Semtech SMF05C Schematic [ru]

SMF05C

TVS Diode Array

For ESD and Latch-Up Protection

PROTECTION PRODUCTS

Description

The SMF series TVS arrays are designed to protect sen­sitive electronics from damage or latch-up due to ESD
and other voltage-induced transient events. They are
designed for use in applications where board space is at
a premium. Each device will protect up to five lines. They
are unidirectional devices and may be used on lines where
the signal polarities are above ground.

TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sec­tional area junctions for conducting high transient cur­rents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.

The SMF series devices may be used to meet the immu­nity requirements of IEC 61000-4-2, level 4. The small
SC70 package makes them ideal for use in portable elec­tronics such as cell phones, PDA’s, notebook comput­ers, and digital cameras.

PRELIMINARY

Features

 ESD protection for data lines to

IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)

 Small package for use in portable electronics
 Protects five I/O lines
 Working voltage: 5V
 Low leakage current
 Low operating and clamping voltages
 Solid-state silicon-avalanche technology

Mechanical Characteristics

 EIAJ SC70-6L package
 Molding compound flammability rating: UL 94V-0
 Marking : Marking Code
 Packaging : Tape and Reel per EIA 481

Applications

 Cellular Handsets and Accessories
 Cordless Phones
 Personal Digital Assistants (PDA’s)
 Notebooks and Handhelds
 Portable Instrumentation
 Digital Cameras
 Peripherals
 MP3 Players

Circuit Diagram Schematic & PIN Configuration

134 56

1

2

34

Revision 08/04/04

2

1

SC70-6L (Top View)

6

5

www.semtech.com

SMF05C

PROTECTION PRODUCTS

Absolute Maximum Rating

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Electrical Characteristics

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PRELIMINARY

kp

PP

V

DSE

L

J

GTS

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8A

02
51

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051+ot55-

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o

C

o

C

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C

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MWR

RB

R

C

C

j

I

t

V

MWR

I

PP

I

PP

V

R

Am1=6 V

C°52=T,V5=5Aµ

t,A5=

p

t,A8=

p

sµ02/8=8.9V

sµ02/8=5.21V

zHM1=f,V0=031Fp

5V

2 2004 Semtech Corp.

www.semtech.com

SMF05C

µ

PROTECTION PRODUCTS

PROTECTION PRODUCTS

Typical Characteristics

Non-Repetitive Peak Pulse Power vs. Pulse Time

10

(kW)

pk

1

0.1

Peak Pulse Power - P

0.01

0.1 1 10 100 1000

Pulse Duration - t

Pulse Waveform

110

100

90

80

PP

70

60

50

40

Percent of I

30

20

10

0

0 5 10 15 20 25 30

-t

e

Time (µs)

td = IPP/2

(µs)

p

Waveform

Parameters:

tr = 8µs

td = 20µs

PRELIMINARY

Power Derating Curve

110

100

90

PP

80

70

60

50

40

30

% of Rated Power or I

20

10

0

0 25 50 75 100 125 150

Ambient Temperature - T

Clamping Voltage vs. Peak Pulse Current

9

8

7

(V)

C

6

5

4

3

2

Clamping Voltage - V

1

0

0246810

Peak Pulse Current - I

(oC)

A

Waveform

Parameters:

tr = 8µs

td = 20

s

(A)

PP

Capacitance vs. Reverse Voltage ESD Clamping Characteristics

(8kV Contact Discharge per IEC 61000-4-2)

140

120

100

(pF)

j

80

60

40

Capaci tance - C

20

0

0123456

Reverse Voltage - V

(V)

R

f = 1MHz

3 2004 Semtech Corp.

www.semtech.com

SMF05C

PROTECTION PRODUCTS

Applications Information

Device Connection for Protection of Five Data Lines

The SMF05C is designed to protect up to five unidirec­tional data lines. The device is connected as follows:

1. Unidirectional protection of five I/O lines is
achieved by connecting pins 1, 3, 4, 5 and 6 to the
data lines. Pin 2 is connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces.

Circuit Board Layout Recommendations for Suppres­sion of ESD.

Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:

z Place the SMF05C near the input terminals or

connectors to restrict transient coupling.

z Minimize the path length between the SMF05C and

the protected line.

z Minimize all conductive loops including power and

ground loops.

z The ESD transient return path to ground should be

kept as short as possible.

z Never run critical signals near board edges.
z Use ground planes whenever possible.

PRELIMINARY

SMF05C Circuit Diagram

134 56

2

Protection of Five Unidirectional Lines

Matte Tin Lead Finish

Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com­pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.

4 2004 Semtech Corp.

www.semtech.com

SMF05C

PROTECTION PRODUCTS

PROTECTION PRODUCTS

Typical Applications

PRELIMINARY

5 2004 Semtech Corp.

www.semtech.com

SMF05C

PROTECTION PRODUCTS

Outline Drawing - SC70 6L

A

e1

D

N

2X

E/2

E

EI

ccc C

2X N/2 TIPS

aaa C

SEATING
PLANE

NOTES:

1.

2. -A-

3.

4.

C

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

DATUMS AND TO BE DETERMINED AT DATUM PLANE

DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.

REFERENCE JEDEC STD MO-203, VARIATION AB.

12

B

D

-B-

e

A2

A1

bxN

bbb C A-B D

A

SIDE VIEW

GAGE

PLANE

0.15

-H-

PRELIMINARY

DIMENSIONS

DIM

SEE DETAIL A

H

c

L

01

DETAIL

(L1)

A

INCHES

MIN NOM MAX MIN MAX

---

A

.000

A1

.028
.006
.003

.045

.010

0°

.035

-

­.079
.049

.083 BSC
.026 BSC

.014

(.017)

6

­.004
.004
.012

A2

E1

e1

L1

01

aaa
bbb

ccc

b
c

D

E

e

L

N

MILLIMETERS

.043
.004 0.00
.039

0.70
.012 0.15
.009

0.08

1.90.075

.083
.053 1.15

0.26

8° 0°

NOM

-

2.10 BSC

0.65 BSC

1.30 BSC.051

(0.42)

0.90

2.00

1.25

0.36.018

6

0.10

0.10

0.30

-

1.10

-

0.10

1.00

-

0.30

-

0.22

2.10

1.35

0.46

-

8°

Land Pattern - SC70 6L

C

NOTES:

1.

X

DIM

DIM

Z

G

Y

P

THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.

DIMENSIONS

DIMENSIONS

INCHES

INCHES

C

C
G

G
P

P
X

X
Y

Y
Z

Z

(.073)

.039
.026
.016
.033
.106

MILLIMETERS

MILLIMETERS

(1.85)

1.00

0.65

0.40

0.85

2.70

6 2004 Semtech Corp.

www.semtech.com

SMF05C

PROTECTION PRODUCTS

PROTECTION PRODUCTS

Marking Codes

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C50FMSC5

Note:
(1) Pin 1 Identified with a dot

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edoC

Ordering Information

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CT.C50FMSbPnS000,3hcnI7

TCT.C50FMSnSettaM000,3hcnI7

PRELIMINARY

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Contact Information

Semtech Corporation

Protection Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: [phone] FAX [phone]

7 2004 Semtech Corp.

www.semtech.com