supply Ripple Operating Supply Current
Input Voltage Levels
CKI Input Levels
Crystal Input (÷ 32, ÷ 16, ÷ 8)
Logic High (V Logic Low (V
)
IH
)
IL
Schmitt Trigger Input (÷ 4)
Logic High (VIH) Logic Low (V
)
IL
RESET Input Levels
Logic High
Logic Low SO Input Level (test mode) All Other Inputs
Logic High
Logic High
Logic Low
Logic High
Logic Low
Input Capacitance Hi-Z Input Leakage
Output Voltage Levels
LSTTL Operation
Logic High (V
OH
)
Logic Low (VOL)
CMOS Operation
Logic High
Logic Low
Note : 1. VCCvoltagechange must be less than 0.5V in a 1ms period to maintain proper operation.
CC
CC
)
Note 1
)
Peak to Peak All Inputs and Outputs Open
Schmitt Trigger Input
V
= Max.
CC
With TTL trip level options selected, V
CC
With high trip level options selected.
VCC=5V±5% IOH=–25µA IOL= 0.36mA
I
=–10µA
OH
IOL=+10µA
=5V±5%.
4.5
4.5
2.0
– 0.3
0.7 V
CC
– 0.3
0.7 V
CC
– 0.3
2.0
3.0
2.0
– 0.3
3.6
– 0.3
–1
2.7
VCC–1
6.3
9.5
0.5 13
0.4
0.6
0.6
2.5
0.8
1.2
7
+1
0.4
0.2
V V V
mA
V V
V V
V V V
V V V V
V pF µA
V
V
V
V
3/27
ETL9444/9445–ETL9344/9345
ETL944 4/L9445 DC ELECTRICAL CHARACTERISTICS (continued)
Parameter Test Conditions Min. Max. Unit
Output Current Levels
Output Sink Current
SO and SK Outputs (I
L
Outputs and Standard
0-L7
G
0-G3,D0-D3
Outputs (IOL)
OL
)
G0-G3and D0-D3Outputs with High Current Options (I
G
and D0-D3Outputs with
0-G3
OL
)
Very High Current Options (IOL) CKI (single-pin RC oscillator)
CKO
Output Source Current
Standard Configuration, All Outputs (I
OH
)
Push-pull Configuration SO and SK Outputs (I
LED Configuration, L0-L
OH
)
7
Outputs, Low Current Driver Option (IOH) LED Configuration, L
0-L7
Outputs, High Current Driver Option (IOH) TRI-STATEConfiguration, L
Outputs, Low
0-L7
Current Driver Option (I
OH
) TRI-STATEConfiguration, L0-L7Outputs, High Current Driver Option (I
OH
)
Input Load Source Current CKO Output
RAM Power Supply Option Power Requirement V
TRI-STATEOutput Leakage Current – 2.5 + 2.5
Total Sink Current Allowed
All Outputs Combined D, G Ports L
7-L4
L3-L
0
All Other Pins
Total Source Current Allowed
All I/O Combined L
7-L4
L3-L
0
Each L Pin All Other Pins
V
= 9.5V, VOL= 0.4V
CC
VCC= 6.3V, VOL= 0.4V V
= 4.5V, VOL= 0.4V
CC
VCC= 9.5V, VOL= 0.4V V
= 6.3V, VOL= 0.4V
CC
VCC= 4.5V, VOL= 0.4V VCC= 9.5V, VOL= 1.0V V
= 6.3V, VOL= 1.0V
CC
VCC= 4.5V, VOL= 1.0V V
= 9.5V, VOL= 1.0V
CC
VCC= 6.3V, VOL= 1.0V VCC= 4.5V, VOL= 1.0V V
= 4.5V, VIH= 3.5V
CC
VCC= 4.5V, VOL= 0.4V V
= 9.5V, VOH= 2.0V
CC
VCC= 6.3V, VOH= 2.0V V
= 4.5V, VOH= 2.0V
CC
VCC= 9.5V, VOH= 4.75V V
= 6.3V, VOH= 2.4V
CC
VCC= 4.5V, VOH= 1.0V V
= 9.5V, VOH= 2.0V
CC
VCC= 6.0V, VOH= 2.0V V
= 9.5V, VOH= 2.0V
CC
VCC= 6.0V, VOH= 2.0V V
= 9.5V, VOH= 5.5V
CC
