Semikron SKKT 92B16 E G6 Data Sheet
SKKT 92B16 E G6
SEMIPACK® 1
Thyristor Modules
SKKT 92B16 E G6
Features
• Heat transfer through aluminium oxide
ceramic isolated metal baseplate
• UL recognized, file no. E63532
Typical Applications
• DC motor control (e. g. for machine
tools)
• AC motor soft starters
• Temperature control (e. g. for ovens,
chemical processes)
• Professional light dimming (studios,
theaters)
Absolute Maximum Ratings
Symbol Conditions Values Unit
Chip
=85°C
I
T(AV)
I
TSM
2
t
i
2
i
t
V
RSM
V
RRM
V
DRM
(di/dt)
(dv/dt)
T
j
cr
cr
sinus 180°
10 ms
10 ms
Tj= 130 °C
Tj= 130 °C
T
c
T
= 100 °C
c
T
=25°C
j
T
= 130 °C
j
T
=25°C
j
T
= 130 °C
j
98 A
74 A
2000 A
1750 A
20000 A
15313 A
1700 V
1600 V
1600 V
140 A/µs
1000 V/µs
-40 ... 130 °C
2
s
2
s
Module
T
stg
V
isol
a.c.; 50 Hz; r.m.s.
1min
1s
-40 ... 125 °C
3000 V
3600 V
Characteristics
Symbol Conditions min. typ. max. Unit
Chip
V
T
V
T(TO)
r
T
I
DD;IRD
t
gd
t
gr
t
q
I
H
I
L
V
GT
I
GT
V
GD
I
GD
R
th(j-c)
R
th(j-c)
R
th(j-c)
Tj=25°C, IT= 300 A
Tj= 130 °C
Tj= 130 °C
Tj= 130 °C, VDD = V
DRM
; VRD = V
Tj=25°C, IG=1A, diG/dt = 1 A/µs
VD = 0.67 * V
DRM
Tj= 130 °C
Tj=25°C
Tj=25°C, RG=33Ω
Tj=25°C, d.c.
Tj=25°C, d.c.
Tj= 130 °C, d.c.
Tj= 130 °C, d.c.
cont.
sin. 180°
rec. 120°
per chip
per module
per chip
per module
per chip
per module
RRM
1.7 1.85 V
0.85 0.95 V
3.30 4.00 mΩ
20 mA
1µs
2µs
200 µs
150 250 mA
300 600 mA
2.5 V
100 mA
0.25 V
4mA
0.230 K/W
0.115 K/W
0.240 K/W
0.120 K/W
0.250 K/W
0.125 K/W
Module
R
th(c-s)
chip 0.22 K/W
module 0.11 K/W
M
s
M
t
a 5 * 9,81 m/s
to heatsink M5 4.25 5.75 Nm
to terminals M5 2.55 3.45 Nm
2
w75g
SKKT
© by SEMIKRON Rev. 9 – 02.03.2009 1
SKKT 92B16 E G6
Fig. 1L: Power dissipation per thyristor/diode vs.
on-state current
Fig. 2L: Max. power dissipation of one module vs. rms
current
Fig. 1R: Max. power dissipation per chip vs. ambient
temperature
Fig. 2R: Max. power dissipation of one module vs. case
temperature
Fig. 3L: Max. power dissipation of two modules vs. direct
current
2 Rev. 9 – 02.03.2009 © by SEMIKRON
Fig. 3R: Max. power dissipation of two modules vs. case
temperature
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