SGS Thomson Microelectronics ETC5057N, ETC5057FN, ETC5057D, ETC5054N, ETC5054FN Datasheet

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ETC5054 ETC5057
SERIAL INTERFACECODEC/FILTER
COMPLETE CODEC AND FILTERING SYS­TEM (DEVICE)INCLUDING: – Transmithigh-passand low-pass filtering. – Receivelow-passfilterwith sin x/x correction. – ActiveRC noise filters – µ-laworA-lawcompatibl eCOderandDECoder . – Internalprecisionvoltage reference. – SerialI/O interface. – Internalauto-zerocircuitry.
A-LAW 16 PINS (ETC5057FN,20 PINS) µ-LAW WITHOUT SIGNALING, 16 PINS
(ETC5054FN,20 PINS) MEETS OR EXCEEDS ALL D3/D4 AND
CCITT SPECIFICATIONS
±
5V OPERATION
LOW OPERATING POWER - TYPICALLY 60 mW
POWER-DOWN STANDBY MODE - TYPI­CALLY 3 mW
AUTOMATIC POWER-DOWN TTL OR CMOS COMPATIBLE DIGITAL IN-
TERFACES MAXIMIZES LINE INTERFACE CARD CIR-
CUIT DENSITY 0to70°C OPERATION
DESCRIPTION
The ETC5057/ETC5054 family consists of A-law and µ–law monolithic PCM CODEC/filters utilizing the A/D and D/A conversionarchitectureshown in the block diagram below, and a serial PCM inter­face. The devices are fabricated using double­poly CMOS process. The encode portion of each device consists of an input gain adjust amplifier, an active RC pre-filter which eliminates very high frequency noise prior to entering a switched-ca­pacitor band-pass filter that rejects signals below 200 Hz and above 3400 Hz. Also included are auto-zerocircuitry and a compandingcoder which samples the filtered signal and encodes it in the companded A-law orµ–law PCM format. The de­code portion of each device consists of an ex­panding decoder, which reconstructs the analog signal from the companded A-law or µ–law code, a low-pass filter which corrects for the sin x/x re­sponse of the decoder output and rejects signals above 3400 Hz and is followed by a single-ended power amplifier capable of driving low impedance loads. The devices require 1.536 MHz, 1.544
MHz, or 2.048 MHz transmit and receive master clocks, which may be asynchronous,transmit and receive bit clocks which may vary from 64 kHz to
2.048 MHz, and transmit and receive frame sync pulses. The timing of the frame sync pulses and PCM data is compatible with both industry stand­ard formats.
This is advanced information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
March 2000
DIP16 (Plastic)
ORDERING NUMBERS:
ETC5057N ETC5054N
SO16 (Wide)
ORDERING NUMBERS:
ETC5057D ETC5054D
PLCC20
ORDERING NUMBERS:
ETC5057FN ETC5054FN
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PIN CONNECTIONS (Topview)
DIP and SO
PLCC
BLOCKDIAGRAM
ETC5054 - ETC5057
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PIN DESCRIPTION
Name
Pin
Type
*
N
°
DIP and
SO
N
°
PLCC
(**)
Function Description
V
BB
S 1 1 Negative
Power Supply
VBB=–5V±5%.
GNDA GND 2 2 Analog Ground All signals are referenced to this pin.
VF
R
O O 3 3 Receive Filter
Output
Analog Output of the Receive Filter
V
CC
S 4 5 Positive Power
Supply
VCC=+5V±5%.
FS
R
I 5 6 Receive Frame
Sync Pulse
Enables BCLKRto shift PCM data into DR.FSRis an 8kHz pulse train. See figures 1, 2 and 3 for timing details.
D
R
I 6 7 Receive Data
Input
PCM data is shifted into DRfollowing the FSRleading edge.
BCLK
R
/CLKSEL I 7 8 Shift-inClock Shifts data into DRafter the FSRleading edge. May
vary from 64 kHz to 2.048 MHz. Alternatively, may be a logic input which selects either 1.536 MHz/1.544 MHz or 2.048 MHz for master clock in synchronous mode and BCLK
X
is used for both transmit and receive directions (see table 1). This input has an internal pull­up.