VCC= 6.3V, VOH= 3.2V V
= 4.5V, VOH= 1.5V
CC
VCC= 9.5V, VOH= 5.5V VCC= 6.3V, VOH= 3.2V V
= 4.5V, VOH= 1.5V
CC
VCC= 5.0V, VIL=0V
= 3.3V 6.0
R
1.8
1.2
0.9
0.8
0.5
0.4 15 11
7.5 30 22 15
2
0.2
–140
–75
–30 – 1.4 – 1.4 – 1.2
– 1.5 – 1.5
– 3.0 – 3.0
– 0.75
– 0.8 – 0.9 – 1.5 – 1.6 – 1.8
–10
–800 –480 –250
–140
–18 –13
–35 –25
120 120
4 4
1.5
120
60 60 30
1.5
mA mA mA mA mA mA mA mA mA mA mA mA mA mA
µA µA µA
mA mA mA
mA mA
mA mA mA mA mA mA mA mA
µA
mA
µA
mA mA mA mA mA
mA mA mA mA mA
4/27
ETL9444/9445–ETL9344/9345
ETL934 4/L9345
ABSOLUTE M AXI MUM RATI NG S
Symbol Paramet e r Valu e Unit
Voltage at any Pin Relative to GND – 0.5 to + 10 V Ambient Operating Temperature – 40 to + 85 °C Ambient Storage Temperature – 65 to + 150 °C Lead Temperature (soldering, 10 seconds) 300 °C Power Dissipation 0.75W at 25°C
0.25W at 85°C Total Source Current 120 mA Total Sink Current 120 mA
Absolute maximum ratings indicate limits beyond whichdamage to the device mayoccur. DC and AC electrical specifications are not en­sured when operating the device at absolute maximum ratings.
DC ELECTRICAL CHARACTERISTICS –40°CTA≤+85°C, 4.5V VCC≤ 7.5V (unless otherwise specified)
Parameter Test Conditions Min. Max. Unit
Standard Operating Voltage (V Optional Operating Voltage (V Power Supply Ripple Operating Supply Current
Input Voltage Levels
CKI Input Levels
Crystal Input
Logic High (V Logic Low (V
)
IH
)
IL
Schmitt Trigger Input
Logic High (VIH) Logic Low (V
)
IL
RESET Input Levels
Logic High
Logic Low SO Input Level (test mode) All Other Inputs
Logic High
Logic High
Logic Low
Logic High
Logic Low
Input Capacitance Hi-Z Input Leakage
Output Voltage Levels
LSTTL Operation
Logic High (V
OH
)
Logic Low (VOL)
CMOS Operation
Logic High
Logic Low
Note : 1. VCCvoltagechange must be less than 0.5V in a 1ms period to maintain proper operation.
CC
CC
)
Note 1
)
Peak to Peak All Inputs and Outputs Open
Schmitt Trigger Input
V
= Max.
CC
With TTL trip level options selected, V
CC
With high trip level options selected
VCC=5V±5% IOH=–20µA IOL= 0.36mA
I
=–10µA
OH
IOL=+10µA
=5V±5%
4.5
4.5
2.2
– 0.3
0.7 V
CC
– 0.3
0.7 V
CC
– 0.3
2.2
3.0
2.2
– 0.3
3.6
– 0.3
–2
2.7
VCC–1
5.5
7.5
0.5 15
0.3
0.4
0.4
2.5
0.6
1.2
7
+2
0.4
0.2
V V V
mA
V V
V V
V V V
V V V V
V pF µA
V
V
V
V
5/27
ETL9444/9445–ETL9344/9345
ETL934 4/L9345 DC ELECTRICAL CHARACTERISTICS (continued)
Parameter Test Conditions Min. Max. Unit
Output Current Levels
Output Sink Current
SO and SK Outputs (I
L
Outputs and Standard
0-L7
G
0-G3,D0-D3
G
and D0-D3Outputs with
0-G3
Outputs (IOL)
OL
)
High Current Options (IOL) G
and D0-D3Outputs with
0-G3
Very High Current Options (IOL) CKI (single-pin RC oscillator)
CKO
