SGS-THOMSON STP6NA80, STP6NA80FI Technical data

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STP6NA80

STP6NA80FI

N - CHANNEL ENHANCEMENT MODE

FAST POWER MOS TRANSISTOR

TYPE

VDSS

R DS ( on)

ID

STP6NA80

800 V

< 1.9 Ω

5.7 A

STP6NA80FI

800 V

< 1.9 Ω

3.4 A

TYPICAL RDS(on) = 1.68 Ω

± 30V GATE TO SOURCE VOLTAGE RATING

100% AVALANCHE TESTED

REPETITIVE AVALANCHE DATA AT 100oC

LOW INTRINSIC CAPACITANCES

GATE GHARGE MINIMIZED

REDUCED THRESHOLD VOLTAGE SPREAD

DESCRIPTION

This series of POWER MOSFETS represents the most advanced high voltage technology. The optimized cell layout coupled with a new proprietary edge termination concur to give the device low RDS(on) and gate charge, unequalled ruggedness and superior switching performance.

APPLICATIONS

HIGH CURRENT, HIGH SPEED SWITCHING

SWITCH MODE POWER SUPPLIES (SMPS)

DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVE

ABSOLUTE MAXIMUM RATINGS

3

3

2

2

1

1

TO-220 ISOWATT220

INTERNAL SCHEMATIC DIAGRAM

Symbol

Parameter

 

Value

Unit

 

 

STP6NA80

STP6NA80FI

 

VD S

Drain-source Voltage (VGS = 0)

 

800

V

VDG R

Drain-gate Voltage (RG S = 20 kΩ)

 

800

V

VGS

Gate-source Voltage

 

± 30

V

ID

Drain Current (continuous) at Tc = 25 oC

5.7

3.4

A

ID

Drain Current (continuous) at Tc = 100 oC

3.6

2.1

A

ID M()

Drain Current (pulsed)

23

23

A

Ptot

Total Dissipation at Tc = 25 oC

125

45

W

 

Derating Factor

1

0.36

W/oC

VISO

Insulation Withstand Voltage (DC)

 

2000

V

Tstg

Storage Temperature

-65 to 150

oC

Tj

Max. Operating Junction Temperature

 

150

oC

() Pulse width limited by safe operating area

November 1996

1/10

STP6NA80/FI

THERMAL DATA

 

 

 

 

 

TO-220

ISOWATT220

 

Rthj-cas e

Thermal Resistance Junction-case

Max

1

2.78

oC/W

Rthjamb

Thermal

Resistance

Junction-ambient

Max

 

62.5

oC/W

Rt hcsin k

Thermal

Resistance

Case-sink

Typ

 

0.5

oC/W

Tl

Maximum Lead Temperature For Soldering Purpose

 

300

oC

AVALANCHE CHARACTERISTICS

Symbol

IA R

EAS

EAR

IA R

Parameter

Max Value

Unit

Avalanche Current, Repetitive or Not-Repetitive

5.7

A

(pulse width limited by Tj max, δ < 1%)

 

 

Single Pulse Avalanche Energy

165

mJ

(starting Tj = 25 oC, ID = IAR, VD D = 50 V)

 

 

Repetitive Avalanche Energy

6.5

mJ

(pulse width limited by Tj max, δ < 1%)

 

 

Avalanche Current, Repetitive or Not-Repetitive

3.6

A

(Tc = 100 oC, pulse width limited by Tj max, δ < 1%)

 

 

ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified) OFF

Symbol

Parameter

Test Conditions

Min.

Typ. Max.

Unit

V( BR)DSS

Drain-source

ID = 250 μA VG S = 0

800

 

V

 

Breakdown Voltage

 

 

 

 

IDS S

Zero Gate Voltage

VDS = Max Rating

 

25

μA

 

Drain Current (VGS = 0)

VDS = Max Rating x 0.8 Tc = 125 oC

 

250

μA

IG SS

Gate-body Leakage

VGS = ± 30 V

 

± 100

nA

 

Current (VD S = 0)

 

 

 

 

ON ( )

Symbol

VG S(th)

RDS( on)

ID( on)

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Gate Threshold Voltage

VDS = VGS

ID = 250 μA

2.25

3

3.75

V

Static Drain-source On

VGS = 10V

ID = 3 A

 

1.68

1.9

Ω

Resistance

 

 

 

 

 

 

On State Drain Current

VDS > ID( on) x RD S(on) max

6

 

 

A

 

VGS = 10 V

 

 

 

 

 

DYNAMIC

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

gfs ( )

Forward

VDS > ID( on) x RD S(on) max

ID = 3 A

4

6.1

 

S

 

Transconductance

 

 

 

 

 

 

Ciss

Input Capacitance

VDS = 25 V f = 1 MHz

VG S = 0

 

1330

1750

pF

Coss

Output Capacitance

 

 

 

160

210

pF

Crss

Reverse Transfer

 

 

 

40

55

pF

 

Capacitance

 

 

 

 

 

 

2/10

SGS-THOMSON STP6NA80, STP6NA80FI Technical data

STP6NA80/FI

ELECTRICAL CHARACTERISTICS (continued)

SWITCHING ON

Symbol

Parameter

Test Conditions

Min. Typ. Max. Unit

td(on)

Turn-on Time

VDD = 400 V

ID = 3 A

35

45

ns

tr

Rise Time

RG = 47 Ω

VGS = 10 V

95

125

ns

 

 

(see test circuit, figure 3)

 

 

 

(di/dt)on

Turn-on Current Slope

VDD = 640 V

ID = 6 A

170

 

A/μs

 

 

RG = 47 Ω

VGS = 10 V

 

 

 

 

 

(see test circuit, figure 5)

 

 

 

Qg

Total Gate Charge

VDD = 640 V

ID = 6 A VGS = 10 V

58

78

nC

Qgs

Gate-Source Charge

 

 

8

 

nC

Qgd

Gate-Drain Charge

 

 

27

 

nC

SWITCHING OFF

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

tr(Vof f)

Off-voltage Rise Time

VDD = 640 V

ID = 6 A

 

90

120

ns

tf

Fall Time

RG = 47 Ω

VGS = 10 V

 

25

35

ns

tc

Cross-over Time

(see test circuit, figure 5)

 

125

165

ns

SOURCE DRAIN DIODE

Symbol

Parameter

 

Test Conditions

Min.

Typ. Max.

Unit

IS D

Source-drain Current

 

 

 

5.7

A

ISDM()

Source-drain Current

 

 

 

23

A

 

(pulsed)

 

 

 

 

 

VS D ( )

Forward On Voltage

ISD = 6 A

VGS = 0

 

1.6

V

trr

Reverse Recovery

ISD = 6 A

di/dt = 100 A/μs

 

850

ns

 

Time

VDD = 100 V Tj = 150 oC

 

 

μC

Qrr

Reverse Recovery

(see test circuit, figure 5)

 

15

 

Charge

 

 

 

 

 

IRRM

Reverse Recovery

 

 

 

35

A

 

Current

 

 

 

 

 

( ) Pulsed: Pulse duration = 300 μs, duty cycle 1.5 %

 

 

 

 

() Pulse width limited by safe operating area

 

 

 

 

 

Safe Operating Areas for TO-220

 

Safe Operating Areas for ISOWATT220

 

3/10

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