PROGRAMMABLE SYNCHRONOUS
DC/DC HYSTERETIC CONTROLLER
WITH VRM 9.0 VID RANGE
SC1155
DESCRIPTION
The SC1155 is a synchronous-buck switch-mode controller designed for use in single ended power supply
applications where efficiency is the primary concern.
The controller is a hysteretic type, with a user selectable hysteresis. The SC1155 is ideal for implementing DC/DC converters needed to power advanced microprocessors such as Pentium
®
llI and Athlon®, in both
single and multiple processor configurations. Inhibit,
under-voltage lockout and soft-start functions are included for controlled power-up.
SC1155 features include an integrated 5 bit D/A converter, temperature compensated voltage reference,
current limit comparator, over-current protection, and
an adaptive deadtime circuit to prevent shoot-through
of the power MOSFET during switching transitions.
Power good signaling, logic compatible shutdown, and
over-voltage protection are also provided. The integrated D/A converter provides pr ogrammability of output voltage from 1.1V to 1.85V in 25mV increments.
The SC1155 high side driver can be configured as
either a grounded reference or as a floating bootstrap
driver. The high and low side MOSF ET drivers have a
peak current rating of 2 amps.
14V
BOOT to DRVGND25V
BOOT to BOOTLO15V
Digital Inputs-0.3 to +7.3V
AGND to DRVGND+
0.5VV
LOHIB to AGND14V
LOSENSE to AGND14V
IOUTLO to AGND14V
HISENSE to AGND14V
VSENSE to AGND5V
Continuous Power Dissipation, T
Continuous Power Dissipation, T
Operating Junction TemperatureT
Lead Temperature (Soldering) 10 secondsT
Storage TemperatureT
1IOUTCurrent Out. The output voltage on this pin is proportional to the load current as measured
x I
across the high side MOSFET, and is approximately equal to 2 x R
DS(ON)
2DROOPDroop Voltage. This pin is used to set the amount of output voltage set-point droop as a
function of load current. The voltage is set by a resistor divider between IOUT and AGND.
3OCPOver Current Protection. This pin is used to set the trip point for over current protection by a
resistor divider between IOUT and AGND.
4VHYSTHysteresis Set Pin. This pin is used to set the amount of hysteresis required by a resistor
divider between VREFB and AGND.
5VREFBBuffered Reference Voltage (from VID circuitry).
6VSENSE Output Voltage Sense.
7AGNDSmall Signal Analog and Digital Ground.
8SOFTSTSoft Start. Connecting a capacitor from this pin to AGND sets the time delay.
LOAD
.
9NCNot connected
10LODRVLow Drive Control. Connecting this pin to +5V enables normal operation. When LOHIB is
grounded, this pin can be used to control LOWDR.
11LOHIBLow Side Inhibit. This pin is used to eliminate shoot-thru current.
12DRVGND Power Ground. Insure output capacitor ground is connected to this pin.
13LOWDRLow Side Driver Output. Connect to gate of low side MOSFET.
14DRVDrive Regulator for the MOSFET Drivers.
15VIN12V12V Supply. Connect to 12V power rail.
16BOOTBootstrap. This pin is used to generate a floating drive for the high side FET driver.
17HIGHDR High Side Driver Output. Connect to gate of high side MOSFET.
18BOOTLO Bootstrap Low. In desktop applications, this pin connects to DRVGND.
19HISENSE High Current Sense. Connected to the drain of the high side FET, or the input side of a current
sense resistor between the input and the high side FET.
20LOSENSE Low Current Sense. Connected to the source of the high side FET, or the FET side of a current
sense resistor between the input and the high side FET.
21IOUTLOThis is the sampling capacitors bottom leg. Voltage on this pin is voltage on the LOSENSE pin
when the high side FET is on.
22INHIBITInhibit. If this pin is grounded, the MOSFET drivers are disabled. Usually connected to +5V
through a pull-up resistor.
23VID4
24VID3
25VID2
26VID1
27VID0
28PWRGD
(1)
Programming Input (MSB).
(1)
Programming Input.
(1)
Programming Input.
(1)
Programming Input.
(1)
Programming Input (LSB).
(1)
Power Good. This open collector logic output is high if the output voltage is within 5% of the set
Notes
(1) Guaranteed, but not tested.
(2) Test circuit and timing diagram.
(3) This device is ESD sensitive. Use of standard ESD handling precautions is required.
PROGRAMMABLE SYNCHRONOUS
DC/DC HYSTERETIC CONTROLLER
WITH VRM 9.0 VID RANGE
SC1155
(V)
NOTE:
(1) If the VID bits are set to 11111, then the high-side and the low-side driver outputs will be set low, turning both
MOSFETs off, and the controller will be set to a low-Iq state.