Output Source Current
Standard Configuration, All Outputs (I
OH
)
Push-pull Configuration SO and SK Outputs (I
LED Configuration, L
OH
0-L7
)
Outputs, Low Current Driver Option (IOH) LED Configuration, L
0-L7
Outputs, High Current Driver Option (IOH) TRI-STATEConfiguration, L
Outputs, Low
0-L7
Current Driver Option (I
OH
) TRI-STATEConfiguration, L0-L7Outputs, High Current Driver Option (I
OH
)
Input Load Source Current CKO Output
RAM Power Supply Option Power Requirement V
TRI-STATEOutput Leakage Current –5 +5
Total Sink Current Allowed
All Outputs Combined D. G Ports L
7-L4
L3-L
0
All Other Pins
Total Source Current Allowed
All I/O Combined L
7-L4
L3-L
0
Each L Pin All Other Pins
V
= 7.5V, VOL= 0.4V
CC
V
= 5.5V, VOL= 0.4V
CC
VCC= 4.5V, VOL= 0.4V VCC= 7.5V, VOL= 0.4V V
= 5.5V, VOL= 0.4V
CC
VCC= 4.5V, VOL= 0.4V V
= 7.5V, VOL= 1.0V
CC
VCC= 5.5V, VOL= 1.0V VCC= 4.5V, VOL= 1.0V V
= 7.5V, VOL= 1.0V
CC
VCC= 5.5V, VOL= 1.0V V
= 4.5V, VOL= 1.0V
CC
VCC= 4.5V, VIH= 3.5V VCC= 4.5V, VOL= 0.4V
V
= 7.5V, VOH= 2.0V
CC
V
= 5.5V, VOH= 2.0V
CC
VCC= 4.5V, VOH= 2.0V VCC= 7.5V, VOH= 3.75V V
= 5.5V, VOH= 2.0V
CC
VCC= 4.5V, VOH= 1.0V V
= 7.5V, VOH= 2.0V
CC
VCC= 6.0V, VOH= 2.0V VCC= 5.5V, VOH= 2.0V V
= 7.5V, VOH= 2.0V
CC
VCC= 6.0V, VOH= 2.0V VCC= 5.5V, VOH= 2.0V V
= 7.5V, VOH= 4.0V
CC
VCC= 5.5V, VOH= 2.7V V
= 4.5V, VOH= 1.5V
CC
VCC= 7.5V, VOH= 4.0V VCC= 5.5V, VOH= 2.7V V
= 4.5V, VOH= 1.5V
CC
VCC= 5.0V, VIL=0V
= 3.3V 8.0
R
1.4
1.0
0.8
0.6
0.5
0.4 12
9
7 24 18 14
2
0.2
–100
–55 –28
– 0.85
– 1.1 – 1.2 – 1.4 – 1.4 – 0.7 – 2.7 – 2.7 – 1.4 – 0.7 – 0.6 – 0.9 – 1.4 – 1.2 – 1.8
–10
–900 –600 –350
–200
–27 –17 –15 –54 –34 –30
120 120
4 4
1.5
120
60 60 30
1.5
mA mA mA mA mA mA mA mA mA mA mA mA mA mA
µA µA µA
mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
µA
mA
µA
mA mA mA mA mA
mA mA mA mA mA
6/27
ETL9444/9445–ETL9344/9345
AC ELECTRICAL CHARACTERISTICS ETL9444/L9445 : 0°C TA≤ +70°C, 4.5V VCC≤9.5V (unless otherwise specified) ETL9344/L9345 : –40°CTA≤+85°C, 4.5V VCC≤7.5V (unless otherwise specified)
Parameter Test Conditions Min. Max. Unit
Instruction Cycle Time – t
c
CKI
Input Frequency – f
I
Duty Cycle Rise Time Fall Time
CKI Using RC (÷ 4)
Instruction Cycle Time
CKO as SYNC Input
t
SYNC
INPUTS : IN
-IN0,G3-G0,L7-L
3
t
SETUP
t
HOL D
0
SI
t
SETUP
t
HOL D
OUTPUT PROPAGATION DELAY SO, SK Outputs
t
pd1,tpd0
All Other Outputs
t
pd1,tpd0
÷ 32 Mode ÷ 16 Mode ÷ 8Mode ÷4Mode
f
= 2MHz
I
R = 56k± 5% C=100pF±10%
Test Condition : CL= 50pF, RL= 20k,V
OUT
= 1.5V
16
0.8
0.4
0.2
0.1 30
16
400
40
2.0
1.0
0.5
0.25 60
120
80
28
8.0
1.3
2.0
1.0
4.0
5.6
µs
MHz MHz MHz MHz
% ns ns
µs ns
µs µs
µs µs
µs µs
7/27
ETL9444/9445–ETL9344/9345
Figure 2 : Connection Diagrams.
