The SC1102 is a low-cost, full featured, synchronous
voltage-mode controller designed for use in single
ended power supply applications where efficiency is of
primary concern. Synchronous operation allows for the
elimination of heat sinks in many applications. The
SC1102 is ideal for implementing DC/DC converters
needed to power advanced microprocessors in low
cost systems, or in distributed power applications
where efficiency is important. Internal level-shift, highside drive circuitry, and preset shoot-thru control, allows the use of inexpensive N-channel power switches.
SC1102 features include temperature compensated
voltage reference, triangle wave oscillator and current
sense comparator circuitry. Power good signaling,
shutdown, and over voltage protection are also provided.
The SC1102 operates at a fixed 200kHz, providing an
optimum compromise between efficiency, external
component size, and cost.
APPLICATION CIRCUIT
Typical Distributed Power Supply
FEATURES
•
1.265V Reference available
•
Synchronous operation
•
Over current fault monitor
•
On-chip power good and OVP functions
•
Small size with minimum external components
•
Soft Start
•
R
Current sensing
DS(ON)
APPLICATIONS
•
Microprocessor core supply
•
Low cost synchronous applications
•
Voltage Regulator Modules (VRM)
ORDERING INFORMATION
DEVICE
SC1102CSTRSO-140 - 125°C
SC1102EVBEvaluation Board
Note:
(1) Only available in tape and reel packaging. A reel
contains 2500 devices.
SYNCHRONOUS DC/DC CONTROLLER FOR
DISTRIBUTED POWER SUPPLY APPLICATIONS
September 5, 2000
PIN DESCRIPTION
Pin #Pin NamePin Function
1 VCCChip supply voltage
2PWRGDLogic high indicates correct output voltage
3OVPOver voltage protection.
4OCSETSets the converter overcurrent trip point
5PHASEInput from the phase node between the MOSFET’S
6DHHigh side driver output
7PGNDPower ground
8DLLow side driver output
9BSTLBootstrap, low side driver.
10BSTHBootstrap, high side driver.
11SENSEVoltage sense input
SC1102
12VREFBuffered band gap voltage reference.
13SS/SHDNSoft start. A capacitor to ground sets the slow start time.
14GNDSignal ground
NOTE:
(1) All logic level inputs and outputs are open collector TTL compatible.
SYNCHRONOUS DC/DC CONTROLLER FOR
DISTRIBUTED POWER SUPPLY APPLICATIONS
SC1102
Synchronous Buck Converter
Primary V
power is provided by a synchronous,
CORE
voltage-mode pulse width modulated (PWM) controller.
This section has all the features required to build a
high efficiency synchronous buck converter, including
“Power Good” flag, shut-down, and cycle-by-cycle current limit.
The output voltage of the synchronous converter is set
and controlled by the output of the error amplifier. The
external resistive divider reference voltage is derived
from an internal trimmed-bandgap voltage reference
(See Fig. 1). The inverting input of the error amplifier
receives its voltage from the SENSE pin.
The internal oscillator uses an on-chip capacitor and
trimmed precision current sources to set the oscillation
frequency to 200kHz. The triangular output of the oscillator sets the reference voltage at the inverting input
of the comparator. The non-inverting input of the comparator receives it’s input voltage from the error amplifier. When the oscillator output voltage drops below the
error amplifier output voltage, the comparator output
goes high. This pulls DL low, turning off the low-side
FET, and DH is pulled high, turning on the high-side
FET (once the cross-current control allows it). When
the oscillator voltage rises back above the error amplifier output voltage, the comparator output goes low.
This pulls DH low, turning off the high-side FET, and
DL is pulled high, turning on the low-side FET (once
the cross-current control allows it).
As SENSE increases, the output voltage of the error
amplifier decreases. This causes a reduction in the ontime of the high-side MOSFET connected to DH,
hence lowering the output voltage.
Under Voltage Lockout
The under voltage lockout circuit of the SC1102 assures that the high-side MOSFET driver outputs remain in the off state whenever the supply voltage drops
below set parameters. Lockout occurs if V
4.1V. Normal operation resumes once V
falls below
CC
rises above
CC
4.2V.
