SGS-THOMSON STH60N10, STH60N10FI, STW60N10 Technical data

STH60N10

STH60N10/FI

STW60N10

N - CHANNEL ENHANCEMENT MODE

POWER MOS TRANSISTOR

TYPE

VDSS

R DS ( on)

ID

STH60N10

100 V

< 0.025 Ω

60 A

STH60N10FI

100 V

< 0.025 Ω

36 A

STW60N10

100 V

< 0.025 Ω

60 A

TYPICAL RDS(on) = 0.02 Ω

AVALANCHE RUGGED TECHNOLOGY

100% AVALANCHE TESTED

REPETITIVE AVALANCHE DATA AT 100oC

LOW GATE CHARGE

VERY HIGH CURRENT CAPABILITY

175oC OPERATING TEMPERATURE

APPLICATION ORIENTED CHARACTERIZATION

APPLICATIONS

HIGH CURRENT, HIGH SPEED SWITCHING

SOLENOID AND RELAY DRIVERS

REGULATORS

DC-DC & DC-AC CONVERTERS

MOTOR CONTROL, AUDIO AMPLIFIERS

AUTOMOTIVE ENVIRONMENT (INJECTION, ABS, AIR-BAG, LAMPDRIVERS, Etc.)

TO-247

3

2

1

 

 

 

3

3

 

 

2

2

 

 

 

 

1

 

1

TO-218

 

 

 

 

 

ISOWATT218

INTERNAL SCHEMATIC DIAGRAM

ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Value

 

Unit

 

 

STH/STW60N10

STH60N10FI

 

VD S

Drain-source Voltage (VGS = 0)

100

 

V

VDG R

Draingate Voltage (RGS = 20 kΩ)

100

 

V

VGS

Gate-source Voltage

± 20

 

V

ID

Drain Current (continuous) at Tc = 25 oC

60

36

A

ID

Drain Current (continuous) at Tc = 100 oC

42

22

A

ID M()

Drain Current (pulsed)

240

240

A

Ptot

Total Dissipation at Tc = 25 oC

200

70

W

 

Derating Factor

1.33

0.56

W/oC

VISO

Insulation Withstand Voltage (DC)

 

4000

V

Tstg

Storage Temperature

-65 to 175

-65 to 150

oC

Tj

Max. Operating Junction Temperature

175

150

oC

() Pulse width limited by safe operating area

May 1993

1/11

STH60N10/FI STW60N10

THERMAL DATA

 

 

 

 

 

TO-218/TO-247 ISOWATT218

 

Rthj-cas e

Thermal Resistance Junction-case

Max

0.75

1.79

oC/W

Rthjamb

Thermal

Resistance

Junction-ambient

Max

 

30

oC/W

Rt hcsin k

Thermal

Resistance

Case-sink

Typ

 

0.1

oC/W

Tl

Maximum Lead Temperature For Soldering Purpose

 

300

oC

AVALANCHE CHARACTERISTICS

Symbol

IA R

EAS

EAR

IA R

Parameter

Max Value

Unit

Avalanche Current, Repetitive or Not-Repetitive

60

A

(pulse width limited by Tj max, δ < 1%)

 

 

Single Pulse Avalanche Energy

720

mJ

(starting Tj = 25 oC, ID = IAR, VD D = 25 V)

 

 

Repetitive Avalanche Energy

180

mJ

(pulse width limited by Tj max, δ < 1%)

 

 

Avalanche Current, Repetitive or Not-Repetitive

37

A

(Tc = 100 oC, pulse width limited by Tj max, δ < 1%)

 

 

ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified) OFF

Symbol

Parameter

Test Conditions

Min.

Typ. Max.