Pin Description
L
7-L0
G
3-G0
D
3-D0
IN
-IN
3
SI Serial Input (or counter input) SO Serial Output (or general purpose output) SK Logic-controlled Clock (or general purpose output)
CKI System Oscillator Input
CKO System Oscillator Output (or general purpose input, RAM power supply, or SYNC input)
RESET System Reset Input
V
CC
GND Ground
8 Bidirectional I/O Ports with TRI-STATE 4 Bidirectional I/O Ports 4 General Purpose Outputs 4 General Purpose Inputs (COP444L only)
0
Power Supply
Figure 3 : Input/output Timing Diagrams (crystal divide-by-16 mode).
8/27
Figure 3a: Synchronization Timing.
ETL9444/9445–ETL9344/9345
FUN CTI ON AL DESCRIPTI ON
A blockdiagram ofthe ETL9444is given in figure 1. Data pathsare illustratedinsimplified formto depict how the various logic elements communicate with eachotherin implementing the instructionsetof the device. Positive logic is used. Whena bit is set,it is a logic”1”(greater than 2volts).Whena bit isreset, it is a logic ”0” (less than 0.8volts).
Allfunctional referencesto theETL9444/L9445 also apply tothe ETL9344/L9345.
PROGRAM MEMORY Program Memory consists ofa 2048 byteROM. As
can be seen by an examination of the ETL9444/L9445 instructionset,thesewordsmaybe programinstructions, programdataorROMaddres­singdata.Becauseof thespecialcharacteristics as­sociated with the JP, JSRP, JID, and LQID instructions,ROMmust oftenbe thoughtofas being organized into 32 pages of 64 wordseach.
ROM addressing isaccomplishedby a11-bit PCre­gister. Its binaryvalueselects oneof the 2048 8-bit words contained in ROM. A newaddress is loaded into the PC register during each instruction cycle. Unlesstheinstruction isa transfer of controlinstruc­tion, thePC registeris loaded withthenext sequen­tial 11-bit binary count value. Three levels of subroutine nesting are implemented by the 11-bit subroutine save registers, SA, SB, and SC ; provi­ding a last-in, first-out (LIFO)hardware subroutine stack.
ROM instruction words are fetched, decoded and executed by the Instruction Decode, Control and Skip Logiccircuitry.
DATA MEMORY Data memoryconsistsof a 512-bit RAM,organized
as 8 data registers of 16 4-bit digits. RAM addres­sing is implemented by a 7-bit B register whose up­per 3 bits (Br) select1 of 8 data registers andlower 4 bits (Bd) select 1 of 16 4-bit digitsin theselected dataregister.Whilethe4-bit contentsofthe selected
RAM digit (M) is usually loaded into or from, or ex­changed with, the A register (accumulator), it may also be loaded into or fromthe Qlatches or loaded fromthe L ports. RAM addressing may alsobe per­formeddirectlybythe LDDandXADinstructionsba­sed upon the 7-bit contents of the operand field of these instructions. The Bd registeralso serves asa source register for 4-bit data sent directly to the D outputs.
INTERNALLOGIC The 4-bit Aregister(accumulator) isthe source and
destination register for most I/O, arithmetic, logic and datamemoryaccess operations. Itcan alsobe usedto loadtheBr andBdportions oftheB register, to load and input 4 bitsof the 8-bitQ latch data, to input 4bitsof the8-bit L I/Oportdataandto perform data exchanges with the SIO register.
A4-bitadderperforms thearithmetic andlogicfunc­tions,storing its results in A. It also outputs a carry bitto the 1-bitC register, mostoftenemployed toin­dicate arithmetic overflow. The C register, in conjunction with the XAS instruction and the ENre­gister, also serves to control the SK output. C can be outputted directly to SK or can enableSK to be a sync clockeach instructioncycle time. (See XAS instruction andEN register description, below).
Four general-purpose inputs, IN3-IN0, are provided. The D register provides 4 general-purpose outputs
and is used as the destination register for the 4-bit contents of Bd. The D outputs can be directly connectedtothe digitsofa multiplexed LED display.
The G register contents are outputs to 4 general­purpose bidirectional I/O ports. G I/O ports can be directly connected tothe digits ofa multiplexedLED display.
The Q register is an internal, latched, 8-bit register, usedto hold data loaded to or fromM and A,aswell as 8-bit data from ROM. Its contentsare output to theL I/OportswhentheLdriversareenabledunder program control(See LEIinstruction).
9/27
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