SGS Thomson Microelectronics BZW06-8V5B, BZW06-8V5, BZW06-85B, BZW06-85, BZW06-70B Datasheet
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BZW06-5V8/376
®
FEATURES
PEAK PULSE POWER : 600 W (10/1000µs)
■
STAND-OFF VOLTAGE RANGE :
■
From 5.8V to 376 V
UNI AND BIDIRECTIONAL TYPES
■
LOW CLAMPING FACTOR
■
FAST RESPONSE TIME
■
UL RECOGNIZED
■
DESCRIPTION
Transil diodes provide high overvoltage protection
by clamping action. Their instantaneous response
to transient overvoltages makes them particularly suited to protect voltage sensitive devices
such as MOS Technology and low voltage supplied IC’s.
BZW06-5V8B/376B
TRANSIL
DO-15
TM
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25°C)
Symbol Parameter Value Unit
P
I
FSM
T
T
P
T
PP
stg
j
L
Peak pulse power dissipation (see note 1) Tj initial = Tamb
Power dissipation on infinite heatsink T
Non repetitive surge peak forward current
for unidirectional types
= 75°C
amb
tp = 10ms
Tj initial = T
amb
Storage temperature range
Maximum junction temperature
Maximum lead temperature for soldering during 10s a 5mm
600 W
1.7 W
100 A
-65to+175
175
230 °C
from case.
Note 1 :For a surge greater than the maximum values, the diode will fail in short-circuit.
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
R
th (j-l)
th (j-a)
Junction to leads
Junction to ambient on printed circuit. L
lead
=10mm
60 °C/W
100 °C/W
°C
°C
February 2003 - Ed : 3A
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BZW06-xx
ELECTRICAL CHARACTERISTICS (T
amb
= 25°C)
I
I
F
Symbol Parameter
V
RM
V
BR
V
CL
I
RM
I
PP
αT
V
F
Unidirectional Bidirectional µAV VmAV A VA10
BZW06-5V8 BZW06-5V8B
BZW06-6V4 BZW06-6V4B
BZW06-8V5 BZW06-8V5B
BZW06-10 BZW06-10B
BZW06-13 BZW06-13B
BZW06-15 BZW06-15B
BZW06-19 BZW06-19B
BZW06-20 BZW06-20B
BZW06-23 BZW06-23B
BZW06-26 BZW06-26B
BZW06-28 BZW06-28B
BZW06-31 BZW06-31B
BZW06-33 BZW06-33B
BZW06-40 BZW06-40B
BZW06-48 BZW06-48B
BZW06-58 BZW06-58B
BZW06-70 BZW06-70B
BZW06-85 BZW06-85B
BZW06-102 BZW06-102B
BZW06-128 BZW06-128B
BZW06-154 BZW06-154B
BZW06-171 BZW06-171B
Stand-off voltage
Breakdown voltage
Clamping voltage
Leakage current @ V
RM
Peak pulse current
Voltage temperature coefficient
Forward voltage drop
Types IRM@V
max min max max max typ
1000 5.8 6.45 10 10.5 57.0 13.4 298 5.7 4000
RM
500 6.4 7.13 10 11.3 53.0 14.5 276 6.1 3700
10 8.5 9.5 1 14.5 41 18.6 215 7.3 2800
5 10.2 11.4 1 16.7 36.0 21.7 184 7.8 2300
5 12.8 14.3 1 21.2 28.0 27.2 147 8.4 1900
1 15.3 17.1 1 25.2 24.0 32.5 123 8.8 1600
1 18.8 20.9 1 30.6 19.6 39.3 102 9.2 1350
1 20.5 22.8 1 33.2 18.0 42.8 93 9.4 1250
1 23.1 25.7 1 37.5 16.0 48.3 83 9.6 1150
1 25.6 28.5 1 41.5 14.5 53.5 75 9.7 1075
1 28.2 31.4 1 45.7 13.1 59.0 68 9.8 1000
1 30.8 34.2 1 49.9 12.0 64.3 62 9.6 950
1 33.3 37.1 1 53.9 11.1 69.7 57 10.0 900
1 40.2 44.7 1 64.8 9.3 84 48 10.1 800
1 47.8 53.2 1 77.0 7.8 100 40 10.3 700
1 58.1 64.6 1 92.0 6.5 121 33 10.4 625
1 70.1 77.9 1 113 5.3 146 27.0 10.5 550
1 85.5 95.0 1 137 4.4 178 22.5 10.6 500
1 102 114 1 165 3.6 212 19.0 10.7 450