MCLKR/PDN I 8 9 Receive Master Clock Must be 1.536 MHz, 1.544 MHz or 2.048 MHz. May be
asynchronous with MCLK
X
, but should be
synchronous with MCLK
X
for best performance. When
MCLK
R
is connected continuously low, MCLKXis
selected for all internal timing. When MCLK
R
is connected continuously high, the device is powered down.
MCLK
X
I 9 12 TransmitMaster Clock Must be 1.536 MHz, 1.544 MHz or 2.048 MHz. May be
asynchronous with MCLK
R
.
BCLK
XI
10 14 Shift-out Clock Shifts out the PCM data on DX. May vary from 64 kHz
to 2.048 MHz, but must be synchronous with MCLK
X
.
D
X
O 11 15 Transmit
Data Output
The TRI-STATEPCM data output which is enabled by FS
X
.
FS
X
I 12 16 Transmit Frame
Sync Pulse
Enables BCLKXto shift out the PCM data on DX.FSXis an 8 kHz pulse train. See figures 1, 2 and 3 for timing details.
TS
X
O 13 17 Transmit Time Slot Open drain output which pulses low during the encoder
time slot. Recommended to be grounded if not used.
GS
X
O 14 18 Gain Set Analog output of the transmit input amplifier. Used to
set gain externally.
VF
X
I
I 15 19 Inverting Amplifier
Input
Inverting Input of the Transmit Input Amplifier.
VF
X
I
+
I 16 20 Non-inverting Amplifier
Input
Non-inverting Input of the Transmit Input Amplifier.
(*) I: Input, O: Output,S: Power Supply (**) Pins 4,10,11 and 13 are not connected TRI-STATEis a trademark of NationalSemiconductor Corp.
ETC5054 - ETC5057
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FUNCTIONAL DESCRIPTION
POWER-UP When power is first applied, power-on reset cir-
cuitry initializes the device and places it into the power-down mode. All non-essential circuits are deactivatedand the D
X
and VFRO outputs are put in high impedance states. To power-up the device, a logical low level or clock must be ap­plied to the MCLK
R
/PDN pin and FSXand/or FS
R
pulses must be present. Thus, 2 power-down control modes are available. The first is to pull the MCLK
R
/PDN pin high ; the alternative is to hold
both FS
X
and FSRinputs continuously low. The device will power-down approximately 2 ms after the last FS
X
or FSRpulse. Power-up will occur on
the first FS
X
or FSRpulse. The TRI-STATE PCM
data output, D
X
, will remain in the high impedance
state until the secondFS
X
pulse.
SYNCHRONOUS OPERATION For synchronous operation, the same master
clock and bit clock should be used for both the transmit and receive directions. In this mode, a clock must be applied to MCLK
X
and the
MCLK
R
/PDN pin can be used as a power-down
control. A low level on MCLK
R
/PDN powers up the device and a high level powers down the de­vice. In either case, MCLK
X
will be selected as the master clock for both the transmit and receive circuits.A bit clock must also be applied to BCLK
X
and the BCLKR/CKSEL can be used to select the proper internal divider for a master clock of 1.536 MHz, 1.544 MHz or 2.048 MHz. For 1.544 MHz operation, the device automatically compensates for the 193rd clock pulse each frame. With a fixed level on the BCLK
R
/CLKSEL pin, BCLKXwill be selected as the bit clock for both the transmit and receive directions. Table 1 indicates the frequen­cies of operation which can be selected, depend­ing on the state of BCLK
R
/CLKSEL. In this syn-
chronous mode, the bit clock, BCLK
X
, may be from 64 kHz to 2.048 MHz, but must be synchro­nous with MCLK
X
.
Each FS
X
pulse begins the encoding cycle and the PCM data from the previous encode cycle is shifted out of the enabled D
X
output on the posi-
tive edge of BCLK
X
. After 8 bit clock periods, the
TRI-STATE D
X
output is returned to a high im-
pedance state. With and FS
R
pulse, PCM data is
latched via the D
R
input on the negative edge of
BCLK
X
(or BCLKRif running). FSXand FSRmust
be synchronouswith MCLK
X/R
.
