SENA TECHNOLOGIES IW03 Users Manual

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Bluetooth® Serial Module

Application Note

Bluetooth Class 2 OEM Module

Model: Parani-BCD210

Ver 1.0

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1. General

The Parani-BCD210 is a Bluetooth Class 2 OEM module for OEM manufacturers who want to

implement Bluetooth Class 2 functionality with their products cost effectively and also in timely

manner. Users can build their own antenna circuit around the BCD210 to lower the overall cost

while benefit from the BCD210’s field-proven standard SPP (Serial Port Profile) firmware

provided with no additional cost.

The BCD210 supports Class 1 Bluetooth transmission level for longer communication distance

typically ranges from 100 m up to 1 km. The BCD210 supports UART, USB, I2C, PCM, PIO

interfaces for the communication with the OEM products.

The BCD210 is provided with Bluetooth v2.0 compatible firmware runs internally for SPP (Serial

Port Profile) applications by default. The SPP firmware supports up to 4 simultaneous multiple

connections and is designed to work out-of-box for real world SPP applications such as POS

(Point-of-sales), industrial automation, remote metering and other various applications.

Optionally, the BCD210 can be supplied with only software stack up to HCI level so entire

Bluetooth stack runs on the host side for the application such as USB dongles for computers, or

OEM manufacturers can even develop and embed their own firmware into the BCD210.

The BCD210 is fully qualified with Bluetooth v.2.0+EDR specification so OEM manufacturers

can save cost and time for overall OEM product certifications, which makes the BCD210 ideal

solution for larger volume and cost sensitive applications.

To comply with FCC RF exposure compliance requirements, the antenna used for this

transmitter must be installed to provide a separation distance of at least 20 cm from all persons

and must not be co-located or operate in conjunction with any other antenna or transmitter.”

As such, the radio component of this device is intended only for OEM integrators under the

following two conditions: The antenna must be installed such that 20 cm is maintained between

the antenna and users.

The transmitter module may not be co-located with any other transmitter or antenna.

As long as the two conditions above are met, further transmitter testing will not be required.

However, the OEM integrator is still responsible for testing their end product for any additional

compliance requirements required with this module installed (e.g., digital device emissions, PC

peripheral requirements).

In the event that these conditions cannot be met (for example, co-location with another

transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be

used on the final product. In these circumstances, the OEM integrator will be responsible for re-

evaluating the end product (including the transmitter) and obtaining a separate FCC

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authorization.

End Product Labeling The final end product must be labeled in a visible area with the following : “Contains Transmitter Module FCC ID: S7AIW03”. The radio component is an integral part of the Parani-BCD210DU and cannot be removed.

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1.1 Features

■ Fully qualified Bluetooth v2.0 + EDR

■ Full-speed Bluetooth operation

■ Full piconet and scatternet support

■ Minimum external components

■ Low-power 1.8V operation

■ 1.8V core, 1.8 to 3.6V I/O

■ Integrated 1.8V regulator

■ 8 x 8mm, 96-ball TFBGA and 6 x 6mm, 96-ball, VFBGA package options

■ USB v2.0 and dual UART ports

■ Support for IEEE 802.11 coexistence

■ Support for 8Mbit external Flash

■ Green (RoHS and no antimony or halogenated flame retardants)

1.2 Applications

■ PCs

■ PDAs

■ Computer accessories (compact Flash cards, PCMCIA cards, SD cards and USB dongles)

■ Access points

■ Digital cameras

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Model despription

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Model name Interface Connector

Parani-BCD210DU DIP, pin U.FL 5dBi dipole 3dBi dipole 1dBi stub

Parani-BCD210DS DIP, pin RPSMA 5dBi dipole 3dBi dipole 1dBi stub

Parani-BCD210DC DIP, pin CHIP 0dBi Chip

Parani-BCD210SU SMD, pad U.FL 5dBi dipole 3dBi dipole 1dBi stub

Parani-BCD210SC SMD, pad CHIP 0dBi Chip

Antenna

Type1 Type2 Type3

Use Antenna

Dipole antenna (M/N: R-AN2400-1901RS) Max Gain 5.37 dBi Dipole antenna (M/N: R-AN2400-5801RS) Max Gain 3.27 dBi