PROGRAMMABLE SYNCHRONOUS
DC/DC HYSTERETIC CONTROLLER
WITH VRM 9.0 VID RANGE
SC1155
FUNCTIONAL DESCRIPTION
Reference/Voltage Identification
The reference/voltage identif ication (VID) section consists of a temperature compensated bandgap reference and a 5-bit voltage selection network. The 5 VID
pins are TTL compatable inputs to the VID selection
network. They are internally pulled up to +5V generated from the +12V supply by a resistor divider, and
provide programm ability of output voltage from 1.1V to
1.85V in 25mV increments.
Refer to the Output Voltage Table for the VID code
settings. The output voltage of the VID network, VREF
is within 1% of the nominal setting over the full input
and output voltage range and junction temperature
range. The output of the reference/VID network is
indirectly brought out through a buffer to the REFB pin.
The voltage on this pin will be within 3mV of VREF. It is
not recommended to dr ive loads with REFB other than
setting the hysteresis of the hysteretic comparator,
because the current drawn from REFB sets the charging current for the sof t s tart c apac itor. Ref er to the s of t
start section for additional information.
Hysteretic Comparator
The hysteretic comparator regulates the output voltage
of the synchronous-buck conver ter. The hysteresis is
set by connecting the center point of a resistor divider
from REFB to AGND to the HYST pin. The hysteresis
of the comparator will be equal to twice the voltage
difference between REFB and HYST, and has a m aximum value of 60mV. The maximum propagation delay
from the comparator inputs to the driver outputs is
250ns.
Low Side Driver
The low side driver is designed to drive a low R
N-channel MOSFET, and is rated for 2 amps source
and sink current. The bias for the low side driver is
provided internally from VDRV.
High Side Driver
The high side driver is designed to drive a low R
N-channel MOSFET, and is rated for 2 amps source
and sink current. It can be configured either as a
ground referenced driver or as a floating bootstrap
driver. When configured as a floating driver, the bias
voltage to the driver is developed from the DRV regulator. The internal bootstr ap diode, connected between
DS(ON)
DS(ON)
the DRV and BOOT pins, is a Schottky for improved
drive efficiency. The maximum voltage that can be
applied between the BOOT pin and ground is 25V. The
driver can be referenced to ground by connecting
BOOTLO to PGND, and c onnecting +12V to the BO O T
pin.
Deadtime Control
Deadtime control prevents shoot- through current from
flowing through the main power FET s during switching
transitions by actively controlling the turn-on times of
the FET drivers. T he high side driver is not allowed to
turn on until the gate drive voltage to the low-side FET
is below 2 volts. The low side driver is not allowed to
turn on until the voltage at the junction of the 2 FETs
(VPHASE) is below 2 volts. An internal low-pass filter
with an 11MHz pole is located between the output of
the low-side driver (DL) and the input of the deadtime
circuit. This controls the high-side driver by filtering out
the noise that could appear on DL when the high-side
driver turns on.
Current Sensing
Current sensing is achieved by sampling and holding
the voltage across the high side FET while it is turned
on. The sampling network consists of an internal 50Ω
switch and an external 0.1µF hold capacitor . Internal
logic controls the turn-on and turn-off of the sample/
hold switch such that the switch does not tur n on until
VPHASE transitions high and turns of f when the input
to the high side driver goes low. Thus sampling will
occur only when the high side FET is conducting current. The voltage at the IO pin equals 2 times the
sensed voltage. In applications where a higher accuracy in current sensing is required, a sense resistor can
be placed in series with the high side FET and the
voltage across the sense resistor can be sampled by
the current sensing circuit.
Droop Compensation
The droop compensation network reduces the load
transient overshoot/undershoot at VOUT, relative to
VREF. VOUT is programmed to a voltage greater than
VREF (equal to VREF x (1+R5/R6)) by an external
resistor divider from VOUT to the VSENSE pin to
reduce the undershoot on VOUT during a low to high
load current transient. The over shoot during a high to
low load current transient is reduced by subtracting the
voltage that is on the DROOP pin from VREF. The
voltage on the IO pin is divided down with an external
PROGRAMMABLE SYNCHRONOUS
DC/DC HYSTERETIC CONTROLLER
WITH VRM 9.0 VID RANGE
SC1155
FUNCTIONAL DESCRIPTION (cont.)
resistor divider, and connected to the DROOP pin.