ASYNCHRONOUSOPERATION For asynchronous operation, separate transmit
and receive clocks may be applied, MCLK
X
and
MCLK
R
must be 2.048 MHz for the ETC5057, or
1.536 MHz, 1.544 MHz for the ETC5054, and need not be synchronous. For best transmission performance, however, MCLK
R
should be syn-
chronous with MCLK
X
, which is easily achieved by applying only static logic levels to the MCLK
R
/PDN pin. This will automatically connect
MCLK
X
to all internal MCLKRfunctions (see pin description).For 1.544 MHz operation, the device automatically compensates for the 193rd clock pulse each frame. FS
X
startseach encoding cycle
and must be synchronous with MCLK
X
and
BCLK
X
.FSRstartseach decoding cycle and must
be synchronous with BCLK
R
. BCLKRmust be a clock, the logic levels shown in table 1 are not valid in asynchronous mode. BCLK
X
and BCLK
R
may operate from 64 kHz to 2.048 MHz.
SHORTFRAME SYNC OPERATION The device can utilize either a short frame sync
pulse or a long frame sync pulse. Upon power in­itialization, the device assumes a short frame mode. In this mode, both frame sync pulses, FS
X
and FSR, must be one bit clock period long, with timing relationships specifiedin figure 2. With FS
X
high during a falling edge of BCLKXthe next ris­ing edge of BCLK
X
enables the DXTRI-STATE output buffer, which will output the sign bit. The followingseven rising edges clock out the remain­ing seven bits, and the next falling edge disables the D
X
output.With FSRhigh during a fallingedge
of BCLK
R
(BCLKXin synchronous mode), the
next falling edge of BCLK
R
latchesin the sign bit. The following seven falling edges latch in the seven remaining bits. Both devices may utilize the short frame sync pulse in synchronous or asyn­chronousoperatingmode.
LONGFRAME SYNC OPERATION To use the long frame mode, both the frame sync
pulses, FS
X
and FSR, must be three or more bit clock periodslong, with timing relationships speci­fied in figure 3. Basedon the transmit frame sync, FS
X
, the device will sense whether short or long frame sync pulses are being used. For 64 kHz op­eration,the frame sync pulse must be kept low for a minimum of 160 ns (see fig. 1). The D
X
TRI­STATE output buffer is enabled with the rising edge of FS
X
or the rising edge of BCLKX, which­ever comes later, and the first bit clocked out is the sign bit. The following seven BCLK
X
rising
Table 1:SelectionofMasterClockFrequencies.
BCLKR/CLKSEL
Master Clock Frequency
Selected
ETC5057 ETC5054
Clocked 0
1 (or open circuit)
2.048 MHz
1.536 MHz or
1.544 MHz
2.048 MHz
1.536 MHz or
1.544 MHz
2.048 MHz
1.536 MHz or
1.544 MHz
ETC5054 - ETC5057
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edges clock out the remaining seven bits. The D
X
output is disabled by the falling BCLKXedge fol­lowing the eighth rising edge, or by FS
X
going low, which-evercomes later. A rising edge on the receive frame sync pulse, FS
R
, will cause the
PCM data at D
R
to be latched in on the next eight
falling edges of BCLK
R
(BCLKXin synchronous mode). Both devices may utilize the long frame sync pulse in synchronous or asynchronous mode.
TRANSMITSECTION The transmit sectioninput is an operational ampli-
fier with provision for gain adjustment using two external resistors, see figure6. The low noise and wide bandwidth allow gains in excess of 20 dB across the audio passband to be realized. The op amp drives a unitygain filter consisting of RD ac­tive pre-filter, followed by an eighth order switched-capacitorbandpassfilter clocked at 256 kHz. The outputof this filter directly drives the en­coder sample-and-holdcircuit. The A/D is of com­panding type according to A-law (ETC5057)or µ– law (ETC5054) coding conventions. A precision voltage reference is trimmed in manufacturing to provide an input overload (t
MAX
) of nominally2.5V peak (see table of transmission characteristics). The FS
X
frame sync pulse controls the sampling
of the filter output, and then the successive-ap-
proximation encoding cycle begins. The 8-bit code is then loaded into a buffer and shifted out through D
X
at the next FSXpulse. The total en­coding delay will be approximately 165 µs (due to the transmit filter) plus 125µs (due to encoding delay), which totals 290µs. Any offset vol-tage due to the filters or comparator is cancelled by sign bit integration.
