Datasheet BTB16-800B, BTB16-700B, BTB16-600B, BTB16-400B, BTA16-800B Datasheet (SGS Thomson Microelectronics)

...
BTA16 B BTB16 B
March 1995
STANDARDTRIACS
Symbol Parameter Value Unit
I
T(RMS)
RMS on-state current (360° conduction angle)
I
TSM
Non repetitive surge peak on-state current ( Tj initial = 25°C)
tp = 8.3 ms 170 A
tp = 10 ms 160
I2tI
2
t value tp = 10 ms 128 A2s
dI/dt Critical rate of rise of on-state current
Gate supply : IG= 500mA diG/dt = 1A/µs
Repetitive F = 50 Hz
10 A/µs
Non
Repetitive
50
Tstg
Tj
Storage and operating junction temperature range - 40 to + 150
- 40 to + 125
°C °C
Tl Maximum lead temperature for soldering during 10 s at 4.5 mm
from case
260 °C
TO220AB
(Plastic)
A1
A2
G
.HIGHSURGECURRENT CAPABILITY
.COMMUTATION : (dV/dt)c>10V/µs
.BTA Family :
INSULATINGVOLTAGE= 2500V
(RMS)
(ULRECOGNIZED: E81734)
DESCRIPTION
Symbol Parameter BTA / BTB16-... B Unit
400 600 700 800
V
DRM
V
RRM
Repetitive peak off-state voltage Tj = 125 °C
400 600 700 800 V
ABSOLUTE RATINGS (limitingvalues)
FEATURES
The BTA/BTB16 B triac family are high perform­ance glass passivated PNPN devices. These parts are suitables for general purpose ap­plications where high surge current capability is re­quired. Application such as phase control and static switching on inductive or resistive load.
1/5
GATECHARACTERISTICS (maximum values)
Symbol Parameter Value Unit
Rth (j-a) Junction to ambient 60 °C/W
Rth (j-c) DC Junction to case for DC BTA 2.9 °C/W
BTB 2.3
Rth (j-c) AC Junction to case for 360° conduction angle
( F= 50 Hz)
BTA 2.2 °C/W BTB 1.75
Symbol Test Conditions Quadrant Suffix Unit
B
I
GT
VD=12V (DC) RL=33 Tj=25°C I-II-III MAX 50 mA
IV MAX 100
V
GT
VD=12V (DC) RL=33 Tj=25°C I-II-III-IV MAX 1.5 V
V
GD
VD=V
DRMRL
=3.3k Tj=125°C I-II-III-IV MIN 0.2 V
tgt VD=V
DRMIG
= 500mA
dIG/dt = 3A/µs
Tj=25°C I-II-III-IV TYP 2 µs
I
L
IG=1.2 I
GT
Tj=25°C I-III-IV TYP 40 mA
II 70
IH*I
T
= 500mA gate open Tj=25°C MAX 50 mA
VTM*ITM= 22.5A tp= 380µs Tj=25°C MAX 1.6 V
I
DRM
I
RRM
V
DRM
Rated
V
RRM
Rated
Tj=25°C MAX 0.01 mA
Tj=125°C MAX 2
dV/dt * Linear slope up to VD=67%V
DRM
gate open
Tj=125°C MIN 250 V/µs
(dV/dt)c * (dI/dt)c = 7A/ms Tj=125°C MIN 10 V/µs
* For either polarity of electrode A2voltage with reference to electrode A1.
P
G (AV)
=1W PGM= 10W (tp = 20 µs) IGM=4A(tp=20µs) VGM= 16V (tp = 20 µs).
ELECTRICAL CHARACTERISTICS
THERMAL RESISTANCES
BTA16 B / BTB16 B
2/5
Fig.1 : Maximum RMS power dissipation versus RMS on-state current (F=50Hz). (Curves are cut off by (dI/dt)c limitation)
Fig.3 : Correlation between maximum RMS power dissipation and maximum allowable temperatures (T
amb
and T
case
) for different thermal resistances heatsink +
contact (BTB).
Fig.4 : RMS on-state current versus case temperature.
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
0.01
0.1
1
Zth/Rth
Zth( j-c)
Zth(j-a)
tp(s)
Fig.5 : Relative variation of thermal impedance versus
pulse duration.
Fig.6 : Relative variation of gate trigger current and holding current versus junction temperature.
Fig.2 : Correlation between maximum RMS power dissipation and maximum allowable temperatures (T
amb
and T
case
) for different thermal resistances heatsink +
contact (BTA).
BTA16 B / BT B16 B
3/5
Fig.8 : Non repetitive surge peak on-state current for a sinusoidal pulse with width : t 10ms, and corresponding value of I2t.
Fig.9 : On-state characteristics (maximum values).
Fig.7 : Non Repetitive surge peak on-state current
versus number of cycles.
BTA16 B / BTB16 B
4/5
PACKAGE MECHANICAL DATA
TO220AB Plastic
Cooling method : C Marking : type number Weight : 2.3 g Recommended torque value : 0.8 m.N. Maximum torquevalue : 1 m.N.
I
==
A
G
D
B
C
F
P
N
O
M
L
J
H
REF. DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A 10.20 10.50 0.401 0.413 B 14.23 15.87 0.560 0.625 C 12.70 14.70 0.500 0.579 D 5.85 6.85 0.230 0.270 F 4.50 0.178 G 2.54 3.00 0.100 0.119 H 4.48 4.82 0.176 0.190
I 3.55 4.00 0.140 0.158
J 1.15 1.39 0.045 0.055 L 0.35 0.65 0.013 0.026 M 2.10 2.70 0.082 0.107 N 4.58 5.58 0.18 0.22 O 0.80 1.20 0.031 0.048 P 0.64 0.96 0.025 0.038
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted byimplication orotherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.
1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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BTA16 B / BT B16 B
5/5
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