SGS Thomson Microelectronics 2N2484 Datasheet

The documentation and process

INCH-POUND conversion measures necessary to comply with this revision shall be completed by 31 November 2000.

MIL-PRF-19500/376E 31 August 2000 SUPERSEDING MIL-PRF-19500/376D 21 August 1998

PERFORMANCE SPECIFICATION

SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, LOW-POWER

TYPES 2N2484, 2N2484UA, 2N2484UB, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC

This specification is approved for use by all Departments and Agencies of the Department of Defense.

1. SCOPE

1.1 Scope. This specification covers the performance requirements for NPN, silicon, low-power transistors. Four levels of product assurance is provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for die.

1.2 Physical dimensions. See figure 1 (similar to T0-18), figures 2 and 3 (surface mount case outlines UA and UB), and figures 4 and 5 (die).

1.3 Maximum ratings.

Types

2N2484 500 (1) 60 6 60 50 -65 to +200 325 146 2N2484UA 650 (2) 60 6 60 50 -65 to +200 210 160 2N2484UB 500 (1) 60 6 60 50 -65 to +200 325 146

TA = +25°C

mW V dc V dc V dc mA dc

CBO

EBO

CEO

TJ and T

STG

°C °C/W °C/W

θJA

θJC

(1) Derate linearly at 3.08 mW/°C above TA = +37.5°C (2) Derate linearly at 4.76 mW/°C above TA = +63.5°C.

1.4 Primary electrical characteristics.

Limits

Min Max

VCE = 5 V dc

IC = 1 mA dc

f = 1 kHz

250 900

obo

IE = 0

VCB = 5 V dc

100 kHz ≤ f ≤ 1 MHz

5.0

|hfe|2 V

IC = 500 µA dc

VCE = 5 V dc

f = 30 MHz

2.0

7.0

(1)

CE(sat)

IC = 1.0 mA dc IB = 0.1 mA dc

V dc

0.3

(1) Pulsed (see 4.5.1).

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Defense Supply Center, Columbus, ATTN: DSCC/VAC, Post Office Box 3990, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

MIL-PRF-19500/376E

Dimensions

Symbol Inches Millimeters Note

Min Max Min Max CD .178 .195 4.52 4.95 CH .170 .210 4.32 5.33 HD .209 .230 5.31 5.84 LC .100 TP 2.54 TP 6 LD .016 .021 0.41 0.53 7,8

LL .500 .750 12.7019.05 7,8

LU .016 .019 0.41 0.48 7,8

L1 --- .050 --- 1.27 7,8 L2 .250 --- 6.35 --- 7,8

Q --- .040 --- 0.86 5

TL .028 .048 0.71 1.22 3,4

TW .036 .046 0.91 1.17 3

r --- .010 --- 0.25 10

α 45° TP 45° TP

NOTES:

1. Dimension are in inches.

2. Metric equivalents are given for general information only.

3. Beyond r (radius) maximum, TW shall be held for a minimum length of .011 (0.28 mm).

4. Dimension TL measured from maximum HD.

5. Body contour optional within zone defined by HD, CD, and Q.

6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC.

7. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled in L1 and beyond LL minimum.

8. All three leads.

9. The collector shall be internally connected to the case.

10. Dimension r (radius) applies to both inside corners of tab.

11. In accordance with ANSI Y14.5M, diameters are equivalent to φx symbology.

12. Lead 1 = emitter, lead 2 = base, lead 3 = collector.

FIGURE 1. Physical dimensions (similar to TO-18).

MIL-PRF-19500/376E

Dimensions

Symbol Inches Millimeters Note

Min Max Min Max

A .061 .075 1.55 1.90 3 A1 .029 .041 0.74 1.04 B1 .022 .028 0.56 0.71 B2 .075 REF 1.91 REF B3 .006 .022 0.15 0.56 5

D .145 .155 3.68 3.93 D1 .045 .055 1.14 1.39 D2 .0375 BSC .952 BSC D3 --- .155 --- 3.93

E .215 .225 5.46 5.71 E3 --- .225 --- 5.71 L1 .032 .048 0.81 1.22 L2 .072 .088 1.83 2.23 L3 .003 .007 0.08 0.18 5

NOTES:

1. Dimensions are in inches.

2. Metric equivalents are given for general information only.

3. Dimension "A" controls the overall package thickness. When a window lid is used, dimension "A" must increase by a minimum of .010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm).

4. The corner shape (square, notch, radius, etc.) may vary at the manufacturer's option, from that shown on the drawing.

5. Dimensions "B3" minimum and "L3" minimum and the appropriately castellation length define an unobstructed three-dimensional space traversing all of the ceramic layers in which a castellation was designed. (Castellations are required on bottom two layers, optional on top ceramic layer.) Dimension "B3" maximum and "L3" maximum define the maximum width and depth of the castellation at any point on its surface. Measurement of these dimensions may be made prior to solder dipping.

6. Lead 4 = no connection.

FIGURE 2. Physical dimensions, surface mount (2N2484UA).

MIL-PRF-19500/376E

Dimensions

Inches Millimeters

Min. Max. Min. Max.

A .046 .056 0.97 1.42 A1 .017 .035 0.43 0.89 B1 .016 .024 0.41 0.61 3

D .085 .108 2.41 2.74 D1 .071 .079 1.81 2.01 D2 .035 .039 0.89 0.99 D3

E .115 .128 2.82 3.25 E3

L1 .022 .038 0.56 0.96 4

NOTES:

1. Dimensions are in inches.

2. Metric equivalents are given for general information only.

3. Dimensions B2 and B3 are identical to B1

4. Dimension L2 is identical to L1.

FIGURE 3. Physical dimensions, surface mount (2N2484UB).

NotesLtr

MIL-PRF-19500/376E

A- version

NOTES:

1. Die size...............................................0.015 x 0.019 inches ± 0.001 inch

2. Die thickness.......................................0.010 ± 0.0015 inches

3. Top metal............................................Aluminum 15,000Å minimum, 18,000Å nominal

4. Back metal ..........................................A. Gold 2,500Å minimum, 3,000Å nominal

B. Eutectic Mount – No Gold

5. Backside.............................................Collector

6. Bonding pad........................................ B = 0.003 inches, E = 0.004 inches diameter

7. Passivation.........................................Si3N4 (Silicon Nitride) 2kÅ min, 2.2kÅ nom.

FIGURE 4. Physical dimensions, JANHC and JANKC die, A - version.

MIL-PRF-19500/376E

B - version

Die size:.....................................................0.018 x 0.018 inches

Die thickness: ............................................ 0.008 ± 0.0016 inches

Base pad: .................................................. 0.0025 inches diameter

Emitter pad:............................................... 0.003 inches diameter

Back metal:................................................ Gold, 6500 ± 1950 Å

Top metal: ................................................. Aluminum, 19500 ± 2500 Å

Back side:..................................................Collector

Glassivation:..............................................SiO2, 7500 ± 1500 Å

FIGURE 5. Physical dimensions, JANHC and JANKC die, B - version.

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