RECEIVESECTION The receive section consists of an expanding
DAC which drives a fifth order switched-capacitor low pass filter clocked at 256 kHz. The decoder is A-law (ETC5057) or µ–law (ETC5054) and the 5th order low pass filter corrects for the sin x/x at­tenuation due to the 8 kHz sample and hold. The filter is then followedby a2nd order RC ac­tive post-filterand power amplifier capable of driv­ing a 600load to a level of 7.2 dBm. The re­ceive section is unity-gain.Upon the occurenceof FS
R
, the data at the DRinput is clocked in on the
falling edge of the next eight BCLK
R
(BCLKX)pe­riods. At the end of the decoder time slot, the de­coding cycle begins, and 10µs later the decoder DAC output is updated. The total decoder delay is∼10µs (decoder update) plus 110µs (filter delay) plus 62.5µs (1/2 frame), which gives ap- proximately 180µs. A mute circuitry is a active during 10ms when power up.
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CC
VCCto GNDA 7 V
V
BB
VBBto GNDA – 7 V
V
IN,VOUT
Voltage at any AnalogInput or Output VCC+ 0.3 to VBB– 0.3 V Voltage at Any Digital Input or Output V
CC
+ 0.3 to GNDA – 0.3 V
T
oper
Operating Temperature Range – 25 to + 125
°
C
T
stg
Storage Temperature Range – 65 to + 150
°
C
Lead Temperature (soldering, 10 seconds) 300
°
C
ELECTRICALOPERATING CHARACTERISTICS VCC= 5.0 V ± 5%, VBB= – 5.0 V ± 5%GNDA= 0 V, T
A
=0°Cto70°C; Typical Characteristics Specifiedat VCC=5.0 V, VBB= – 5.0 V, TA=25°C ; all signals
are referenced to GNDA.
Symbol Parameter Min. Typ. Max. Unit
V
IL
Input Low Voltage 0.6 V
V
IH
Input High Voltage 2.2 V
V
OL
Output Low Voltage I
L
= 3.2mA D
X
IL= 3.2mA, Open Drain TS
X
0.4
0.4
V V
V
OH
Output High Voltage I
H
= 3.2mA D
X
2.4 V
I
IL
Input Low Current (GNDA VIN≤ VIL, all digital inputs) –10 10 µA
I
IH
Input High Current (VIH≤ VIN≤ VCC) except BCLKR/BCLKSEL –10 10 µA
I
OZ
Output Current in HIGH Impedance State (TRI-STATE) (GNDA V
O
VCC)D
X
–10 10 µA
ETC5054 - ETC5057
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ANALOG INTERFACEWITH TRANSMIT INPUT AMPLIFIER (all devices)
Symbol Parameter Min. Typ. Max. Unit
I
I
XA Input Leakage Current VFXI+or VFXI
-
(–2.5V V +2.5V)
– 200 200 nA
R
I
XA Input Resistance VFXI+or VFXI
-
(–2.5V≤V≤+2.5V)
10 M
R
O
XA OutputResistance (closed loop, unity gain) 1 3
R
L
XA Load Resistance GS
X
10 k
C
L
XA Load Capacitance GS
X
50 pF
V
O
XA Output Dynamic Range (R
L
10KΩ)GS
X
±
2.8 V
AV
X
A Voltage Gain (VFXI+to GSX) 5000 V/V
F
U
XA Unity Gain Bandwidth 1 2 MHz
V
OS
XA Offset Voltage – 20 20 mV
V
CM
XA Common-mode Voltage – 2.5 2.5 V CMRRXA Common-mode Rejection Ratio 60 dB PSRRXA Power Supply Rejection Ratio 60 dB
ANALOG INTERFACEWITH RECEIVE FILTER (all devices)
Symbol Parameter Min. Typ. Max. Unit
R
O
RF OutputResistance VFRO13
R
L
RF Load Resistance (VFRO=±2.5V) 600
C
L
RF Load Capacitance 500 pF
VOS
R
O Output DC Offset Voltage – 200 200 mV
POWERDISSIPATION(all devices)
Symbol Parameter Min. Typ. Max. Unit
I
CC
0 Power-down Current 0.5 1.5 mA
I
BB
0 Power-down Current 0.05 0.3 mA
I
CC
1 ActiveCurrent 6.0 9.0 mA
I
BB
1 Active Current 6.0 9.0 mA
ETC5054 - ETC5057
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