Unit

V( BR)DSS

Drain-source

ID = 250 μA VG S = 0

100

 

V

 

Breakdown Voltage

 

 

 

 

IDS S

Zero Gate Voltage

VDS = Max Rating

 

250

μA

 

Drain Current (VGS = 0)

VDS = Max Rating x 0.8 Tc = 125 oC

 

1000

μA

IG SS

Gate-body Leakage

VGS = ± 20 V

 

± 100

nA

 

Current (VD S = 0)

 

 

 

 

ON ( )

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VG S(th)

Gate Threshold Voltage

VDS = VGS

ID = 250

μA

2

2.9

4

V

RDS( on)

Static Drain-source On

VGS = 10 V

ID = 30

A

 

0.02

0.025

Ω

 

Resistance

VGS = 10 V

ID = 30 A Tc = 100oC

 

 

0.05

Ω

ID( on)

On State Drain Current

VDS > ID( on) x RD S(on) max

60

 

 

A

 

 

VGS = 10 V

 

 

 

 

 

 

DYNAMIC

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

gfs ( )

Forward

VDS > ID( on) x RD S(on) max

ID = 30 A

25

35

 

S

 

Transconductance

 

 

 

 

 

 

Ciss

Input Capacitance

VDS = 25 V f = 1 MHz

VG S = 0

 

4000

5000

pF

Coss

Output Capacitance

 

 

 

1100

1400

pF

Crss

Reverse Transfer

 

 

 

250

350

pF

 

Capacitance

 

 

 

 

 

 

2/11

STH60N10/FI STW60N10

ELECTRICAL CHARACTERISTICS (continued)

SWITCHING ON

Symbol

Parameter

Test Conditions

Min. Typ. Max. Unit

td(on)

Turn-on Time

VDD = 80 V

ID = 30 A

90

130

ns

tr

Rise Time

RG = 50 Ω

VGS = 10 V

270

380

ns

 

 

(see test circuit, figure 3)

 

 

 

(di/dt)on

Turn-on Current Slope

VDD = 80 V

ID = 60 A

270

 

A/μs

 

 

RG = 50 Ω

VGS = 10 V

 

 

 

 

 

(see test circuit, figure 5)

 

 

 

Qg

Total Gate Charge

VDD = 80 V

ID = 30 A VGS = 10 V

120

170

nC

Qgs

Gate-Source Charge

 

 

16

 

nC

Qgd

Gate-Drain Charge

 

 

60

 

nC

SWITCHING OFF

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

tr(Vof f)

Off-voltage Rise Time

VDD = 80 V

ID = 60 A

 

200

280

ns

tf

Fall Time

RG = 50 Ω

VGS = 10 V

 

210

290

ns

tc

Cross-over Time

(see test circuit, figure 5)

 

410

570

ns

SOURCE DRAIN DIODE

Symbol

Parameter

Test Conditions

Min.

Typ. Max.

Unit

IS D

Source-drain Current

 

 

 

60

A

ISDM()

Source-drain Current

 

 

 

240

A

 

(pulsed)

 

 

 

 

 

VS D ( )

Forward On Voltage

ISD = 60 A

VG S = 0

 

1.6

V

trr

Reverse Recovery

ISD = 60 A di/dt = 100 A/μs

 

180

ns

 

Time

VDD = 30 V

Tj = 150 oC

 

 

μC

Qrr

Reverse Recovery

(see test circuit, figure 5)

 

1

 

Charge

 

 

 

 

 

IRRM

Reverse Recovery

 

 

 

11

A

 

Current

 

 

 

 

 

( ) Pulsed: Pulse duration = 300 μs, duty cycle 1.5 % () Pulse width limited by safe operating area

Safe Operating Areas For TO-218 and TO-247 Safe Operating Areas For ISOWATT218

3/11

SGS-THOMSON STH60N10, STH60N10FI, STW60N10 Technical data

STH60N10/FI STW60N10

Thermal Impedeance For TO-218 and TO-247

Thermal Impedance For ISOWATT218

Derating Curve For TO-218 and TO-247

Derating Curve For ISOWATT218

Output Characteristics

Transfer Characteristics

4/11

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