Semikron SEMIX101GD126HDS Data Sheet

SEMiX101GD126HDs
SEMiX® 13
Trench IGBT Modules
SEMiX101GD126HDs
• Homogeneous Si
• Trench = Trenchgate technology
•V
• High short circuit capability
• UL recognised file no. E63532
Typical Applications*
• AC inverter drives
•UPS
• Electronic Welding
Remarks
• Case temperatur limited to TC=125°C
• Not for new design
with positive temperature
CE(sat)
coefficient
max.
Absolute Maximum Ratings Symbol Conditions Values Unit
IGBT
V I
C
I
Cnom
I
CRM
V
CES
GES
Tj= 150 °C
I
= 2xI
CRM
Cnom
T
=25°C
c
T
=80°C
c
1200 V
129 A
91 A 75 A
150 A
-20 ... 20 V
VCC= 600 V V
t
psc
T
j
GE
V
CES
20 V
1200 V
= 125 °C
T
j
10 µs
-40 ... 150 °C
Inverse diode
T
I
F
I
Fnom
I
FRM
I
FSM
T
Tj= 150 °C
I
= 2xI
FRM
Fnom
tp= 10 ms, sin 180°, Tj=25°C
j
=25°C
c
T
=80°C
c
117 A
81 A
75 A 150 A 600 A
-40 ... 150 °C
Module
I
t(RMS)
T
stg
V
isol
AC sinus 50Hz, t = 1 min 4000 V
600 A
-40 ... 125 °C
Characteristics Symbol Conditions min. typ. max. Unit
IGBT
V
CE(sat)
V
CE0
r
CE
V
GE(th)
I
CES
C
ies
C
oes
C
res
Q R
Gint
t
d(on)
t
r
E
on
t
d(off)
t
f
E
off
R
th(j-c)
IC=75A V
=15V
GE
chiplevel
VGE=15V
VGE=VCE, IC=3mA 5 5.8 6.5 V
VGE=0V V
= 1200 V
CE
VCE=25V V
=0V
GE
G
VGE=- 8 V...+ 15 V Tj=25°C
VCC= 600 V I
=75A
C
=2
R
G on
R
=2
G off
per IGBT 0.27 K/W
T
=25°C
j
= 125 °C
T
j
Tj=25°C T
= 125 °C
j
T
=25°C
j
T
= 125 °C
j
T
=25°C
j
T
= 125 °C
j
f=1MHz f=1MHz f=1MHz
T
= 125 °C
j
Tj= 125 °C Tj= 125 °C Tj= 125 °C Tj= 125 °C
Tj= 125 °C
1.7 2.1 V
22.45V
11.2V
0.9 1.1 V
9.3 12.0 m
14.7 18.0 m
0.1 0.3 mA mA
5.3 nF
0.28 nF
0.24 nF 600 nC
10.00 225 ns
40 ns 10 mJ
470 ns
85 ns
11 mJ
GD
© by SEMIKRON Rev. 0 – 16.04.2010 1
SEMiX101GD126HDs
SEMiX® 13
Trench IGBT Modules
SEMiX101GD126HDs
• Homogeneous Si
• Trench = Trenchgate technology
•V
• High short circuit capability
• UL recognised file no. E63532
Typical Applications*
• AC inverter drives
•UPS
• Electronic Welding
with positive temperature
CE(sat)
coefficient
Characteristics Symbol Conditions min. typ. max. Unit
Inverse diode
V
V
r
F
I
RRM
Q
E
R
= V
F
F0
rr
rr
th(j-c)
IF=75A
EC
V
=0V
GE
chip
IF=75A di/dt
= 2240 A/µs
off
V
=-15V
GE
V
= 600 V
CC
per diode 0.46 K/W
T
=25°C
j
= 125 °C
T
j
Tj=25°C T
= 125 °C
j
Tj=25°C T
= 125 °C
j
T
= 125 °C
j
Tj= 125 °C
Tj= 125 °C
1.6 1.80 V
1.6 1.8 V
0.9 1 1.1 V
0.7 0.8 0.9 V
6.7 8.0 9.3 m
9.3 10.7 12.0 m 97 A 20 µC
9mJ
Module
L
CE
R
CC'+EE'
R
th(c-s)
M
s
M
t
=25°C
T
res., terminal-chip
C
T
= 125 °C
C
per module 0.04 K/W to heat sink (M5) 3 5 Nm
to terminals (M6)
2.5 5 Nm
20 nH
0.7 m 1m
Nm
w 350 g
Temperatur Sensor
R
100
B
100/125
Tc=100°C (R25=5 k) 493 ± 5% R
T[K];
(T)=R100
exp[B
100/125
(1/T-1/T
100
)];
3550
±2%
K
Remarks
• Case temperatur limited to TC=125°C max.
• Not for new design
GD
2 Rev. 0 – 16.04.2010 © by SEMIKRON
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