RF & MICROWAVE TRANSISTORS
.REFRACTORY/GOLD METALLIZATION
.EMITTER SITE BALLASTED
.
:1 VSWR CAPABILITY AT RATED
∞
CONDITIONS
.LOW THERMAL RESISTANCE
.INPUT/OUTPUT MATCHING
.OVERLAY GEOMETRY
.METAL/CERAMIC HERMETIC PACKAGE
.P
DESCRIPTION
The AM82223-010 is a common base, silicon
NPN bipolar transistor designed for high gain
and efficiency in the 2.2 − 2.3 GHz frequency
range.
Suitable for hi-rel aerospace telemetry applications, the AM82223-010 is provided in the industry-standard AMPAC™ metal/ceramic hermetic
package and incorporates internal input and output impedance matching structures along with a
rugged, emitter-site ballasted overlay die geometry.
= 9 W MIN. WITH 6.5 dB GAIN
OUT
.400 x . 40 0 2NLFL (S042)
ORDER CO DE
AM82223-010
PIN CONNECTION
AM82223-010
TELEMETRY APPLICATIONS
hermetically sealed
BRANDING
82223-10
AM82223-010 is capable of withstanding ∞:1
load mismatch at any phase angle under full
rated operating conditions.
ABSOLUTE MAXIMUM RATINGS (T
Symbol Parameter Value Unit
P
DISS
I
C
V
CC
T
J
T
STG
THERMAL DATA
R
TH(j-c)
*Applies only to rated RF amplifier operation
NOTE: Thermal Resistance determined by Infra-Red Scanning of Hot-Spot
August 31, 1994
Junction Temperature at rated RF operating conditions.
Power Dissipation* (TC ≤ 75˚C) 28 W
Device Current* 1.2 A
Collector-Supply Voltage* 26 V
Junction Temperature 200
Storage Temperature
Junction-Case Thermal Resistance 4.4
case
= 25°C)
1. Collector 3. Emitter
2. Base 4. Base
65 to +200
−
°
°
°
C/W
C
C
1/3
AM82223-010
ELECTRICAL SPECIFICATIONS (T
case
= 25°C)
STATIC
Symbol
BV
CBOIC
BV
CERIC
BV
EBOIE
I
CBO
h
FE
= 5 mA IE = 0 mA 45 — — V
= 10 mA RBE = 10 Ω 45 — — V
= 1 mA IC = 0 mA 3.5 — — V
VCB = 24 V — — 1 m A
VCE = 5 V IC = 750 mA 20 — 300 —
Test Condition s Value
Min. Typ. Max.
DYNAMIC
Symbol Test Conditi ons
P
OUT
η
P
f = 2.2 − 2.3 GHz PIN = 2.0 W VCC = 24 V 9.0 — — W
cf = 2.2 − 2.3 GHz PIN = 2.0 W VCC = 24 V 40 — — %
f = 2.2 − 2.3 GHz PIN = 2.0 W VCC = 24 V 6.5 — — dB
G
Value
Min. Typ. Max.
Unit
Unit
2/3