Sequans Communications SP150Q User Manual

Calliope Platform - Module SP150Q

SEQUANS Communications

15-55 Boulevard Charles de Gaulle

92700 Colombes, France

Phone. [phone]

Fax. [phone]

www.sequans.com

[e-mail]

Datasheet

Legal Notices

Copyright ©2018, SEQUANS Communications

All information contained herein and disclosed by this document is
confidential and the proprietary property of SEQUANS Communications,
and all rights therein are expressly reserved. Acceptance of this material
signifies agreement by the recipient that the information contained in this
document is confidential and that it will be used solely for the purposes set
forth herein. Acceptance of this material signifies agreement by the recipient
that it will not be used, reproduced in whole or in part, disclosed, distributed,
or conveyed to others in any manner or by any means – graphic, electronic, or
mechanical, including photocopying, recording, taping, or information
storage and retrieval systems – without the express written permission of
SEQUANS Communications.

Preface

All Sequans’ logos and trademarks are the property of SEQUANS
Communications. Unauthorized usage is strictly prohibited without the
express written permission of SEQUANS Communications. All other
company and product names may be trademarks or registered trademarks of
their respective owners. Products and services of SEQUANS
Communications, and those of its licensees may be protected by one or more
pending or issued U.S. or foreign patents.

Sequans’ SP150Q utilizes SMSC’s Inter-Chip Connectivity™ technology. See

www.smsc.com.

Because of continuing developments and improvements in design,
manufacturing, and deployment, material in this document is subject to
change without notification and does not represent any commitment or
obligation on the part of SEQUANS Communications. SEQUANS
Communications shall have no liability for any error or damages resulting
from the use of this document.

SP150Q DATASHEET PROPRIETARY i

SEQUANS Communications

Document Revision History

Revision Date Product Application

01 July 2018 First edition.

02 September 2018 Second edition.

03 October 2018 Third edition. Refer to Changes in this Document on page iii.

ii PROPRIETARY SP150Q DATASHEET

SEQUANS Communications

About this Datasheet

Purpose and Scope

The SP150Q is a complete LTE module including base-band, RF and memory,
for the design of connected consumer electronics devices, tablet and laptop
computers, machine-to-machine devices, and other devices with embedded
LTE connectivity on Sprint® network and its roaming partners
(www.sprint.com). This document provides technical information about
SP150Q LGA module. SP150Q is based on Sequans’ Calliope platform.

Who Should Read this Datasheet

This document is intended for engineers who are developing User Equipment
(UE) for LTE systems.

Changes in this Document

The following changes were done since the previous edition of the document:

• Updated features list in Section Product Features

• Updated test conditions in Section 3.12 RF Performance on page

7.

2

on page 1.

SP150Q DATASHEET PROPRIETARY iii

SEQUANS Communications

References

[1] Core technology specifications:

• 3GPP E-UTRA 21 series Release 10 (EPS)

• 3GPP E-UTRA 22 series Release 10 (IMEI)

• 3GPP E-UTRA 23 series Release 10 (NAS, SMS)

• 3GPP E-UTRA 24 series Release 10 (NAS)

• 3GPP E-UTRA 31 series Release 10 (UICC)

• 3GPP E-UTRA 33 series Release 10 (security)

• 3GPP E-UTRA 36 series Release 10 (RAN)

• 3GPP2 C.S0015-A v1.0 (SMS)

• IETF, RFC 3261, 4861, 4862, 6434

For more information, see

• ftp://ftp.3gpp.org/Specs/latest/Rel-10/21_series/

• ftp://ftp.3gpp.org/Specs/latest/Rel-10/22_series/

• ftp://ftp.3gpp.org/Specs/latest/Rel-10/23_series/

• ftp://ftp.3gpp.org/Specs/latest/Rel-10/24_series/

• ftp://ftp.3gpp.org/Specs/latest/Rel-10/31_series/

• ftp://ftp.3gpp.org/Specs/latest/Rel-10/33_series/

• ftp://ftp.3gpp.org/Specs/latest/Rel-10/36_series/

• http://www.3gpp2.org/public_html/specs/CS0015-0.pdf

• https://tools.ietf.org/html/

[2] Test specifications:

3GPP E-UTRA 36 series Release 10 (RAN)

ftp://ftp.3gpp.org/Specs/latest/Rel-10/36_series/

[3] Vocabulary reference:

• 3GPP TR 21.905: "Vocabulary for 3GPP Specifications"

For more information, see http://www.3gpp.org/ftp/specs/archive/21_series/21.905/

[4]

• "Universal Serial Bus Specification", Revision 2.0, April 27, 2000 (http://www.usb.org/devel-

opers/docs/). ECM (Ethernet Networking Control Model) is specified in “USB Class Definitions for

Communication Devices”, Version 1.1, January 19,1999, section 3.8.2. EEM (CDC Ethernet Emula­tion Model) is specified in “Universal Serial Bus Communications Class Subclass Specification for
Ethernet Emulation Model Devices”, Revision 1.0, February 2, 2005.

• SQN3223 Application CPU runs OpenWrt, a Linux distribution for embedded devices. See
https://openwrt.org/.

iv PROPRIETARY SP150Q DATASHEET

SEQUANS Communications

Documentation Conventions

This section illustrates the conventions that are used in this document.

General Conventions

Note Important information requiring the user’s attention.

Caution A condition or circumstance that may cause damage to the equipment or loss of

data.

Warning A condition or circumstance that may cause personal injury.

Italics Italic font style denotes

• emphasis of an important word;

• first use of a new term;

• title of a document.

Screen Name Sans serif, bold font denotes

• on-screen name of a window, dialog box or field;

• keys on a keyboard;

• labels printed on the equipment.

Software Conventions

Code Regular Courier font denotes code or text displayed on-screen.

Code Bold Courier font denotes commands and parameters that you enter exactly as

shown. Multiple parameters are grouped in brackets [ ]. If you are to choose only
one among grouped parameters, the choices are separated with a pipe: [parm1 |
parm2 | parm3] If there is no pipe separator, you must enter each parameter:
[parm1 parm2 parm3]

Code Italic Courier font denotes parameters that require you to enter a value or

variable. Multiple parameters are grouped in brackets [ ]. If you are to choose
only one among grouped parameters, the choices are separated with a pipe:
[parm1 | parm2 | parm3] If there is no pipe separator, you must enter a value for
each parameter: [parm1 parm2 parm3]

SP150Q DATASHEET PROPRIETARY v

SEQUANS Communications

Table of Contents

Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i

Legal Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .i

Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii

About this Datasheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

Purpose and Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

Who Should Read this Datasheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

Changes in this Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .iv

Documentation Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v

Chapter 1

Product Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Features Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.2 TDM-PCM Interface Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Chapter 2

Regulatory Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Chapter 3

Physical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1 ECCN and Part Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2 Electrical Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.2.1 Detailed Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.3 Environmental Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.3.1 Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.3.2 Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.4 Auxiliary ADC Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.5 Power Supply Dimensioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.6 I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.7 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.7.1 Module Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.7.2 Marking Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.8 Packing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.9 Storage Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.10 Mounting Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

3.11 Component Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Proprietary vi

SEQUANS Communications

Table of Contents

3.12 RF Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Chapter 4

Signals and Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

4.1 SP150Q Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

4.2 Notes on SP150Q Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

4.2.1 High-Speed UARTs Flow Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

4.2.2 I2S/PCM Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

4.3 Power Supplies Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4.4 Power-up Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4.5 Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Appendix A

Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Proprietary vii

SEQUANS Communications

Product Features

^YEϯϮϰϭ

ϱϭϮDďŝƚ>WZ

^W/&ůĂƐŚ

;ϮϱϲDďŝƚͿ

ϯϮϳϲϴŬ,njyƚĂů

WD/dyK

^Wϯd

Z&^ǁŝƚĐŚ

^Wϯd

Z&^ǁŝƚĐŚ

W

WƌŝŵĂƌLJ

ŶƚĞŶŶĂ

ŝǀĞƌƐŝƚLJ
ŶƚĞŶŶĂ

^WϭϱϬY

ϭϮƵƉůĞdžĞƌ

Ϯϲϱ

ƵƉůĞdžĞƌ

hZdƐ

:d'

h^

^/K

WD/Ϯ^

ϭϮ^t

Ϯϲϱ

^t

dy/&

Zy/&Ϭ

Zy/&ϭ

ϯϴϰD,nj

><Z&

sďĂƚ

^/D>ĞǀĞů^ŚŝĨƚĞƌ

^/D

'W/K

^W/

^YEϯϮϮϯ

ŽŶƚƌŽů

sďĂƚ

;ƚŽWƐͿ

ϮϱϮ

^t

ŝĨĨ

ƐǁŝƚĐŚ

ϮϱϮ

ƵƉůĞdžĞƌ

ŝĨĨ

ƐǁŝƚĐŚ

ϮϱĂůƵŶ

1

1.1 Features Description

Sequans SP150Q module includes Calliope Category 1 baseband, a complete
triple band RF front end, memory and required circuitry to meet 3GPP
E-UTRA (Long Term Evolution - LTE, Release 10 set of specifications) and
Sprint LTE UE specifications.

For more information on the core technology specifications see the section

References on page 2. The term SP150Q module refers to the hardware and

the associated embedded software.

The architecture block diagram of the SP150Q is presented on Figure 1-5.

SP150Q DATASHEET PROPRIETARY 1

Figure 1-1: SP150Q Block Diagram

Table 1-1 on page 2 provides detail on general features of the SP150Q.

SEQUANS Communications

Table 1-2 on page 2 provides detail for the LTE-related features of the SP150Q.

SP150Q’s ECCN and part number are detailed in the Section 3.1 ECCN and

Part Number on page 9.

Table 1-1: General Features

PRODUCT FEATURES

FEATURES DESCRIPTION

General interfaces

Supported Frequency Bands

Operation voltages

Packaging

Operating temperature

•JTAG

•USIM

•SPI

•GPIO

• USB 2.0 Host or Device

•UART (x3)

•SDIO Host

•PCM/I2S

•LTE Band 25

•LTE Band 26

•LTE Band 2

•LTE Band 5

•LTE Band 12

•V

(operational range from 3.3 V to 4.42 V)

bat

•LGA module

• 108 pads (22.53 x 22.66 x 1.47 mm)

• RoHS compliant, halogen-free

• -30°C to +60 °C ambient

See also Section 3.3 Environmental Operating Conditions on page 11

Humidity

• 10% to 85%

See also Section 3.3 Environmental Operating Conditions on page 11

Table 1-2: LTE Fea t ur e s

Standard compliance

SP150Q DATASHEET PROPRIETARY 2

• 3GPP E-UTRA Release 10 compliant

SEQUANS Communications

PRODUCT FEATURES

FEATURES DESCRIPTION

Table 1-2: LTE Features (Continued)

PHY

• One UL and two DL transceivers

• Category 1 UE

•FDD

• Normal and extended cyclic prefix

• Modulation

- DL: QPSK, 16QAM, 64QAM

- UL: QPSK, 16QAM

• All coding schemes corresponding to modulations

• All channel coding (turbo-coding with interleaver, tail biting convolutional coding,
block and repetition coding) and CRC lengths

• Channels 5, 10, 15, and 20 MHz

• Sounding (including in special subframes)

• Control and data in special subframes

• Antenna diversity on DL: MRC (Maximum Ratio Combining)

• All power control schemes and DL power allocation schemes

• HARQ Incremental Redundancy and Chase Combining, with bundling or multi­plexing

• Measurements and computations related to CQI (Channel Quality Indicator), PMI
(Pre-coding Matrix Indicator) and RI (Rank Indicator), RSRP, and RSRQ