Dipole antenna (M/N: AN2400-3306RS) Max Gain 1.40 dBi

Chip antenna (SENA_F0615) Max Gain: 0.2dBi

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1.3 Device Diagram

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1.4 Pin Diagram

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1.5 Pin Descriptions

Function Pin Name Pin Number Description

USB Interface

UART Interface

PCM Interface

SPI Interface

PIO Interface

USB_DP 8 USB data plus

USB_DN 7 USB data minus

UART_TXD 11 UART data output

UART_RXD 12 UART data input

UART_RTS 10 UART request to send active low

UART_CTS 9 UART clear to send active low

PCM_OUT 25 Synchronous data output

PCM_IN 24 Synchronous data input

PCM_SYNC 23 Synchronous data sync

PCM_CLK 22 Synchronous data clock

SPI_MISO 30 SPI data output

SPI_MOSI 32 SPI data input

SPI_CSB 29 Chip select for SPI, active low

SPI_CLK 31 SPI clock

PIO_0 50 Programmable input/output line

PIO_1 49 Programmable input/output line

PIO_2 52 Programmable input/output line

PIO_3 51 Programmable input/output line

PIO_4 1 Programmable input/output line

PIO_5 20 Programmable input/output line

PIO_6 4 Programmable input/output line

PIO_7 3 Programmable input/output line

PIO_8 19 Programmable input/output line

PIO_9 13 Programmable input/output line

PIO_10 6 Programmable input/output line

PIO_11 14 Programmable input/output line

PIO_12 2 Programmable input/output line

PIO_13 15 Programmable input/output line

PIO_14 5 Programmable input/output line

PIO_15 21 Programmable input/output line

AIO_0 54 Analogue programmable input/output line

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AIO_1 55 Analogue programmable input/output line

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Power

LED Drivers

Others

VCC 16 Power supply for system, I/O, 3.3V

VCHG 35 Lithium ion/polymer battery charger input

VBAT 34 Lithium ion/polymer battery positive terminal

VREG_EN 33 Take high to enable internal regulators

GND 17 Ground

GND 18 Ground

GND 28 Ground

GND 36 Ground

GND 46 Ground

GND 48 Ground

GND 56 Ground

LED_0 26 LED driver

LED_1 27 LED driver

RF_I/O 47 Transmitter output/receiver input

RESETB 53 Reset, active low, > 5ms to cause a reset

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2. Electrical characteristics

