SGS-THOMSON STP7NB60, STP7NB60FP Technical data

!

STP7NB60

STP7NB60FP

N - CHANNEL ENHANCEMENT MODE

PowerMESH MOSFET

TYPE

VDSS

RDS(on)

ID

STP7NB60

600

V

< 1.2 Ω

7.2 A

STP7NB60FP

600

V

< 1.2 Ω

4.1 A

TYPICAL RDS(on) = 1.0 Ω

EXTREMELY HIGH dv/dt CAPABILITY

100% AVALANCHE TESTED

VERY LOW INTRINSIC CAPACITANCES

GATE CHARGE MINIMIZED

DESCRIPTION

Using the latest high voltage MESH OVERLAY process, SGS-Thomson has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company's proprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics.

APPLICATIONS

HIGH CURRENT, HIGH SPEED SWITCHING

SWITCH MODE POWER SUPPLIES (SMPS)

DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVE

ABSOLUTE MAXIMUM RATINGS

3

3

2

2

1

1

TO-220

TO-220FP

INTERNAL SCHEMATIC DIAGRAM

Symbol

Parameter

Value

Uni t

 

 

ST P7NB60

STP7NB60FP

 

VDS

Drain-source Voltage (VGS = 0)

 

600

V

VDGR

Draingate Voltage (RGS = 20 kΩ)

 

600

V

VGS

Gate-source Voltage

 

± 30

V

ID

Drain Current (continuous) at Tc = 25 oC

7.2

4.1

A

ID

Drain Current (continuous) at Tc = 100 oC

4.5

2.6

A

IDM()

Drain Current (pulsed)

28.8

28.8

A

Pt ot

Total Dissipation at Tc = 25 o C

125

40

W

 

Derating Factor

1.0

0.32

W/oC

dv/dt(1)

Peak Diode Recovery voltage slope

4.5

4.5

V/ns

VISO

Insulation Withstand Voltage (DC)

 

2000

V

Tstg

Storage Temperature

-65 to 150

oC

Tj

Max. Operating Junction Temperature

 

150

oC

() Pulse width limited by safe operating area

(1) ISD 7A, di/dt 200 A/μs, VDD V(BR)DSS, Tj TJMAX

 

March 1998

1/9

STP7NB60/FP

THERMAL DATA

 

 

 

 

 

TO-220

T O220-F P

 

Rt hj-ca se

Thermal Resistance Junction-case

Max

1.0

3.13

oC/W

Rt hjamb

Thermal

Resistance

Junction-ambient

Max

62.5

 

oC/W

Rthcsi nk

Thermal

Resistance

Case-sink

Typ

0.5

 

oC/W

Tl

Maximum Lead Temperature For Soldering Purpose

300

 

oC

AVALANCHE CHARACTERISTICS

Symb ol

Parameter

Max Valu e

Uni t

IAR

Avalanche Current, Repetitive or Not-Repetitive

7.2

A

 

(pulse width limited by Tj max, δ < 1%)

 

 

EAS

Single Pulse Avalanche Energy

580

mJ

 

(starting Tj = 25 oC, ID = IAR, VDD = 50 V)

 

 

ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified) OFF

Symb ol

Parameter

Test Cond ition s

Mi n.

Typ . Max.

Un it

V(BR)DSS

Drain-source

ID = 250 μA VGS = 0

 

600

 

V

 

Breakdown Voltage

 

 

 

 

 

IDSS

Zero Gate Voltage

VDS = Max Rating

Tc = 125 oC

 

1

μA

 

Drain Current (VGS = 0)

VDS = Max Rating

 

50

μA

IGSS

Gate-body Leakage

VGS = ± 30 V

 

 

± 100

nA

 

Current (VDS = 0)

 

 

 

 

 

ON ( )

Symb ol

Parameter

Test Cond ition s

Mi n.

Typ .

Max.

Un it

VGS(th)

Gate Threshold Voltage

VDS = VGS

ID = 250 μA

3

4

5

V

RDS( on)

Static Drain-source On

VGS = 10V

ID = 3.6 A

 

1.0

1.2

Ω

 

Resistance

 

 

 

 

 

 

ID(o n)

On State Drain Current

VDS > ID(on) x RDS(on) max

7.2

 

 

A

 

 

VGS = 10 V

 

 

 

 

 

DYNAMIC

Symb ol

Parameter

Test Cond ition s

Mi n.

Typ .

Max.

Un it

gfs ( ) Forward

VDS > ID(on) x RDS(on) max

ID = 3.6 A

4

5.3

 

S

 

Transconductance

 

 

 

 

 

 

Ciss

Input Capacitance

VDS = 25 V f = 1 MHz

VGS = 0

 

1250

1625

pF

Coss

Output Capacitance

 

 

 

165

223

pF

Crss

Reverse Transfer

 

 

 

16

22

pF

 

Capacitance

 

 

 

 

 

 

2/9

SGS-THOMSON STP7NB60, STP7NB60FP Technical data

STP7NB60/FP

ELECTRICAL CHARACTERISTICS (continued)

SWITCHING ON

Symb ol

Parameter

td(on)

Turn-on Time

tr

Rise Time

Qg

Total Gate Charge

Qgs

Gate-Source Charge

Qgd

Gate-Drain Charge

Test Cond ition s

Mi n. Typ .

Max.

Un it

VDD = 300 V

ID = 3.6 A

18

27

ns

RG = 4.7 Ω

VGS = 10 V

8

12

ns

(see test circuit, figure 3)

 

 

 

VDD = 480 V

ID = 7.2 A VGS = 10 V

30

45

nC

 

 

9.9

 

nC

 

 

13.3

 

nC

SWITCHING OFF

Symb ol

Parameter

tr(Vof f)

Off-voltage Rise Time

tf

Fall Time

tc

Cross-over Time

Test Cond ition s

Mi n. Typ .

Max.

Un it

VDD = 480 V

ID = 7.2 A

8

12

ns

RG = 4.7 Ω

VGS = 10 V

5

8

ns

(see test circuit, figure 5)

15

23

ns

SOURCE DRAIN DIODE

Symb ol

Parameter

Test Cond ition s

Mi n. Typ . Max.

Un it

ISD

Source-drain

Current

 

7.2

A

ISDM ()

Source-drain

Current

 

28.8

A

(pulsed)

VSD ( ) Forward On Voltage

trr Reverse Recovery

Time

Qrr Reverse Recovery

Charge

IRRM Reverse Recovery

Current

ISD = 7.2 A

VGS = 0

 

1.6

V

ISD = 7.2 A

di/dt = 100 A/μs

530

 

ns

VDD = 100 V

Tj = 150 o C

 

 

μC

(see test circuit, figure 5)

4.5

 

 

 

17

 

A

( ) Pulsed: Pulse duration = 300 μs, duty cycle 1.5 % () Pulse width limited by safe operating area

Safe Operating Area for TO-220

Safe Operating Area for TO-220FP

3/9

Loading...
+ 6 hidden pages