• Low power modes, including Power Gating

MAC

RLC

PDCP

• Random Access procedure in normal and special subframes

• Scheduling Request, Buffer Status Reporting, and Power Headroom Reporting

• Discontinuous reception (DRX) with long and short cycles

• Fast scanning

• Hosted configuration

• Semi-persistent scheduling

•IPv4, IPv6

•RoHC

• Location based services

• Advanced QoS features

• ARQ modes: UM, AM, and TM

• Ciphering and deciphering: NULL, AES, SNOW 3G

• Integrity and protection: AES, SNOW 3G

3 PROPRIETARY SP150Q DATASHEET

SEQUANS Communications

Table 1-2: LTE Features (Continued)

PRODUCT FEATURES

FEATURES DESCRIPTION

RRC

NAS and above

UICC

• MIB and all SIBs

• Intra and inter-frequency measurements and handover

• Up to 8 Data Radio Bearers supported

• MFBI (Multi-Frequency Band Indicator). FGI 35 Enabled

• Frequency Hopping

• Connected Mode Mobility

• PUSCH Hopping

• ANR (Automatic Neighbor Relation)

•NAS

• IMS Client (SMS) or SMS over SG

•OMADM Client

•Pre-loaded APN

• Device supports BIP messaging (all bearers)

• Client Initiated BIP

• LTE IP Messaging

• UICC 312530 IMSI Card Support

• UICC 311882 IoT card support

• Device supports removable UICC

• Device supports ISIM

• Device supports SIM OTA Server initiated polling requests via SMSPP

• Device supports SIM OTA provisioning of user credentials into the UICC from the
SIM OTA server instead of OMA DM

• Device will read APN values from the UICC instead of receiving them from OMA DM

SP150Q DATASHEET PROPRIETARY 4

SEQUANS Communications

PRODUCT FEATURES

TDM-PCM INTERFACE SPECIFICATION

1.2 TDM-PCM Interface Specification

The features of the SP150Q’s TDM-PCM controller include:

• Support of PCM slave mode with PCM_CLK input and PCM_FS input.

• Support of PCM master mode with with PCM_CLK input and PCM_FS
output generated internally

• PCM_CLK input frequency from 128 kHz to 8192 kHz

• Variable number of time-slots within a frame depending on PCM_CLK
frequency

• Support of PCM data format of 8-bits or 16-bits

• In master mode, SP150Q can generate other Frame Sync periods than the
standard Frame Sync period (125 µs).

• Support of short and long Frame Sync formats (active for 1 or 3 PCM_CLK
periods)

• Separated programmable time-slot-offset value for Tx and Rx, for each
voice channel.

It supports two channels of voice over TDM-PCM. This support is provided
by having two complete PCM controllers, each with its own full register set.
These two controllers are time division multiplexed on the PCM bus.

Sequans PCM interface takes PCM_CLK as an input in both master and slave
modes. It supports a set of different frequencies, in the range 128 kHz to 8192
kHz.

Caution: This clock signal is an input in both master and slave modes.

The signals implementing the PCM interface are detailed in 4.2.2 I2S/PCM

Interface Signals on page 36.

5 PROPRIETARY SP150Q DATASHEET

SEQUANS Communications

2

Regulatory Approval

Attention

FCC-ID: 2AAGMSP150Q (limited modular approval)

This above identified LTE radio module is not intended to be provided to
end-users but is for installation by OEM integrators only.

Installation/Integration

OEM integrators must follow Sequans installation instructions to provide for
and benefit from FCC compliant module integrations and must abide
especially by the following:

The maximum antenna gain values (accounting for cable attenuation) to
comply with the FCC maximum ERP/EIRP limits and with RF Exposure rules
will be provided in a future revision of this document for the following bands:

• LTE band 25 (1900+)

• LTE band 26 (850+)

• LTE band 2 (1900 PCS)

• LTE band 5 (850)

• LTE band 12 (700 a)

The Sequans' module integration guidelines must be closely followed.

Compliance of host integrations of the module is limited to hosts adaptation
designs which are identical to Sequans' reference design.