2.1 Absolute maximum ratings

Ratings Min Max Unit

Storage Temperature -40 +85 °C

Operating Temperature -40 +85 °C

Supply voltage VCC -0.4 3.6 V

VREG_EN -0.4 4.9 V

VBAT -0.4 4.4 V

LED[1:0] -0.4 4.4 V

VCHG -0.4 6.5 V

Other terminal voltages GND – 0.4 VCC + 0.4 V

2.2 Recommended operating conditions

Ratings Min Typ Max Unit

Operating Temperature -30 20 +70 °C

Supply voltage VCC 3.1 3.3 3.5 V

VREG_EN 2.8 4.2 4.4 V

VBAT 2.8 4.2 4.4 V

LED[1:0] 2.8 4.2 4.4 V

VCHG 4.5 5.0 5.5 V

2.3 Power Consumption

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3. RF Characteristics

3.1 Basic Data Rate

3.1.1 Transmitter Performance

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RF Characteristics

VCC = 3.3V, 20°C

Min Typ Max Bluetooth

Specification

Unit

Output power 2 4 6 20 dBm

Power Density 2 4 6 20 dBm

Power Control 2 4 6 2 ≤ step ≤ 8 dB

TX Output Spectrum-Frequency range - - - 2400 ~2483.5 MHz

TX Output Spectrum-20dB Bandwidth - 940 1000 ≤ 1000 kHz

Adjacent

Channel Power

F = F0 ± 2MHz - -36 -20 ≤ -20 dBm

F = F0 ± 3MHz - -45 -40 ≤ -40 dBm

F = F0 ± > 3MHz - -50 -40 ≤ -40 dBm

Modulation

Characteristics

∆f1

140 165 175 140 ≤ ∆f1

avg

∆f2

115 142 - ∆f2

avg

∆f2

/∆f1

avg

0.80 0.92 - (∆f1

avg

≤ 175 kHz

avg

≥ 115 kHz

avg

/∆f2

avg

) ≥ 0.8

avg

Initial Carrier Frequency Tolerance -75 ±20 75 ≤ ±75 kHz

Carrier

Frequency Drift

Drift rate -20 - 20 ≤ ±20 kHz/50µs

1 slot Freq Drift -25 - 25 ≤ ±25 kHz

5 slot Freq Drift -40 - 40 ≤ ±40 kHz

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3.1.2 Transceiver

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RF Characteristics

VCC = 3.3V, 20°C

Out of band

Spurious

Emissions

0.030-1.000GHz - - -36 ≤ -36 dBm

1.000-12.75GHz - - -30 ≤ -30 dBm

1.800-5.100GHz - - -47 ≤ -47 dBm

5.100-5.300GHz - - -47 ≤ -47 dBm

Min Typ Max Specification Unit

3.1.3 Receiver Performance

RF Characteristics

VCC = 3.3V, 20°C

Sensitivity - Single slot packets (0.1%) -88 -85 -82 ≤ -70 dBm

Sensitivity - Multi slot packets (0.1%) -88 -85 -82 ≤ -70 dBm

C/I performance

at 0.1% BER

co-channel - - 11 ≤ -11 dB

F = F0 + 1MHz - - 0 ≤ 0 kHz

F = F0 – 1MHz - - 0 ≤ 0 dB

F = F0 + 2MHz - - -20 ≤ -20 dB

Min Typ Max Bluetooth

Specification

Unit

F = F0 – 2MHz - - -30 ≤ -30 dB

F = F0 – 3MHz - - -40 ≤ -40 dB

F = F0 + 5MHz - - -40 ≤ -40 dB

F = F

Blocking

performance

Inter-modulation performance -39 - - ≥ -39 dBm

Maximum input level at 0.1% BER -20 - - ≥ -20 dBm

0.030-2.000GHz -10 - - -10 dBm

2.000-2.400GHz -27 - - -27 dBm

2.500-3.000GHz -27 - - -27 dBm

3.000-12.75GHz -10 - - -10 dBm

- - -9 ≤ -9 dB

Image

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3.2 Enhanced Data Rate

3.2.1 Transmitter performance

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RF Characteristics

VCC = 3.3V, 20°C

Maximum RF Transmit Power 0 2 4 -6 to +4 dB

Relative Transmit Power -4 -1 1 -4 to +1 dB

Carrier

Frequency

Stability

Modulation

Accuracy

π/4

DQPSK

8DPSK | ω0 | -10 - 10

π/4

DQPSK

8DPSK RMS DEVM - - 13 ≤ 13 %

| ω0 | -10 - 10

| ωi | -75 - 75

| ω0 + ωi | -75 - 75

| ωi | -75 - 75

| ω0 + ωi | -75 - 75

RMS DEVM - - 20 ≤ 20 %

99% DEVM - - 30 ≤ 30 %

Peak DEVM - - 35 ≤ 35 %

99% DEVM - - 20 ≤ 20 %

Peak DEVM - - 25 ≤ 25 %

Min Typ Max Bluetooth

Specification

≤ ±10 for all blocks

≤ ±75 for all packets

≤ ±75 for all blocks

≤ ±10 for all blocks

≤ ±75 for all packets

≤ ±75 for all blocks

Unit

kHz

EDR Differential Phase Encoding 99 - - ≥ 99 %

In-band

Spurious

Emissions

(8DPSK)

