The SC1101 is a versatile, low-cost, voltage-mode
PWM controller designed for use in single ended DC/
DC power supply applications. A simple, fixed-voltage
buck regulator can be implemented using the SC1101
with a minimum of external components. Internal level
shift and drive circuitry eliminates the need for an expensive p-channel, high-side switch. The small device
footprint allows for compact circuit design.
SC1101 features include a temperature compensated
voltage reference, triangle wave oscillator, current limit
comparator, frequency shift over-current protection,
and an internally compensated error amplifier. Pulse by
pulse current limiting is implemented by sensing the
differential voltage across an external resistor, or an
appropriately sized PC board trace.
The SC1101 operates at a fixed frequency of 200kHz,
providing an optimum compromise between efficiency,
external component size, and cost.
SC1101
FEATURES
•
Low cost / small size
•
Switch mode efficiency (90%)
•
1% reference voltage accuracy
•
Over current protection
•
500mA output drive
•
SO-8 package
APPLICATIONS
•
Pentium® P55 Core Supply
•
Low Cost Microprocessor Supplies
•
Peripheral Card Supplies
•
Industrial Power Supplies
•
High Density DC/DC Conversion
ORDERING INFORMATION
DEVICE
SC1101CSSO-80° to 125°C
(1)
PACKAGETEMP RANGE (TJ)
PIN CONFIGURATION
Top View
1
Vcc
s(+)
2
3
4
Cs(-)
GND
(8 LEAD PLASTIC SOIC)
8
7
6
5
Note:
(1) Add suffix ‘TR’ for tape and reel.
BLOCK DIAGRAM
GND
FB
BST
DH
Pentium is a registered trademark of Intel Corporation
Device Input Voltage
Current Sense Input (Negative)
Current Sense Input (Positive)
Device Power Ground
SC1101
6BSTHigh Side Driver V
(Boost)
CC
7FBError Amplifier Input (-)
8GNDSmall Signal Ground
ABSOLUTE MAXIMUM RATINGS
ParameterSymbolMaximumUnits
Input VoltageV
Ground DifferentialP
Boost Input VoltageBST to GND-0.3 to +15V
Operating Temperature T
Storage Temperature T
Lead Temperature (Soldering) 10 seconds T
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Careful attention to layout requirements are necessary
for successful implementation of the SC1101 PWM controller. High currents switching at 200kHz are present in
the application and their effect on ground plane voltage
differentials must be understood and minimized.
1). The high power parts of the circuit should be laid out
first. A ground plane should be used, the number and
position of ground plane interruptions should be such as
to not unnecessarily compromise ground plane integrity.
Isolated or semi-isolated areas of the ground plane may
be deliberately introduced to constrain ground currents
to particular areas, for example the input capacitor and
bottom Schottky ground.
2). The loop formed by the Input Capacitor(s) (Cin), the
Top FET (Q1) and the Schottky (D1) must be kept as
small as possible. This loop contains all the high current,
fast transition switching. Connections should be as wide
and as short as possible to minimize loop inductance.
Minimizing this loop area will reduce EMI, lower ground
injection currents, resulting in electrically “cleaner”
grounds for the rest of the system and minimize source
ringing, resulting in more reliable gate switching signals.
3). The connection between the junction of Q1, D1 and
the output inductor should be a wide trace or copper region. It should be as short as practical. Since this con-
nection has fast voltage transitions, keeping this connection short will minimize EMI. The connection between the
output inductor and the sense resistor should be a wide
trace or copper area, there are no fast voltage or current
transitions in this connection and length is not so important, however adding unnecessary impedance will reduce efficiency.
4) The Output Capacitor(s) (Cout) should be located as
close to the load as possible, fast transient load currents
are supplied by Cout only, and connections between
Cout and the load must be short, wide copper areas to
minimize inductance and resistance.
5) The SC1101 is best placed over an isolated ground
plane area. GND and PGND should be returned to this
isolated ground. This isolated ground area should be
connected to the main ground by a trace that runs from
the GND pin to the ground side of (one of) the output capacitor(s). If this is not possible, the GND pin may be
connected to the ground path between the Output Capacitor(s) and the Cin, Q1, D1 loop. Under no circumstances should GND be returned to a ground inside the
Cin, Q1, D1 loop.
6) Vcc for the SC1101 should be supplied from the 5V
supply through a 10Ω resistor, the Vcc pin should be decoupled directly to GND by a 0.1µF ceramic capacitor,
trace lengths should be as short as possible.
7) The Current Sense resistor and the divider across it
should form as small a loop as possible, the traces running back to CS(+) and CS(-) on the SC1101 should run
parallel and close to each other. The 0.1µF capacitor
should be mounted as close to the CS(+) and CS(-) pins
as possible.
8) To minimize noise pickup at the sensitive FB pin, the
feedback resistors should both be close to the SC1101
with the bottom resistor (Rb) returned to ground at the
GND pin.
TYPICAL APPLICATIONS
Q1
J1
+3.3V
1
+
C3
220uF
C2
220uF
+
C1
0.1uF
J3
GND
1
J4
+12V
1
IRL2203S
L1
D1
32CTQ030S
Under Voltage Lockout
The under voltage lockout circuit of the SC1101 assures
that the high-side MOSFET driver outputs remain in the
off state whenever the supply voltage drops below set
parameters. Lockout occurs if V
mal operation resumes once V