Thus, under loaded conditions, VOUT is regulated to
Vout = Vref • (1+R7/R8) - IOUT • R2/(R1+R2).
Inhibit
The inhibit pin is a TTL compatible digital pin that is
used to enable the controller. When INH is low, the
output drivers are low, the soft start capacitor is discharged, the soft start cur rent source is disabled, and
the controller is in a low I
the short across the soft start capacitor is removed, the
soft start current source is enabled, and normal converter operation begins. W hen the system logic supply
is connected to INH, it controls power sequencing by
locking out controller operation until the system logic
supply exceeds the input threshold voltage of the INH
circuit; thus the +12V supply and the system logic
supply (either +5V or 3.3V) must be above UVLO
thresholds before the controller is allowed to start up.
VIN
The VIN undervoltage lockout circuit disables the controller while the +12V supply is below the 10V start
threshold during power-up. While the controller is
disabled, the output drivers will be low, the soft start
capacitor will be shorted and the soft start current is
disabled and the controller will be in a low I
When VIN exceeds the start threshold, the short across
the soft start capacitor is removed, the soft start current
source is enabled and norm al converter operation begins. There is a 2V hysteresis in the undervoltage
lockout circuit for noise immunity.
state. When INH goes high,
Q
state.
Q
these resistor values will determine the soft start charging current. The maximum current that can be sourced
by REFB is 500µA.
Power Good
The power good circuit monitors for an undervoltage
condition on VOUT. If VSENSE is 7% (nom inal) below
VREF, then the power good pin is pulled low. The
PWRGD pin is an open drain output.
Overvoltage Protection
The overvoltage protection circuit monitors VOUT for
an overvoltage condition. If VSENSE is 15% above
VREF, than a fault latch is set and both output drivers
are turned off. T he latch will rem ain set until VIN goes
below the undervoltage lockout value. A 1ms deglitch
timer is included for noise immunity.
Overcurrent Protection
The overcurrent protection circ uit monitors the current
through the high side FET. The overcurrent thres hold
is adjustable with an external resistor divider between
IO and AGND, with the divider voltage connected to the
OCP pin. If the voltage on the OCP pin exceeds
100mV, then a fault latch is set and the output drivers
are turned off. T he latch will rem ain set until VIN goes
below the undervoltage lockout value. A 1ms deglitch
timer is included for noise immunity. The OCP circuit is
also designed to protect the high side FET against a
short-to-ground fault on the terminal common to both
power FETs (VPHASE).
Drive Regulator
Soft Start
The soft star t circuit controls the rate at which VOUT
powers up. A capacitor is connected between SS and
AGND and is charged by an internal current source.
The value of the current source is proportional to the
reference voltage so the charging rate of C
is also
SS
proportional to the reference voltage. By making the
charging current proportional to VREF, the power-up
time for VOUT will be independent of VREF. Thus, C
can remain the same value for all VID settings. The
soft start charging cur rent is determined by the following equation: I
SS
= I
/5. Where I
REFB
is the current
REFB
flowing out of the REFB pin. It is recommended that no
additional loads be connected to REFB, other than the
resistor divider for setting the hysteresis voltage. T hus
The drive regulator provides drive voltage to the low
side driver, and to the high side driver when the high
side driver is configured as a floating driver. The
minimum drive voltage is 7V. The minimum short
circuit current is 100mA.
3. Components connected to IOUT, DROOP, OCP, VHYST, VREFB, VSENSE, and SOFTST should be referenced to AGND.
4. The bypass capacitors C10 and C15 should be placed close to the IC and referenced to DRVGND.
5. Locate bootstrap capacitor C13 close to the IC.
6. Place bypass capacitor C14 close to Drain of the top FET and Source of the bottom FET to be effective.
7. Route HISENSE and LOSENSE close to each other to minimize induced differential mode noise.
8. Bypass a high frequency disturbance with ceramic capacitor at the point where HISENSE is connected to Vin.
9. Input bulk capacitors should placed as close as possible to the power FETs because of the very high ripple current flow in this pass.
10. If Schottky diode used in parallel with a synchronous (bottom) FET, to achieve a greater efficiency at lower
Vout settings, it needs to be placed next to the aforementioned FET in very close proximity.
11. Since the feedback path relies on the accurate sampling of the output ripple voltage, the best results can be
achieved by connecting the AGND to the ground side of the bulk output capacitors.
12. DRVGND pin should be tight to the main ground plane utilizing very low impedance connection, e.g., multiple
vias.
13. In order to prevent substrate glitching, a small (0.5A) Schottky diode should be placed in close proximity to the
chip with the cathode connected to BOOTLO and anode connected to DRVGND.