F ≥ F0 + 3MHz - - -40 ≥ -40 dBm

F < F0 + 3MHz - - -40 ≥ -40 dBm

F = F0 – 3MHz - - -40 ≥ -40 dBm

F = F0 – 2MHz - - -20 ≥ -20 dBm

F = F0 – 1MHz - - -26 ≥ -26 dB

F = F0 + 1MHz - - -26 ≥ -26 dB

F = F0 + 2MHz - - -20 ≥ -20 dBm

F = F0 + 3MHz - - -40 ≥ -40 dBm

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3.2.2 Receiver performance

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RF Characteristics

VCC = 3.3V, 25°C

Sensitivity

at 0.01% BER

BER floor performance - - -60 ≤ -60 dBm

C/I Performance

(co-channel at 0.1% BER)

C/I

Performance

(Adjacent

Channel

Selectivity)

F = F0 + 1MHz π/4 DQPSK - - 0 ≤ 0 dB

F = F0 – 1MHz π/4 DQPSK - - 0 ≤ 0 dB

F = F0 + 2MHz π/4 DQPSK - - -30 ≤ -30 dB

F = F0 – 2MHz π/4 DQPSK - - -20 ≤ -20 dB

F ≥ F0 + 3MHz π/4 DQPSK - - -40 ≤ -40 dB

π/4 DQPSK -87 -84 -81 ≤ -70 dBm

8DPSK -87 -84 -81 ≤ -70 dBm

π/4 DQPSK - - 13 ≤ +13 dB

8DPSK - - 21 ≤ +21 dB

8DPSK - - 5 ≤ +5 dB

8DPSK - - -25 ≤ -25 dB

8DPSK - - -13 ≤ -13 dB

Min Typ Max Bluetooth

Specification

Unit

8DPSK - - -33 ≤ -33 dB

F ≤ F0 – 5MHz π/4 DQPSK - - -40 ≤ -40 dB

8DPSK - - -33 ≤ -33 dB

F = F

Maximum input level

at 0.1% BER

π/4 DQPSK - - -7 ≤ -7 dB

Image

8DPSK - - 0 ≤ 0 dB

π/4 DQPSK -20 - - ≥ -20 dBm

8DPSK -20 - - ≥ -20 dBm

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4. Device Terminal Descriptions

4.1 UART Interface

This is a standard UART interface for communicating with other serial devices.

BCD210 UART interface provides a simple mechanism for communicating with other serial

device using the RS232 protocol.

When BCD210 is connected to another digital device, UART_RX and UART_TX transfer data

between the two devices. The remaining two signals, UART_CTS, UART_RTS, can be used to

implement RS232 hardware flow control where both are active low indicators. All UART

connections are implemented using CMOS technology and have signaling levels of 0V and 3.3V

Parameter Possible Values

Baud Rate Minimum 1200 baud (2%Error)

Maximum 4M baud (1%Error)

Flow Control RTS/CTS or None

Parity None, Odd or Even

Number of Stop Bits 1 or 2

Bits per Channel 8

[Possible UART Settings]

4.2 USB Interface

BCD210 USB devices contain a full speed (12Mbits/s) USB interface that is capable of driving

of a USB cable directly. No external USB transceiver is required. The device operates as a USB

peripheral, responding to requests from a master host controller such as a PC. Both the OHCI

and the UHCI standards are supported. The set of USB endpoints implemented behave as

specified in the USB section of the Bluetooth specification v2.0+EDR or alternatively can appear

as a set of endpoints appropriate to USB audio devices such as speakers.

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As USB is a Master/Slave oriented system (in common with other USB peripherals), BCD210

only supports USB slave operation.

The USB data lines emerge as pins USB_DP and USB_DN. These terminals are connected to

the internal USB I/O buffers of the BCD210, therefore, have low output impedance. To match

the connection to the characteristic of the USB cable, resistors must be placed in series with

USB_DP/USB_DN and the cable.

BCD210 features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when

BCD210 is ready to enumerate. It signals to the PC that it is a full speed (12Mbit/s) USB device.

The USB internal pull-up is implemented as a current source, and is compliant with section

7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V

when loaded with a 15KΩ±5% pull-down resistor (in the hub/host) when VDD_PADS=3.1V. This

presents a Thevenin resistance to the host of at least 900Ω. Alternatively, an external 1.5KΩ

pull-up resistor can be placed between a PIO line and D+ on the USB cable. The firmware must

be alerted to which mode is used by PS key PSKEY_USB_PIO_PULLUP appropriately. The

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default setting uses the internal pull-up resistor.