Over-Voltage Protection
The over-voltage protection pin (OVP) is high only
when the voltage at SENSE is 20% higher than the target value programmed by the external resistor divider.
The OVP pin is internally connected to a PNP’s
collector.
Power Good
The power good function is to confirm that the regulator outputs are within +/-10% of the programmed
level. PWRGD remains high as long as this condition
is met. PWRGD is connected to an internal open collector NPN transistor.
Soft Start
Initially, SS/SHDN sources 10µA of current to charge
an external capacitor. The outputs of the error amplifiers are clamped to a voltage proportional to the voltage on SS/SHDN. This limits the on-time of the highside MOSFETs, thus leading to a controlled ramp-up
of the output voltages.
Current Limiting
R
DS(ON)
The current limit threshold is set by connecting an
external resistor from the V
supply to OCSET. The
CC
voltage drop across this resistor is due to the 200µA
internal sink sets the voltage at the pin. This voltage
is compared to the voltage at the PHASE node. This
comparison is made only when the high-side drive is
high to avoid false current limit triggering due to uncontributing measurements from the MOSFET’s offvoltage. When the voltage at PHASE is less than the
voltage at OCSET, an overcurrent condition occurs
and the soft start cycle is initiated. The synchronous
switcher turns off and SS/SHDN starts to sink 2µA.
When SS/SHDN reaches 0.8V, it then starts to
source 10µA and a new cycle begins.
Hiccup Mode
During power up, the SS/SHDN pin is internally
pulled low until VCC reaches the undervoltage lockout level of 4.2V. Once V
has reached 4.2V, the
CC
SS/SHDN pin is released and begins to source 10µA
of current to the external soft-start capacitor. As the
soft-start voltage rises, the output of the internal error
amplifier is clamped to this voltage. When the error
signal reaches the level of the internal triangular oscillator, which swings from 1V to 2V at a fixed frequency of 200 kHz, switching occurs. As the error
signal crosses over the oscillator signal, the duty cycle of the PWM signal continues to increase until the
output comes into regulation. If an over-current condition has not occurred the soft-start voltage will continue to rise and level off at about 2.2V.
SYNCHRONOUS DC/DC CONTROLLER FOR
DISTRIBUTED POWER SUPPLY APPLICATIONS
SC1102
THEORY OF OPERATION (CON’T)
An over-current condition occurs when the high-side
drive is turned on, but the PHASE node does not
reach the voltage level set at the OCSET pin. The
PHASE node is sampled only once per cycle during the
valley of the triangular oscillator. Once an over-current
occurs, the high-side drive is turned off and the lowside drive turns on and the SS/SHDN pin begins to
sink 2uA. The soft-start voltage will begin to decrease
as the 2uA of current discharges the external capacitor. When the soft-start voltage reaches 0.8V, the SS/
SHDN pin will begin to source 10uA and begin to
charge the external capacitor causing the soft-start
voltage to rise again. Again, when the soft-start voltage reaches the level of the internal oscillator, switching will occur.
APPLICATION CIRCUIT
Typical 12V Application Circuit with Bootstrapped BSTH
+5V
PWRGD
OVP
R1
R2
1k
1.74k
C1
0.1
C2
0.1
R3
1k
D1
MBR0520
R4
10
U1
SC1102
1
VCC
2
PWRGD
3
OVP
4
OCSET
5
PHASE
6
DRVH
7
PGND
GND
SS/SHDN
VREF
SENSE
BSTH
BSTL
DRVL
14
C3
SHDN
0.1
13
12
11
10
9
8
VREF
C4
1.0
R6
2.2
If the over-current condition is no longer present, normal operation will continue. If the over-current condition is still present, the SS/SHDN pin will again begin to
sink 2uA. This cycle will continue indefinitely until the
over-current condition is removed.
In conclusion, below is shown a typical “12V Application Circuit” which has a BSTH voltage derived by bootstrapping input voltage to the PHASE node through
diode D1. This circuit is very useful in cases where only
input power of 12V is available.
In order to prevent substrate glitching, a small-signal
diode should be placed in close proximity to the chip
with cathode connected to PHASE and anode connected to PGND.