The SC1103 is a versatile, low-cost, voltagemode PWM contr oller designed for use in single
ended DC/DC power supply appli c ations. A simple, fixed- vol tage buck regulat or c an be impl emented using the SC1103 with a minim um of external components. Int er nal level shift and drive
circuitry eliminates the need for an expensive pchannel, hi gh-side switch. The sm all device footprint al lows for com pac t circuit design.
SC1103 features include a temperature compensated voltage ref er ence, triangle wave oscillator,
current l imi t comparat or , frequency shi ft overcurrent prot ec tion, and an i nternally c ompensated
error amplif ier. Pul se by pulse current limi ting is
implemented by sensing the differential voltage
across an external r esi stor , or an appropriately
sized PC board trac e.
The SC1103 operates at a fixed frequency of
200kHz, providi ng an optimum compr omise between eff iciency, external component size, and
cost.
SC1103
FEATURES
•
Low cost / small size
•
Switch m ode efficiency (90%)
•
1% referenc e voltage accuracy
•
Ov er c urrent protection
•
500mA output drive
•
5V to 12V Input power source
APPLICATIONS
•
Pentium® P55 Core Suppl y
•
Low Cost Microprocessor Supplies
•
Peripheral Card Supplies
•
Industrial Power Supplies
•
High Density DC/ DC Conversion
ORDERING INFORMATION
DEVICE
SC1103CSSO-80° to 125°C
Note:
(1) Add suffix ‘TR’ for t ape and r eel.
(1)
PACKAGETEMP RANGE ( TJ)
PIN CONFIGURATION
Top View
(SO-8)
BLOCK DIAGRAM
Pentium is a registered trademark of Intel Corporation
Device Input Voltage
Current Sense Input ( Negative)
Current Sense Input ( P osi tive)
Device Power Ground
SC1103
6BSTHigh Side Driv er V
BST
(Boost)
7FBError Amplifier Input (-)
8GNDSmall Signal Ground
ABSOLU TE MAXIMUM RATINGS
ParameterSymbolMaximumUnits
Input VoltageV
Ground DifferentialP
Boost Input VoltageBST to GN D-0.3 to +26V
Operating Temperat ur e T
Storage Temperature T
Lead Temperature (Soldering) 10 seconds T
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Careful attention to layout requirement s are nec essary
for successful im plementation of the SC1103 PWM
controller. High cur rents switching at 200kHz ar e pr esent in the appl ication and their ef fect on ground plane
voltage differentials m ust be under stood and mini mized.
1). The hi gh power part s of the cir c uit should be laid
out first. A ground plane should be used, the number
and position of ground plane i nterrupti ons should be
such as to not unnecessarily compromise ground
plane integr ity. I solated or semi - isolated areas of the
ground plane may be deliberately int roduced to constrain ground curr ents to particular areas, f or example
the input capacitor and bottom Schot tky ground.
2). The l oop formed by the Input Capacitor(s) (Ci n) ,
the Top FET (Q1) and the Sc hottky (D1) must be kept
as small as possible. This loop contains all the high
current, fast transition switching. Connections should
be as wide and as short as possible to minimiz e loop
inductance. Minimizi ng this loop area will reduce EMI,
lower ground inj ec tion current s, r esul ting in electric ally
“cleaner” gr ounds for the rest of the system and minimize sourc e r inging, resul ting in more reliable gate
switching signal s.
3). The connection between the junc tion of Q1, D1
and the output i nductor should be a wide trac e or c opper region. It should be as short as practic al. Sinc e
this connection has fast voltage transitions, k eeping
this connection short will minimize EMI. The connection between the out put inductor and the sense resistor should be a wide trac e or c opper ar ea, there are no
fast voltage or c urrent transitions in this connection
and length is not so i mportant, however addi ng unnec essary impedance will reduce efficiency.
4) The Output Capacitor( s) (Cout) should be locat ed
as close to the load as possible, fast tr ansi ent load
currents are suppli ed by Cout only, and connec tions
between Cout and the load must be short, wide copper
areas to mi nimi z e inductance and resistanc e.
5) The SC1103 is best pl ac ed over an isolated ground
plane area. GND and P GND should be returned t o this
isolated ground. This isolated ground area should be
connected to t he main ground by a trace that runs
from the GND pin to the ground side of (one of) the
output capaci tor(s). If this i s not possible, the GND pin
may be connected to the ground path between the
Output Capacitor(s) and the Cin, Q1, D1 l oop. Under
no circumstances should GND be returned to a ground
inside the Ci n, Q1, D1 loop.
6) Vcc for the SC1103 should be supplied from the
VIN supply thr ough a 10Ω resistor, the V c c pin should
be decoupled direc tly to G ND by a 0.1µF ceramic capacitor, trace lengths should be as short as possible.
7) The Current S ense resistor and the divider across it
should form as small a loop as possible, the tr ac es running back to CS(+) and CS(-) on the SC1103 shoul d
run parallel and close to each other. The 0.1µF capacitor should be m ounted as close to the CS(+ ) and CS ( - )
pins as possible.
8) To minimize noise pickup at the sensiti ve FB pin,
the feedback resistors should both be close to the
SC1103 with the bottom resistor ( Rb) r eturned to
ground at the GND pin.
TYPICAL APPLICATIONS
+5V
GND
C1
0.1
C2
1500/6.3V
C3
1500/6.3V
Q1
IRL3103S
Under Voltage Lockout
The under voltage l oc k out circuit of the SC1103 assures that the high-si de M OSFET driv er outputs remai n
in the off state whenever the supply vol tage drops below set parameter s. Loc k out occurs if V