4.3 I2C Interface

PIO[8:6] can be used to form a mater I2C interface. The interface is formed using software to

drive these lines. Therefore, it is suited only to relatively slow functions such as driving a dot

matrix LCD (Liquid Crystal Display), keyboard scanner or EEPROM.

Notes:

PIO lines need to be pull-up through 2.2KΩ resistors.

PIO[7:6] dual functions, UART bypass and EEPROM support, therefore, devices using an

EEPROM cannot support UART bypass mode.

For connection to EEPROMs, refer to CSR documentation on I

BlueCore. This provides information on the type of devices currently supported.

C EEPROM for use with

4.4 PCM CODEC Interface

PCM (Pulse Code Modulation) is a standard method used to digitize audio (particularly voice)

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for transmission over digital communication channels. Through its PCM interface, BCD210 has

hardware support for continual transmission and reception of PCM data, thus reducing

processor overhead for wireless headset applications. BCD210 offers a bi-directional digital

audio interface that route directly into the baseband layer of the on-chip firmware. It does not

pass through the HCI protocol layer.

Hardware on BCD210 allows the data to be sent to and received from a SCO connection.

Up to three SCO connections can be supported by the PCM interface at any on time.

BCD210 can operate as PCM interface Master generating an output clock of 128, 256, or

512kHz. When configured as PCM interface slave, it can operate with an input clock up to

2048kHz. BCD210 is compatible with a variety of clock formats, including Long Frame Sync,

Short Frame Sync and GCI timing environments.

It supports 13-bit or 16-bit liner, 8-bit u-law or A-law companied sample formats at 8k samples/s

and can receive and transmit on any selection of three of the first four slots following

PCM_SYNC. The PCM configuration options are enabled by setting the PS Key

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PSKEY_PCM_CONFIG32 (0x1b3).

BCD210 interfaces directly to PCM audio devices including the following:

 Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices

 OKI MSM7705 four channel A-raw and u-law CODEC

 Motorola MC145481 8-bit A-law and u-law CODEC

 Motorola MC145483 13-bit linear CODEC

 STW 5093 and 5094 14-bit linear CODECs

 BCD210 is also compatible with the Motorola SSI

interface

4.5 I/O Parallel Ports

PIO lines can be configured through software to have either weak or strong pull-downs. All PIO

lines are configured as inputs with weak pull-downs at reset.

Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep

modes. PIO_6 or PIO_2 can be configured as a request line for an external clock source. This is

useful when the clock to BCD210 is provided from a system ASIC (Application Specific

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Integrated Circuit). Using PSKEY_CLOCK_REQUEST_ENABLE (0x246), this terminal can be

configured to be low when BCD210 is in Deep Sleep and high when a clock is required. The

clock must be supplied within 4ms of the rising edge of PIO_6 or PIO_2 to avoid losing timing

accuracy in certain Bluetooth operating modes.

BCD210 has three general purpose analogue interface pins, AIO_0, AIO_1 and AIO_2. These

are used to access internal circuitry and control signals. One pin is allocated to decoupling for

the on-chip band gap reference voltage, the other two may be configured to provide additional

functionality.

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4.6 Reset Interface

BCD210 may be reset from several sources: RESETB pin, power on reset, a UART break

character or via a software configured watchdog timer.

The RESETB pin is an active low reset and is internally filtered using the internal low frequency

clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESETB being

active. It is recommended that RESETB be applied for a period greater than 5ms.

The power on reset occurs when the VDD_CORE supply falls below typically 1.5V and is

released when VDD_CORE rises above typically 1.6V.

At reset the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The

PIOs have weak pull-downs.

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5. Application Schematic

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[Power Supply and Reset Interface]

[Serial Interface for Host PC]

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[USB Interface]

C Interface]

[PCM Interface]

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7. Solder Profiles

The soldering profile depends on various parameters necessitating a set up for each application.

The data here is given only for guidance on solder re-flow. There are four zones:

 Preheat Zone – This zone raises the temperature at a controlled rate, typically 1-2.5°C/s  Equilibrium Zone – This zone brings the board to a uniform temperature and also

activates the flux. The duration in this zone (typically 2-3 minutes) will need to be adjusted

to optimize the out gassing of the flux.