1 128 143 1 207 2.9 265 15.0 10.8 400
1 154 171 1 246 2.4 317 12.6 10.8 360
1 171 190 1 274 2.2 353 11.3 10.8 350
VV
CLVBR
V
VBR@IRVCL@I
RM
PP
I
RM
I
PP
VCL@I
V
F
PP
note2 10/1000µs 8/20µs note3 note4
V
αTC
-4
/°C pF
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BZW06-xx
Types I
RM@VRM
VBR@
I
R
VCL@I
PP
VCL@I
PP
αTC
min max max max typ
note2 10/1000µs 8/20µs note3 note4
-4
Unidirectional Bidirectional µAVVmAVAVA10
BZW06-188 BZW06-188B
BZW06-213 BZW06-213B
BZW06-256 BZW06-256B
BZW06-273 BZW06-273B
BZW06-299 BZW06-299B
BZW06-342 BZW06-342B
BZW06-376 BZW06-376B
1 188 209 1 328 2.0 388 10.3 10.8 330
1 231 237 1 344 2.0 442 9.0 11.0 310
1 256 285 1 414 1.6 529 7.6 11.0 290
1 273 304 1 438 1.6 564 7.1 11.0 280
1 299 332 1 482 1.6 618 6.5 11.0 270
1 342 380 1 548 1.3 706 5.7 11.0 360
1 376 418 1 603 1.3 776 5.7 11.0 350
/°C pF
Fig. 1: Peak pulse power dissipation versus initial
junction temperature (printed circuit board).
%I
PP
100
50
10 s
PULSE WAVEFORM 10/1000 s
0
1000 s
Note 2 : Pulse test: tp<50ms.
Note 3 : ∆VBR= αT*(T
Note 4 : VR= 0 V, F = 1 MHz. For bidirectional types,
capacitance value is divided by 2
- 25)*VBR(25°C)
amb
t
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BZW06-xx
Fig. 2 : Peak pulse power versus exponential pulse duration.
Ppp (W)
1E5
1E4
1E3
1E2
1E1
0.001 0.01 0.1 1 10 100
Fig. 3 : Clamping voltage versus peak pulse current.
Exponential waveform t
=20µs________
p
= 1 ms——————-
t
p
= 10 m...............
t
p
Tj initial = 25øC
tp (mS) EXPO.
°
Note : The curves of the figure 3 are specified for a junction temperature of 25°C before surge.
The given results may be extrapolated for other junction temperatures by using the following formula :
∆V
= αT*(T
BR
-25)*VBR(25°C).
amb
For intermediate voltages, extrapolate the given results.
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BZW06-xx
Fig. 4a : Capacitance versus reverse applied
voltage for unidirectional types (typical values).
Fig. 5 : Peak forward voltage drop versus peak forward current (typical values for unidirectional
types).
Fig. 4b : Capacitance versus reverse applied
voltage for bidirectional types (typical values).
Fig. 6 : Transient thermal impedance junction ambient versus pulse duration (For FR4 PC Board
with L
lead = 10mm).
Fig. 7 : Relative variation of leakage current versus junction temperature.
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BZW06-xx
ORDER
600W
BZW 06 - 10 B RL
PACKAGING:
‘ ‘ = Ammopack tape
‘RL’= Tape & reel
STAND-OFF VOLTAGE
BIDIRECTIONAL
No suffix: Unidirectional
MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only).
PACKAGE MECHANICAL DATA
DO-15 (Plastic)
REF. DIMENSIONS
A
CC
Millimeters Inches
Min. Max. Min. Max.
A 6.05 6.75 0.238 0.266
B 2.95 3.53 0.116 0.139
D
B
C 26 31 1.024 1.220
D 0.71 0.88 0.028 0.035
Packaging: standardpackaging is intape and reel.
Weight = 0.4 g.
Informationfurnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
useof such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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