Host integrations with adaption designs deviating from Sequans' reference
design require either class 2 permissive change to this modular approval or a
separate host approval with different FCC-ID;

Host integrations with co-located (simultaneously operating) radio
transmitters must be evaluated in accordance with FCC multi-transmitter
rules and may require either class 2 permissive change to this modular
approval or a separate host approval with different FCC-ID, dependent on the
result of the evaluation; Inquiry at FCC or a TCB is urgently recommended.

Integrations of the module into host products which are intended for portable
use, i.e. less than 20cm distance between its radiating structures (antenna) and
the body of nearby persons, or which otherwise put additional technical
requirements like Hearing Aid compatibility require either class 2 permissive

SP150Q DATASHEET PROPRIETARY 6

SEQUANS Communications

REGULATORY APPROVAL

change to this modular approval or a separate host approval with different
FCC-ID;

Compliance with Unwanted Emission Limits for Digital Device

If the OEM host integration fully complies with the above described reference
design and can completely inherit and rest on compliance of the existing
modular approval the OEM remains still responsible to show compliance of
the overall end-product with the FCC limits for unwanted conducted and
radiated emissions from the digital device (unintentional radio) portion of
such end-product (commonly addressed as part 15B compliance or similar).

End-product Labelling

•FCC-ID

The module's FCC-ID must either be visible from the exterior of the host
product (e.g. per window) or per electronic display, or shall be displayed
on an additional exterior label per the following or similar string:

contains FCC-ID: 2AAGMSP150Q

• Digital Device - Unwanted Emissions Notice

If the end-product falls under part 15 of the FCC rules (it shall display the
following user notice on its exterior acc. to part 15.19 (the notice may be
printed in the manual in case the host is too small):

This device complies with Part 15 of the FCC Rules.Operation is
subject to the following two conditions:
(1) This device may not cause harmful interference,
and
(2) This device must accept any interference received, including
interference that may cause undesired operation.

• Further Labelling Requirements may apply dependent on the FCC rule
parts relevant to the host product.

• End-product User Instructions / Notices in the Manual

At a minimum, end-product users must be provided with the following
notices at a prominent location of the product literature furnished with the
product:

* Product Modifications
Modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this
equipment.
* RF Exposure Compliance
This equipment complies with FCC radio frequency radiation exposure
rules and limits set forth for an uncontrolled environment, when
installed and operated with minimum distance of 20cm between its
radiating structures (antenna) and the body of nearby persons and
when not operated simultaneously with other nearby
radio-transmitters.

7 PROPRIETARY SP150Q DATASHEET

SEQUANS Communications

REGULATORY APPROVAL

• Maximum Antenna Gain

The user instructions of end-products equipped with standard external
antenna connectors for the modular radio transmitter providing the option
to connect other antennae than those which may or may not be bundled
with the end-product must list the maximum allowed antenna gain values
as derived from those given above, accounting for the cable attenuations of
the actual installation.

• Digital Device - Unwanted Emissions Notice

If the end-product is or contains a digital device (unintentional radio
portions) and is not exempted by its use case (like vehicular use) the
following part 15.105 (b) user notice shall be provided at prominent loca­tion of the product literature:

This equipment has been tested and found to comply with the limits
for a Class B digital device, pursuant to part 15 of the FCC rules.
These limits are designed to provide reasonable protection against
harmful interference in a residential installation.
This equipment generates uses and can radiate radio frequency
energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the
following measures:
o Reorient or relocate the receiving antenna.
o Increase the separation between the equipment and receiver.
o Connect the equipment into an outlet on a circuit different from
that to which the receiver is connected.
o Consult the dealer or an experienced radio/TV technician for help

• Further User Notices

May be required dependent on the FCC rule parts relevant to the host
product.

• Non-allowed User Instructions

The end-product user guidance may NOT include instructions about how
to install or de-install the module.

SP150Q DATASHEET PROPRIETARY 8

SEQUANS Communications