 Reflow Zone – The peak temperature should be high enough to achieve good wetting but

not so high as to cause component discoloration or damage. Excessive soldering time can

lead to intermetal growth which can result in a brittle joint.

 Cooling Zone – The cooling rate should be fast, to keep the solder grains small which will

give a longer lasting joint. Typical rates will be 2-5°C/s

[Typical Lead-Free Re-flow Solder Profile]

Key features of the profile:

 Initial Ramp = 1-2.5°C/sec to 175°C±25°C equilibrium

 Equilibrium time = 60 to 180 seconds

 Ramp to Maximum temperature (245°C) = 3°C/sec max.

 Time above liquids temperature (217°C): 45~90 seconds

 Device absolute maximum reflow temperature: 260°C

Devices will withstand the specified profile.

Lead-free devices will withstand up to three reflows to a maximum temperature of 260°C

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8. Packaging Information

TBD

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9. Contact Information

Technical Support

Sena Technologies, Inc.

210 Yangjae-dong, Seocho-gu

Seoul 137-130, Korea

Tel: (+82-2) 573-5422

Fax: (+82-2) 573-7710

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E-Mail: support@sena.com

Website: http://www.sena.com

11. Document History

Date Revision Reason of Change

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12. Certificate Information

12.1 FCC

FCC Rule: Part 15 Subpart C Section 15.247 FCCID: S7AIW03

12.1.1 FCC Compliance Statement

This device complies with part 15 of the FCC Rules. Operation is subject to the following two

conditions:

(1) This device may not cause harmful interference, and (2) This device must accept any interference received,

Including interference that may cause undesired operation

Information to User

This equipment has been tested and found to comply with limits for a Class B digital device, Pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.

This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by on or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver-Connect the equipment into an outlet a circuit different form that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

12.1.2 RF Exposure Statement

The equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This device and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter.

12.1.3 Do not

Any changes or modifications to the equipment not expressly approved by the party responsible for compliance could void user’s authority to operate the equipment.

To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operate in conjunction with any other antenna or transmitter.”

As such, the radio component of this device is intended only for OEM integrators under the following two conditions: The antenna must be installed such that 20 cm is maintained between the antenna and users.

The transmitter module may not be co-located with any other transmitter or antenna.

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (e.g., digital device emissions, PC peripheral requirements).

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In the event that these conditions cannot be met (for example, co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

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End Product Labeling

The final end product must be labeled in a visible area with the following : “Contains Transmitter Module FCC ID: S7AIW03”.

The radio component is an integral part of the Parani-BCD210DU and cannot be removed.

12.2 CE

1177

Declare under our own responsibility that the product

Bluetooth Module

Brand name: SENA

Model No.: Parani-BCD210DU / Parani-BCD210DC / Parani-BCD210DS

Parani-BCD210SU / Parani-BCD210SC

To which this declaration refers conforms with the relevant standards or other standardizing

documents

EN 60950-1

ETSI EN 301 489-1 ETSI EN 301 489-17 ETSI EN 300 328

According to the regulations in Directive 1999/5/EC

12.3 IC

“This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.”

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Radio Cert. No.: IC: 8154A-IW03

12.4 KC

Type Registration Certification No: KCC-CRM-SNA-IW03

Sena Technologies, Inc.

http://www.sena.com

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12.5 JAPAN MIC

Technical Regulations for Specified Radio Equipment Article 2, Section 1 (19) Certification No:

12.6 SIG

QDID: B016862

Model Name: Parani-BCD210

Core Version: 2.0+EDR

Product Type: End Product

Declared Specifications: Baseband Conformance, Radio, Service Discovery Protocol,

Logical Link Control and Adaption Protocol, Generic Access Profile, Link Manager,

RFCOMM,

Serial Port Profile, Host Controller Interface, Summary ICS, Product Type

Sena Technologies, Inc.

http://www.sena.com

Page 24 of 24

SENA TECHNOLOGIES IW03 Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual