Semiconductor NCP81022MNTXG Specifications

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Page 1

Page 2

Dual-Edge & RPM Modulation Vcore Controllers

for IMVP8 Designs

Features of Multi-Phase Dual Edge Architecture

• Current-mode dual-edge modulation for fast initial response to transient loading

• High-performance operational error ampliﬁer

• Accurate total summing current ampliﬁer

• High-impedance differential voltage and total current sense ampliﬁers

• Phase-to-phase dynamic current balancing

• “Lossless” DCR current sensing for current balancing

Features of Enhanced Single-Phase RPM Architectures

• High performance RPM control system

• Ultralow offset IOUT monitor

• Dynamic VID feed-forward

• Programmable droop gain

• Zero droop capable

• Thermal monitor

• Ultra-s onic operat ion

• Digitally controlled operating frequency

Device Market Function VR Spec Controller Architecture Number of Rails CPU Phases

NCP81201 Tablet Controller VR12.1 RPM 1 1 — SVID QFN-28

NCP81111 Microserver Controller VR12.5 Hybrid 1 1/2/3 — SVID QFN-32

NCP81203 Desktop Controller IMVP8 Dual Edge 2 3/2/1+2/1 — SVID QFN-52

NCP81203P Notebook Controller IMVP8 Dual Edge 2 3/2/1+2/1 — SVID QFN-52

NCP81205 Notebook Controller IMVP8 Dual Edge & EN RPM 3 1/2/3+1/2/3+1 — SVID QFN-52

NCP81216 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 3 x 5 V SVID QFN-52

NCP81236 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1/2+1+1 3 x 5 V SVID QFN-52

NCP81218 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 — SVID QFN-48

NCP81210 Ultrabook & Notebook Controller IMVP8 EN RPM 1 1 1 + FETs SVID QFN-40

Pleas e contact ON Se miconductor f or product datashee ts.

Page 2 Computing Solutions

Integrated

Drivers Interface Package

Page 3

Ultrabook Solution Notebook Solutions

NCP81218 1+2+1 Phase Controller

• Dual Edge & DCR current sensing for fast transient response

• EN RPM for fast transition between DCM and CCM mode

• True Differential Current Balancing

• IMVP8 compliant

RAIL1

RAIL2

RAIL3

CPU

NCP81218

1+2+1 Phase

Controller

NCP81382

DrMOS

NCP81382

DrMOS

NCP81382

DrMOS

NCP81382

DrMOS

NCP81205 3+3+1 Phase Controiler

• Dual Edge & DCR current sensing for fast transient response

• EN RPM for fast transition between DCM and CCM mode

• True Differential Current Balancing

• IMVP8 compliant

+20 V

NCP81151

5 V Driver

+20 V

RAIL1

RAIL2

CPU

NCP81205

3+3+1 Phase

Controller

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

+20 V

Desktop Solutions

NCP81203 3+2 Phase Controller

• Dual Edge for fast transient response

• Constant on-time for light load efﬁciency

• Supports all MLCC output capacitor solutions

• IMVP8 compliant

+12 V

NCP81161

12 V Driver

+12 V

RAIL1

RAIL2

NCP81203

3+2

Phase

Controller

NCP81161

12 V Driver

NCP81161

12 V Driver

NCP81161

12 V Driver

NCP81161

12 V Driver

+12 V

CPU

+20 V

NCP81151

5 V Driver

+20 V

NCP81253

5 V Driver

RAIL3

Microserver Solutions

NCP81111 3-Phase Digital Controller

• Optimised to operate at 5MHz using DrMOS

• Can operate as general purpose I2C controller regulator

• Internal compensation using GUI inter face

• VR12.5/6 c ompliant

NCP81381

DrMOS

NCP81111

Phase

Controller

NCP81381

DrMOS

NCP81381

DrMOS

RAIL1

CPU

Page 3ON Semiconductor

Page 4

IMVP8 Multiphase Controllers for Embedded Applications

+20 V

NCP81151

5 V Driver

+20 V

NCP81245 3+3+1 Phase Controller

• Dual Edge & DCR current sensing for fast transient response

• EN RPM for fast transition between DCM and CCM mode

• True Differential Current Balancing

• IMVP8 compliant

NCP81245

3+3+1 Phase

Controller

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81253

5 V Driver

+20 V

RAIL1

RAIL2

RAIL3

CPU

Device Market Function VR Spec Controller Architecture Number of Rails CPU Phases

Drivers Interface Package

NCP81243 Desktop Controller IMVP8 Dual Edge 2 3/2/1+2/1 — SVID QFN-52

NCP 81245 Notebook Controller IMVP8 Dual Edge & EN RPM 3 1/2/3+1/2/3+1 — SVID QFN-52

NCP 81246 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 3 x 5 V SVID QFN-52

NCP 8124 8 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 - SVID QFN-48

NCP81255 Ultrabook & Notebook Controller IMVP8 EN RPM 1 1 1 + FETs SVID QFN-40

NCP81145 Ultrabook & Notebook 5 V Driver — for Dual Edge Rail — — — — DFN-8

NCP81146 Desktop 12 V Driver — for Dual Edge Rail — — — — DFN-8

NCP81253 Ultrabook & Notebook 5 V Driver — for EN RPM rail — — — — DFN-8

Page 4 Computing Solutions

Integrated

Page 5

System Power

System power management devices provide additional rails in computing applications, beyond Vcore and graphics. They are available

with single or dual channel operation, and also in multi-phase conﬁgurations.

1500

VIN = 2.5 V − 13.2 VVCC = 4.5 V − 13.2 V

2.2

NTD4806 NTD4809

4.7nF

1500

1 H

3x22

2x0.22 F

2x1800

VOUT

1.65 V

GND

3.878k

= 4.5 V − 15 V

BST

VCC

PGOOD

0.0015

4.12k

17.08k

0.007

0.014

74.2

COMP/EN

BOOT

GNDFBVOS

R9 R10

1.02k

0.1

ROCSET

1.02k

NCP1589A Application Diagram

Device Description Topology

(V)

NCP1579 Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 275 SOIC-8

NCP1587 Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 250 - 300 SOIC-8

NCP1587A Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 180 - 220 SOIC-8

NCP1589A Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 — DF N-10

NCP1589D Snychronous Buck Controller Step-Down 4.5 13.2 — DFN-10

NCP1589L Synchronous Buck Controller, Low Voltage, with Light Load Efﬁciency and Transient Enhancement Step-Down 4.5 13.2 — DFN-10

NCP5212 Single Synchronous Step Down Controller Step-Down 4.5 27 300 QF N -16

NC P5217 Synchronous Buck Controller, Single Step-Down 4.5 27 300 QF N -14

NCP5230 Low Voltage Synchronous Buck Controller Step-Down 4.5 13.2 — QFN-16

NCP5269 System Agent Controller with 2-bit VID Step-Down 3.3 28 300 - 600 QF N-20

NCP3231 25 A Synchronous Buck Conver ter with Intergrated MOSFETs Step-Down 4.5 18 500 TQFN-40

NCP3232N 15 A Synchronous Buck Converter with Intergrated MOSFE Ts Step-Down 4.5 21 500 TQFN-40

NCP3133A 3 A Synchronous Buck Conver ter with Intergrated MOSFE Ts Step-Down 2.9 5.5 1100 QFN-16

NCP3135 5 A Synchronous Buck Conver ter with Intergrated MOSFE Ts Step-Down 2.9 5.5 1100 QFN-16

VCC Min

VCC Max

(V)

fSW Typ

(kHz) Package

Page 5ON Semiconductor

Page 6

Thermal Management

Extensive Portfolio

Remote Sensors provide temperature information

of a transistor located at a different position on the board; also includes local sensor capability

Fan Controllers integrate the temperature sensor

with a fan controller/monitor

System Monitors integrate combinations of

remote and/or local temperature sensing, voltage monitoring, fan control & monitoring, reset control, and GPIO functions

System Voltages

+1.25 V

Chassis Intrusion

+12 V

+5 V

+3.3 V

+2.5 V

+1.8 V

+1.5 V

+0.9 V

VBatt

ALERT O/P

8 GPIOs

SMBus Interface

TDM3

Bi-directional THERM Pins

RESET I/O

4 PWM O/Ps

8 Tach Inputs

Fan2Max

TDM1

TDM2

Fan Drive and Control

• 4 PWM Fan Drive Outputs

• 8 Tach Inputs

Temperature

• Measures 4 Temp Zones

1 Local

3 Remote

THERM I/O

System

Monitors

Fan

Controllers

Remote

Sensors

Supply Range

Device

(V)

Temperature

Range

(°C )

Local

Accuracy

(°C) Interface

Number

Addresses

SRC

(Ω)

Remote

Accuracy

Remote

Channels

Fan

Channels

TACH

Channels

Voltage

Monitoring

Channels GPIOs Package

ADM1026 3 - 5.5 -40 to +120 ±3 I2C/SMBUS 3 — ±3 2 8 8 19 17 LQFP-48

AD T746 2 3 - 5.5 -40 to +125 ±2.25 I2C/SMBUS 2 2 k ±2.25 3 4 8 13 8 LFC SP-32

NCT80 2.8 - 5.75 -40 to +125 ±2 I2C/SMBUS 8 — — — — 2 7 1 TSSOP-24

AD T7476 3 - 3.6 -40 to +120 ±1.5 I2C/SMBUS 3 — ±1.5 2 3 4 5 — QSOP-24

AD T7473 3 - 3.6 -40 to +120 ±1.5 I2C/SMBUS 3 3 k ±1.5 2 3 4 QSOP-16

AD T7475 3 - 3.6 -40 to +120 ±1.5 I2C/SMBUS 1 — ±1.5 2 3 4 QSOP-16

NCT72 2.8 - 3.6 -40 to +125 ±1 I2C/SMBUS 2 1.5 k ±1 1 DFN-8, WDFN-8

NCT218 1.4 - 2.75 -40 to +125 ±1.75 I2C/SMBUS 2 150 ±1 1 WDFN-8, WLCSP-8

ADM1032 3 - 5.5 -40 to +125 ±3 I2C/SMBUS 2 — ±1 1 SOIC-8, MSOP-8

AD T746 1 3 - 5.5 -40 to +125 ±3 I2C/SMBUS 2 3 k ±1 1 SOIC-8, MSOP-8

ADT7481 3 - 3.6 -40 to +125 ±1 I2C/SMBUS 2 — ±1 2 MSOP-10

ADT7483 3 - 3.6 -40 to +125 ±1 I2C/SMBUS 9 — ±1 2 QSOP-16

Page 6 Computing Solutions

Page 7

3-Phase

2-Phase

Integrated MOSFET and Drivers

Features

• Integrated high- and low-side MOSFETs

• Integrated bootstrap diode

• Matched of driver and MOSFETs optimize switching performance

• Higher switching frequency enables use of smaller inductor and output capacitors

• Low-side MOSFET diode emulation mode provides asynchronous operation

• 65% lower BOM; 45% smaller footprint and simpliﬁed layout versus discrete solutions

Driver

IA Rail

GT Rail

3-Phase

2-Phase

DrMOS

IA Rail

GT Rail

Discrete Integratedversus

Device PWM Input VIN Max (V) Freq Max (MHz) I

NCP5369 5 V Tri-state 25 1 40 QFN-40

NCP81381 5 V Tri-state 30 2 25 QFN-32

NCP81382 5 V Tri-state 30 2 35 QFN -28

Continuous Max (A) Package

OUT

Drivers for Discrete MOSFET Implementations

Drivers speciﬁcally designed to work with controller solutions, and optimized for 5 V or 12 V gate applications.

Device Drivers V

NCP5901 Single 12 N Y DFN-8

NCP5901B Single 12 Y Y DFN-8

NCP 81161 Single 12 Y Y DFN-8

NCP 81151 Single 5 Y Y DFN-8

NCP81253 Single 5 Y N DFN-8

NCP81061 Dual 12 Y Y QF N -16

NCP81152 Dual 5 Y Y QF N -16

Typ (V) Integrated Bootstrap Diode Zero Crossover Detection Package

Page 7ON Semiconductor

Page 8

High Performance Dual MOSFETs (Power Clip)

Features

• Co-packaged high-side & low-side MOSFETs reduces board space

• Optimized for low Figure-of-Merit = R

DS(ON)

x Q

• Improved clip for faster switching & improved efﬁciency

2 x Discrete

1 x Power Clip

• Flipped low-side MOSFET improves thermal performance

• Parasitic inductance loops minimized for improved efﬁciency

Speciﬁc Applications

• GPU rails in VGA cards and gaming motherboards

• Vcore & system rails in notebooks

High Frequency Switching Loop Size Reduction

Max @ VGS= 4.5 V

DS(ON)

Device Package

FDPC 8012S

FDPC 8013S 10-15 30 20 9.6 2.7 6 21 997

FDMC2D2N025DSD* 15-2 0 25 16 7 2.2 5 15 886

FDMC2D3N03DSD* 15-2 0 30 16 7 2.4 5 15 1063

FDPC3D5N025X9D 10 25 12 3.7 3.7 17 17 612

FDPC8900* Power Clip 35 14 30 12 5 6.5 12 8.8 356

FDP C8016S

FDPC8014S >30 25 12 4.7 1.4 11 43 1720

FDPC8014A S >30 25 12 4.7 1.2 11 44 2170

FDMS001N025DSD >30 25 16 4 1.1 10 35 1810

FDMS1D2N03DSD* >30 30 16 4 1.2 11 39 1845

FDPC5018SG 25 30 12 6.5 2 8 28 1210

FDPC5030SG 20 30 12 6.5 3 8 18 801

NTMFD4H088NF*

NTMFD4C85N* >30 30 20 4.3 1.2 15 45 3660

NTMFD4C86N* >30 30 20 8.1 3.4 11 22 1650

* Pending 2Q18.

Power Clip 33

Power Clip 56

Power Phase 56

max

(A)

15-2 0 25 12 7 2.2 8 25 885

20-30 25 12 4.7 1.7 11 31 1195

25 30 12 11.3 2 3 21 1530

(V)

DSS

VGS Max

(V)

High Side Low Side High Side Low Side Low Side

(mΩ)

Qg Typ @ VGS= 4.5 V

(nC)

oss

(pF)

Typ

Page 8 Computing Solutions

Page 9

Asymetric Dual MOSFETs

Max @ VGS= 4.5 V

DS(ON)

Device Package

FDMS3620S

FDMS3622S 25-30A 5.7mΩ 1.6mΩ 12 40 14 05

FDMS3624 S 2 0-25A 5.7mΩ 2.2mΩ 12 27 946

FDMS3626S 15-20A 5.7m Ω 3.2mΩ 12 19 716

NTMFD4901NF

NTMFD4902NF 25-30A 10.0mΩ 6.2mΩ 10 12 813

NTMFD4C20N 25-30A 10.8mΩ 5.2mΩ 9 13 990

FDMC007N30D

FDMC8200S <6A

Power 56 Dual

SO8-FL Dual

Power 33 Dual

max

(A)

>30A

25-30A

<13A

DSS

(V)

25 12

VGS Max

(V)

High Side Low Side High Side Low Side Low Side

10.0mΩ 3.5mΩ 10 20 1100

13.3mΩ 7.0m Ω 6.4 14 413

32.0mΩ 13.5mΩ 3.1 7. 2 373

(mΩ)

5.2mΩ 1.2mΩ 12 50 1828

Qg Typ @ VGS= 4.5 V

(nC)

oss

(pF)

30 V P-Channel MOSFETs

Typ

Device Package Conﬁguration

FDMC013P030Z

FDMC6675BZ Single P-Channel 30/25 27

FDMC6679AZ Single P-Channel 30/25 18

FDMA6676PZ

FDMA530PZ Single P-Channel 30/25 65

MLP 33

MLP 22

Single P-Channel 30/25 13.2

Single P-Channel 30/25 27

Dual N-Channel MOSFETs

Common Drain FDPC4044

• 30 V, 27 A

• Max r

S1S2(on)

• MLP 33 package

Speciﬁc Applications

• V

back-back protection switch for USB Type-C

BUS

• Replace two discrete back-back MOSFETs with single

compact solution

= 4.3 mΩ at VGS = 10 V, I

S1S2

= 27 A

Breakdown VDS/VGS

(V)

Max @ VGS= 4.5 V

DS(ON)

(mΩ)

Common Source FDMD8630

• 30 V, 167 A

• Max r

DS(on)

= 1 mΩ

• PQFN-8 package

Speciﬁc Applications

• Synchronous Rectiﬁc ation

• Synchronous buck for ~50% duty cycle (12 V to 5 V)

Page 9ON Semiconductor

Page 10

N-Channel MOSFETs

Docking Station Connector

Maximum Ratings

(mΩ)

DS(ON)

VGS=

10 V

VGS=

4.5 V Applications

Device Package Polarity

NTMFS4C020N

VDS

(V)

VGS

(V)

N-Channel 30 20 0.7 1 63 13 10144 14 8 1 HPPC

NTMFS4C01N N-Channel 30 20 0.9 1.2 65 18 9200 231 1 HPPC

NTMFS4C022N N-Channel 30 20 1.7 2.4 20.8 4.7 3071 67 1 HPPC

NTMFS4C03N N-Channel 30 20 2.3 3.3 19.8 5.3 2789 71 1 HPPC

NTMFS4C024N N-Channel 30 20 2.8 4 14 5 1972 59 1 Synchronous Side

NTMFS4C35N N-Channel 30 20 3.2 4.2 15 5.5 2300 46 1 Synchronous Side

NTMFS4C025N N-Channel 30 20 3.4 4.9 11.6 4 1683 40 1 Synchronous Side

NTMFS4C05N N-Channel 30 20 3.4 5 13 3 1950 50 1 Synchronous Side

NTMFS4C06N N-Channel 30 20 4 6 14.5 5.5 1988 71 1 Synchronous Side

SO-8FL

NTMFS4C028N N-Channel 30 20 4.7 7 10.9 5.4 1252 126 1 Synchronous Side

NTMFS4C08N N-Channel 30 20 5.8 8.5 8.7 2.8 1100 38 1 Synchronous Side

NTMFS4C09N N-Channel 30 20 6 8.8 10.9 5.4 1252 126 1 Control Side

NTMFS4C029N N-Channel 30 20 5.9 9 9.7 4.8 987 162 1 Control Side

NTMFS4C10N N-Channel 30 20 7 10.8 9.3 4.2 970 125 1 Control Side

NTMFS4C032N N-Channel 30 20 7.4 11.1 7.8 3.7 770 127 1 Control Side

NTMFS4C13N N-Channel 30 20 9.1 13.8 6.6 2.7 720 95 1 Control Side

NTTFS4C02N

N-Channel 30 20 2 3 20 7 2800 66 0.8 HPPC

NTTFS4C05N N-Channel 30 20 3.6 5.1 13 3 1950 50 1 Synchronous Side

NTTFS4C06N N-Channel 30 20 4 6 14.5 5.5 1988 71 1 Synchronous Side

NTTFS4C08N N-Channel 30 20 5.8 8.5 8.7 2.8 1100 38 1 Synchronous Side

µ8-FL

NT TFS4C10N N-Channel 30 20 7.4 11 9.3 4.2 970 125 1 Control Side

NTTFS4C13N N-Channel 30 20 9.1 13.8 6.6 2.7 720 95 1 Control Side

NTTFS4C25N N-Channel 30 20 17 26.5 4 1.3 455 60 1 Control Side

(nC)

(pF)

iss

rss

(pF)

(Ω)

Switching Devices

ON Semiconductor offers a range of switching devices for high speed interface in servers, desktop computing, notebook and netbook computers. Applications include PCI Express, DisplayPort, Gigabit Ethernet and USB 2.0.

2nd LCD

Display

LCD

Panel

Stereo Switch

Page 10 Computing Solutions

DisplayPort

VGA Switch

HDMI/DVI

Switch

LAN Switch

USB Power/ Data Switch

Mic Switch

TMDS

Switch

Gigabit LAN

Transceiver

Internal

Graphics

Processor

Audio

Amp

External

Graphics

Processor

PCIe

Switch

Processor

North Bridge

(ICH)

South Bridge

(MCH)

Codec

Device Interface Data Rate

NCN2612B PCIe 2.0, DisplayPort 1.1 5 Gb/s 12

NCN118 8 USB 2.0 / MHL 2.25 Gb/s 2

NS5S1153 USB 2.0 4 80 Mb/s 2

NLAS7242 USB 2.0 480 Mb/s 2

NLAS52231 Audio 36 MHz 2

NLAS4684 Audio 9.5 MHz 2

Channels

Quiescent

Current

250 µA

21 µA

1 µA

180 nA

Page 11

VOUTBLEEDGNDSR

Advanced Load Switches

ON Semiconductor provides a comprehensive range of load switches, suitable for a variety of different power trees.

• Copackaged MOSFET plus CMOS controllers – value-added features plus high performance

• Monolithic CMOS smart load switches – value added features, low cost

• Discrete MOSFETs – simple, high performance

Bandgap

Type Device

NCP330 26 at 3.3 V 3 1.8 5.5 10 0 - 2000 Rever se blocking TDFN-4

NCP333 55 at 3.3 V 1.5 1.2 5.5 1 Auto 95 - WLCSP-4

NCP334 47 at 3.3 V 2 1.2 5.5 1 - 71 - WLCSP-4

NCP335 47 at 3.3 V 2 1.2 5.5 1 Auto 71 - WLCSP-4

NCP336 23 at 3.3 V 3 1.2 5.5 1 - 810 - WLCSP-6

NCP 337 23 at 3.3 V 3 1.2 5.5 1 Auto 810 - WLCSP-6

NCP338 27 at 1.8 V 2 1 3.6 0.6 Auto 20 - WLCSP-6

NCP339 26 at 3.3 V 3 1.2 5.5 2 - 2700 Reverse blocking WLCSP-6

NCP432 50 at 1.8 V 1.5 1 3.6 0.6 - 20 - WLCSP-4

Smart Load Switch

NCP433 50 at 1.8 V 1.5 1 3.6 0.6 Auto 20 - WLCSP-4

NCP434 43 at 1.8 V 2 1 3.6 0.6 - 61 - WLCSP-4

NCP435 43 at 1.8 V 2 1 3.6 0.6 Auto 61 - WLCSP-4

NCP436 23 at 1.8 V 3 1 3.6 1 - 27 - WLCSP-6

NCP437 23 at 1.8 V 3 1 3.6 1 Auto 27 - WLCSP-6

NC P455 24 18.0 6 0.5 13.5 - Adj - Power good DFN-8

NCP45 525 18.0 6 0.5 13.5 - Adj Adj - DFN-8

NCP45 560 2.4 24 0.5 13.5 - Adj Adj Power good; Fault DF N -12

NCP45 540 3.3 20 0.5 13.5 - Adj Adj Power good ; Fault DFN-1 2

NC P45 541 3.3 20 0.5 13.5 - Adj Adj Power good DF N -1 2

Load Switch

NCP45 520 9.5 10.5 0.5 13.5 - Adj - Power good; Fault DFN-8

ecoSWITCH™ Integrated

NC P455 21 9.5 10.5 0.5 13.5 - Adj Adj Fault DFN-8

Biases

Charge

Pump

(mΩ)

Control

Logic

Delay and Slew Rate

Control

I Max

(A)

PGENVCC

VI Min

Thermal,

Undervoltage

Short-Circuit

Protection

(V)

VI Max

(V)

VIN

NCP45xxx Integrated Load Switch Feature

• Simple/clean design

• No current consumption in standby power mode

• Small PCB footprint

• Low R

• Adjustable soft-start time (SR)

• Adjustable integrated discharge

• Fault protection

• Power rail monitoring & sequencing

(mA) Discharge

due to charge pump driving NMOS

DS(ON)

Slew Rate

(ms) Features Package(s)

Page 11ON Semiconductor

Page 12

Clock Synthesizers for High Performance Computing

Features

• Uses 25 MHz fundamental mode parallel resonant crystal

• PCI-e Gen 1, 2, 3, and 4 jitter complaint HCSL differential outputs

• NB3N50134 features conﬁgurable spread spectrum outputs

• NB3N51044 features individual OE control signal for each output, PLL bypass

mode and an Input multiplexer

• NB3N51054 features I2C interface for OE control and conﬁgurable spread

spectrum outputs

• 3.3 V supply

VDD

25 MHz Clock or

Crystal

Device

NB3N3002 1 Crystal; LVCMOS ; LV TTL 25 1 HCSL 25; 100; 125; 200 No TSSOP-16

NB3N5573 1 Crystal; LVCMOS ; LVTTL 25 2 HCSL 25; 100; 125 ; 200 No TSSOP-16

NB3N51032 1 Crystal; LVCMOS ; LV TTL 25 2 HCSL 25; 100; 125; 200 Yes TSSOP-16

NB3N51034 1 Crystal; LVCMOS ; LV TTL 25 4 HCSL 100: 200 Yes TSSOP-20

NB3N51044 2 Crystal; LVCMOS ; LV TTL 25 4 HCSL 100 : 125 No TSSOP-28

NB3N51054 1 Crystal; LVCMOS ; LV TTL 25 4 HCSL 100 Yes TSSOP-24

X1/CLK

Clock Buffer

Crystal Oscillator

GND

Number

of Inputs Input Type

Phase

Detector

Charge

Pump

NB3N5573 Simpliﬁed Logic Diagram

fin Typ

(MHz)

Number

of Outputs

Output

Type

VCO

S0 S1 OE IREF

Typ

out

(MHz)

HSCL

Output

HSCL

Output

Spread Spectrum

Outputs Package

CLK0

CLK1

Page 12 Computing Solutions

Page 13

Fanout Buffers for High Performance Computing

Features

• DC up to 400 MHz

• Accepts LVPECL, LVDS, HCSL, and single-ended inputs

• Typical input clock frequencies: 100, 133, 156.25, 166, 322.26, or 400 MHz

• Typical propagation delay: 800 ps

• HCSL differential outputs

• Integrated 50 Ω input termination resistors

• IREF pin enables setting of output drive

• Additive phase jitter 0.1 ps typical @ 100 MHz; PCI-e Gen 3 jitter complaint

• Additive phase jitter 80 fs maximum @ 156.25 MHz with NB3L208K, NB3L204K,

NB3L202K; DB800H, DB400H, DB200H compliant

VTCLK

CLK

VTCLK

GND

IREF

REF

Q19

Q20

NB3N121K Logic Diagram

Additive

Device Ratio

NB3L202K 1:2 0.046 30 1 125 350 QFN-16

NB3L204K 1:4 0.046 30 1 125 350 QFN-24

NB3N106K 1:6 0.1 10 0 0.8 400 400 QFN-24

NB3L208K 1:8 0.046 30 1 125 350 QFN-32

NB3N108K 1:8 0.1 10 0 0.8 400 400 QFN-32

NB3N111K 1:10 0.1 100 0.8 400 400 QFN-32

NB4N111K 1:10 <1 100 0.8 700 400 QFN-32

NB3N121K 1:21 0.1 100 0.8 700 400 QFN-52

NB4N121K 1:21 <1 50 0.8 700 200 QFN-52

NB3M8T3910G 3:1:10 0.05 50 1 300 1400 QFN-48

Jitter(RMS)

(ps)

Typ

skew(o-o)

(ps)

Max

tpd Typ

(ns)

tR & tF Max

(ps)

Typ

maxClock

(MHz) Package

Page 13ON Semiconductor

Page 14

Computing Clock for Graphics

P1P8160A Features

• Provides reference clock to the GPU & reduces EMI in the GDDR interface

• Input frequency 27 MHz; crystal or reference clock

• Output frequency 100 MHz spread spectrum clock; 27 MHz RefOUT

• Two tri-level logic pins for selecting eight frequency deviations along with SSOFF

• Modulation rate at 100 MHz: 32 kHz

• Low cycle-cycle & long term jitter

• Supply voltage: 3.3 V ±10%

• WDFN-10 package

D-Sub D-Sub D-Sub D-Sub

GPU

Core

SS_clock

Controller

DDR

SS_clock

Radeon HD 6000/5000 Series

Non_SS_clock

27 MHz

PLL P1P8160A

100 MHz_SS_clock

P1P8160A for AMD Graphics Card Application

NB3N51054 Features

• Uses 25 MHz Fundamental Crystal or Reference Clock Input

• Four Low Skew HCSL or LVDS Outputs

• I2C Support with Read Back Capability

• Spread of −0.35%, −0.5% and No Spread

• Individual Output Enable/Disable Control through I2C

• PCIe Gen 1, Gen 2, Gen 3, Gen 4 Compliant

• Typical Phase Jitter @ 100 MHz (Integrated 12 kHz to 20 MHz): 0.5 ps

• Typical Cycle−Cycle Jitter @ 100 MHz (10k cycles): 20 ps

• Operating Power Supply: 3.3 V ± 5%

27 MHz

Page 14 Computing Solutions

Page 15

Zero Delay Buffers Compliant with DB Specifications

Features

• Differential SRC clock support

• NB3N1900K, NB3N1200K: DB1900Z and DB1200Z compliant with 19 and 12 HCSL output pairs respectively

• NB3W1900L, NB3W1200L, NB3W800L: DB1900ZL, DB1200ZL, and DB800ZL compliant with 19, 12, and 8 low power

NMOS push-pull output pairs respectively

• Optimized for 100 MHz and 133 MHz to meet PCIe Gen 2, Gen 3, Gen 4, and Intel QPI and UPI phase jitter speciﬁcations

• Spread spectrum compatible for low EMI

• Pseudo-external ﬁxed-feedback for low input-to-output delay variation

• Individual OE control pin for each output

• SMBUS programmability for power down mode, PLL BW modes, PLL/Bypass mode & frequency selection

OE_[11:0]#

100M_133M#

HBW_BYPASS_LBW#

PWRGD/PWRDN#

SSC Compatible

CLK_IN

CLK_IN#

SA_0

SA_1

SDA

SCL

* FB_OUT pins are for NB3N1200K only; they are NC for NB3W1200L ** IREF pin is for NB3N1200K only; it is NC for NB3W1200L

Control

Logic

PLL

MUX

IREF**

REF

FB_OUT*

FB_OUT#*

DIF_[11:0]

DIF_[11:0]#

NB3N1200K Simpliﬁed Block Diagram

Jitter(Cy-Cy)

Device Ratio Output

NB3W800L 1:8 Low power NMOS push-pull 34 ±100 50 4 QFN-48

NB3N1200K 1:12 HCSL 50 ±100 50 4 QFN-64

NB3W1200L 1:12 Low power NMOS push-pull 50 ±100 50 4 QFN-64

NB3N1900K 1:19 HCSL 50 ±100 65 4 QFN-72

NB3W1900L 1:19 Low power NMOS push-pull 50 ±100 85 4 QFN-72

(ps)

Typ

skew( I-o )

(ps)

Max

skew(o-o)

(ps)

Max

Edge Rate Max

(V/ns) Package

Page 15ON Semiconductor

Page 16

EEPROMs for Configuration and Calibration

Features

• Broad density range: 1 kb to 2 Mb

• Wide operating Vcc range: 1.7 V to 5.5 V

• High endurance: 1 million program/erase cycles

• Wide temperature range: industrial and extended

EEPROMs

Data

Transmission

Standard Density Organization*

1 Mb 128k x 8

512 kb 64k x 8

256 kb 32k x 8

128 kb 16k x 8

I2C

SPI

Microwire

* Organization f or Microwire de vice s is sele ctable.

64 kb 8k x 8

32 kb 4k x 8

16 kb 2k x 8

8 kb 1k x 8

4 kb 512 x 8

2 kb 256 x 8

2 Mb 256k x 8

1 Mb 128k x 8

512 kb 64k x 8

256 kb 32k x 8

128 kb 16k x 8

64 kb 8k x 8

32 kb 4k x 8

16 kb 2k x 8

8 kb 1k x 8

4 kb 512 x 8

2 kb 256 x 8

1 kb 128 x 8

16 kb 2k x 8 / 1k x 16

8 kb 1k x 8 / 512 x 16

4 kb 512 x 8 / 256 x 16

2 kb 256 x 8 / 128 x 16

1 kb 128 x 8 / 64 x 16

EasyPRO™ is a user-friendly, portable

programming tool for ON Semiconductor

serial EEPROMs (I2C, SPI, Microwire)

VCC Min

(V)

1.7, 1.8 5.5 0.4, 1 US8, SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5, WLCSP-8

1.7, 1.8 5.5 10, 20 SOIC-8, TSSOP-8, UDFN-8

1.65, 1.8 5.5 2 , 3, 4 SOIC-8, TSSOP-8, UDFN-8

VCC Max

(V)

Max

CLK

(MHz) Package(s)

Page 16 Computing Solutions

Page 17

USB-C for PC/Laptop

PC/Laptop form factors are getting smaller, thinner, and lighter with the adaptation of the USB Type-C connectors. ON Semiconductor offers multiport solutions compatible with the USB Type-C Port Controller Protocol and Power Delivery 3.0.

System Devices

Voltage

Regulation

Protection

Sensors

Port Power

Power

Regulation

Power MUX

Power

Switch

Block Diagram

System Devices

Function Device Description

Voltage

Regulation

Protection

NCP81231 Buck Controller, USB Power Delivery and Type-C Applications

ESD870 4 High Speed Data Line Protection, Unidirectional (3.3 V – USB 3.x)

ESDL2011 High Speed Data Line Protection, Bidirectional (1 V – Thunderbolt 3.0), 0.2 pF

ESDM3551 E SD Protection Diode, CC and SBU Protection (5.5 V – USB 3.x), 21 pF

NSPM2052 ESD and Surge Protection Device, Vbat and Vbus Applications, 5 V

NIS5452 Electronic Fuse, 5 V

NCS210 Current Sense Ampliﬁer, Bidirectional Zero -Drift, 1% Max. Gain Error, 60 µV Offset

NCS211 Current Sense Ampliﬁer, Bidirectional Zero-Drift, 1% Max. Gain Error, 60 µV Offset

NCS213

Current Sense Ampliﬁer, Bidirectional Zero-Drift, 1% Max. Gain Error, 100 µV Offset

NC S2 14 Current Sense Ampliﬁer, Bidirectional Zero-Drift, 1% Max. Gain Error, 60 µV Offset

FUSB252UMX High Speed Digital (HSD) Port Protection Switch with Type- C CC

FSUSB242UCX USB Type-C Port Protection Switch

Data Path

Data

Redrvicer

SuperSpeed

MUX

Alt Mode

MUX

Control

Controllers

Port

Control

Policy

Engine

Data Path

Function Device Description

NB7NPQ7021M USB 3.1 Dual Channel Linear Redriver, 3.3 V

NB7NPQ701M USB 3.1 Single Channel Redriver, 3.3 V

Data

Redriver

SuperSpeed

Alt Mode

NB7NPQ702M USB 3.1 Dual Channel Redriver, 3.3 V

NB7VPQ701M USB 3.1 Single Channel Redriver, 1.8 V

NB7V PQ70 2M USB 3.1 Dual Channel Redriver, 1.8 V

FUSB340TMX USB 3.1 SuperSpeed Switch, 10 Gbps

Mux

MUX

FSA4476UCX

Analog Audio Switch with Protec tion Function, USB Type-C

Power Port

Function Device Description

NCP13 42 Quasi-Resonant Flyback Controller with Valley Lock-Out Switching

Secondary Side Synchronous Rectiﬁcation Driver for High Efﬁciency SMPS Topologies

Load Switch, Over-Voltage, Over-Current Protection with Adjustable Current-Limit Control, IntelliMAX™ 28 V

Power

Regulation

Power MUX

NCP4305

NCP4306

NCP43080 Synchronous Rectiﬁer Controller with LLD Function

FPF2595UCX

FPF2895CUCX Current Limit Load Switch with OVP and TRCB, 28 V, 5 A

Control

Function Device Description

Programmable USB Type-C Controller with PD (Default SRC)

Autonomous USB Type-C Controller with I2C and GPIO C ontrol

Port Control

FUSB302TMPX

FUSB303TMX

FUSB307BMPX USB Type-C Por t Controller with USB-PD

Page 17ON Semiconductor

Page 18

Two SuperSpeed Pairs, One High Speed Pair, VCC, Low Capacitance ESD Protection

ESD8116

StdA_SSTX+

StdA_SSTX-

GND_DRAIN

StdA_SSRX+

StdA_SSRX-

USB 3.0 Type A

Connector

GND

D-D+D-

D+

Vbus

StdA_SSTX+

D-

StdA_SSTX-

D+

GND_DRAIN

GND

StdA_SSRX+

StdA_SSRX-

ESD8704

ESD7L5.0

USB 3.0/3.1 Type A

Connetcor

Key Requirement

• Cap < 0.7 pF

Features

• 0.35 pF

• Flow through routing

• Industry leading low clamping voltage

versus competitors

USB 3.x Type A Connector

I/O

I/O2I/O

I/O

(N-1)

I/O

Top layer Other layer

ESD8704 — 0.35 pF, 2 Layer Routing

ESD8116 — 0.30 pF, 1 Layer Routing

(N-2)

I/O

. . . . .

(ESD8704; ESD7L5.0 for D+, D- Lines)

Device Interface Data Lines

ESD870 4 USB 3.x 2 Pair (Tx, Rx) 0.35 UD FN-10 2.5 x 1.0

ESD7L USB 3.x 1 Pair (D +/-) 0.5 SO T-72 3 1.2 x 1.2

ESD8504 USB 3.0 2 Pair (Tx, Rx) 0.4 U DFN-10 2.5 x 1.0

ESD8104 USB 3.0 2 Pair (Tx, Rx) 0.3 U DFN-10 2.5 x 1.0

ESD 8116 USB 3.0 3 Pair ( Tx, Rx, D+/-) 0.3 UDFN-8 2.0 x 1.2

ESD 8011 USB 3.x Single Line 0.10 X3DFN-2 0.62 x 0.32

ESD8101 USB 3.x Single Line 0.20 DSN-2 0.4 3 x 0.23

ESD 8111 USB 3.x Single Line 0.20 WLCSP-2 0.6 x 0.3

ESD8006 USB 3.0 3 Pair (Tx, R x, D +/-)

(pF) Package

0.25

UDFN-8 3.3 x 1.0

Capacitance

Size

(mm)

Page 18 Computing Solutions

Without ESD With ESD

USB 3.0 @ 5 Gb/s

Page 19

One High Speed Pair, VCC, Low Capacitance ESD Protection

Key Requirement

• Cap < 5 pF

Features

• 0.35 - 3.0 pF

• Multi-part solutions available

• Industry leading low clamping voltage

USB 2.0

I/O 1 I/O 2=I/O 3 I/O 4

USB

Host

Controller

NUP2114

BUS

D+ DGnd

Device Data Lines

NUP2114UPX 1 Pair (D+/-) + Vbus 0.8 SOT-553 1.2 x 1.6

NUP2114UCM 1 Pair (D+/-) + Vbus 0.8

NUP4114UPX 2 Pair (D+/-) + Vbus 0.5

NUP4114UCL 2 Pair (D+/-) + Vbus 0.5

NUP4114H 2 Pair (D+/-) + Vbus 0.5

ESD7L5 .0 2 0.5

ESD8351MUT 1

ESD83 51P2T 1

ESD9L5.0 1

(pF) Package

TSOP-6 3.0 x 2.75

SOT-563 1.6 x 1.6

SC-88 2.0 x 2.1

TSOP-6 3.0 x 2.75

SOT-723 1.2 x 1.2

0.37

0.5

X3D FN -2 0.6 x 0.3

SOD-923 1.0 x 0.6

One High Speed Pair, VCC, Common Mode Filter + ESD Protection

Key Requirement

• Cap < 5 pF

• Common Mode Filtering

Features

• 0.5 - 0.8 pF

• Integrated EMI suppression with ESD protection

• Industry leading low clamping voltage

Capacitance

Device Pairs

EMI2121 1

Capacitance @ 2.5 V (pF)

0.9 –25 2.5

CM Attenuation

@ 800 MHz (–dB)

DM Bandwidth

F3dB (GHz) Package

Size

(mm)

WQFN 2.2 x 2.0 x 0.75

Size

(mm)

USB

Host

Controller

EMI2121

NUP4114

BUS

D+ DGnd

BUS

D+ DGnd

Micro USB Connector

GND

D+

D-

VBUS

Top layer Other layer

USB 2.0 @ 480 Mb/s

-5

-10

-15

-20

-25

-30

-35

Suppresses Common Mode Noise Deeper than Competing Passive Solution

Common Mode

1.E+06 1.E+07 1.E+08 1.E+09

Differential Mode

Frequency

Page 19ON Semiconductor

Page 20

ESD8116

CONFIG1

CONFIG2

GND

Aux+

Aux–

Thunderbolt Connetctor

Bottom Layer

Thunderbolt Connetctor

Top Layer

GND

ML3–

ML3+

Hot Plug Detect

PWR

ML1+

ML1–

ML0+

ML0–

ML2+

ML2–

ESD8116

ESD9X

GND

Four High Speed Pairs, up to Six Additional Lines, Low Capacitance ESD

Key Requirement

• Capacitance < 0.4 pF

Features

• Capacitance of 0.35 pF or lower

• Integrated solution in 2.0 x 1.2 mm package

• Grounds between pairs to reduce cross-talk

• Flow-through routing

• Industry leading clamping voltage

Thunderbolt

I/O

I/O4I/O

Common GND = Pins 2, 3

Capacitance

Device Data Lines

ESD8006 3 Pair 0.25 UDFN-8 3.3 x 1.0

ESD 8116 3 Pair 0.30 UDFN-8 2.0 x 1.2

ESD 8011 Single Line 0.10 X3DFN-2 0.62 x 0.32

ESD8101 Single Line 0.20 D SN-2 0.43 x 0.23

(pF) Package

I/O

Size

(mm)

Top layer Bottom layer

Page 20 Computing Solutions

Without ESD8116

With ESD8116

Thunderbolt @ 10 Gb/s

Page 21

HDMI, Display Port

ESD8118

HEC DATA

CEC

SCL

SDA

5 V

HPD

D2+

HDMI Type-A

Connector

D2-

GND

D1+

D1-

GND

D0+

D0-

GND

CLK+

CLK-

GND

D2+

D2-

GND

D1+

D1-

GND

D0+

D0-

GND

CLK+

CLK-

GND

ESD8040

HDMI Type-A Connector

N/C (or HEC_DAT - HDMI1.4)

CEC

SCL

SDA

5 V

HPD (and HEC_DAT - HDMI1.4)

GND

Four High Speed Pairs, Up to Six Additional Interface Lines, Low Capacitance ESD

Key Requirement

• Cap < 0.5 pF

I/O

Features

• 0.3 pF ESD protection

• Flow through routing in high speed lines

• Industry leading low clamping voltage

I/O2I/O

I/O

(N-1)

I/O

Device Data Lines

ESD8104 4 ( TMDS ) 0.3 UDF N-10 2.5 x 1.0

ESD 8118 8 ( TMDS) 0.3 UDF N-10 3.2 x 1.2

ESD8040 14 (TMDS + Low Speed + Power) 0.3 UDF N-18 5.5 x 1.5

NUP4114UPX 5 (4 Low Speed + Power) 0.5 SOT-563 1.6 x 1.6

NUP4114UCL 5 (4 Low Speed + Power) 0.5 SC-88 2.0 x 2.1

NUP4114H 5 (4 Low Speed + Power)

Capacitance

(pF) Package

0.5

Size

(mm)

TSOP-6 3.0 x 2.75

(N-2)

I/O

. . . . .

NUP4114

• MediaGuard fully integrated solution

• Includes ethernet protection (HDMI1.4)

• Backdrive current protection

ESD8118

Without ESD

HDMI 2.0 Eye Diagram with and without ESD8104. 6 Gb/s

Top layer Other layer

ESD8040

With ESD

Page 21ON Semiconductor

Page 22

Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit

ETHERNET TRANSCEIVER

TRANSFORMER

Four Pairs, Low Capacitance Surge and ESD Protection

The 1000BASE-T or Gigabit Ethernet interface operating at higher bitrates is susceptible to ESD strikes, cable-discharge events and lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards.

Features

• Line-to-line capacitance < 3 pF

• V

(25 A surge) < 11 V

clamp

• IEC 61000-4-2 rating > 30 kV

• No latching danger

• Surge rating maintained to 125°C

Beneﬁts

• Compatible with Gb Ethernet and beyond

• Enhanced protection for downstream electronics

• Accommodates operating transients above 3.3 V

• Small form-factor allows integration into connectors

TVS8818

Flow Through

Routing

RJ-45 Connector

TPOPA

TPONA

TPOPB

TPONB

TPOPC

1000BASE-T

TPONC

TPOPD

TPOND

Protection against metallic (transverse) strikes

8/20 μs

Surge Current

Voltage (V), Current (A)

-10 0

Typical Application

TVS8818

Line Side : LC03-6 (optional)

Transformer Side: TVS8818

Competitor

Voltage

ON Semiconductor

Voltage

10 20 30

Time (μs)

Line-to-Line Surge

LC03

40 50 60

A+

A-

B+

B-

RJ45

C+

C-

D+

D-

Surge Protection Devices

Line

Device

VDC Max

(V)

Transient

Max

(V)

Surge IPP,

8/20 ms

(A)

LC03-6 6.7 7.0 100 8.0 ±30 SOIC-8

NSP4201 5.0 6.0 25 1.5 ±30 TSOP-6

NSP8 814 3.0 3.2 35 1.5 ±30 UDFN-8

NSP 8818 3.0 3.2 35 1.5 ±30 UDF N -10

NU P4114H 5.0 5.0 12* 0.4 ±13 TSOP-6

SRDA3.3 3.3 5.0 25 4.0 ±8 SOIC-8

SRDA05 5.0 7. 0 23 5.0 ±8 SOIC-8

* On Pin 5.

Page 22 Computing Solutions

Typical

Line-Line

Capacitance

(pF)

ESD

Contact

Rating

(kV) Package

Page 23

Electronic Fuses

3 – 12 V Power Bus Hot Plug Protection

Features

• Low R

(IOP, I

• Overvoltage protection

• Precise I

• Slew rate control

• Thermal shut-down

• EN pin for synchronizing multiple eFuses

• Outperforms poly-fuses:

– Tighter spec tolerances

– Lower resistance

– Shorter trip-time

– Superior repeatability

• High efﬁciency with high current capability

• eFuses in parallel achieve practically any desired level of

IOP and I

Vin

Input Filter

Capacitor

, high operating and trip currents

DS(ON)

)

TRIP

control

TRIP

Transient

Overshoot

Suppression

eFuse

NISxxxx

L-C

Low Pass Filter

DC Motor’s Noise Filter

Enable/

Fault

Enable

Thermal

Shutdown

UVLO

Voltage

(V)

Angular Vel.

(RPM)

VCC

Charge

Pump

Current

Limit

Voltage

Clamp

Control

Typical Feature Set for eFuse

Fan Blade Aerodynamic Load

Nominal Current

dV/dt

GND

Overcurrent / Overheat

conditions

Source

Limit

dV/dt

Peak Current

Permanent Magnet

DC motor

Typical Application Block Diagram

DC Motor I/V Characteristics

Continuous

Nominal Voltage

Device

NIS5431 3.3 -0.6 to 14 3.85 5 Adjustable 35

NIS5452 5 -0.6 to 14 5.85 5 Adjustable 35

NIS5232 12 -0.6 to 18 15 4.2 Adjustable 44 **

NIS5820* 12 -0.3 to 22 14 8 Adjustable 24

NIS5020* 12 - 0.3 to 22 14 10 Adjustable 14

NIS5021* 12 -0.3 to 22 14 12 Adjustable 14

* Pending 1Q18. ** Au to- retr y available on NI S5132MN2.

(V)

Input Voltage

(V)

Vclamp

(V)

Current

(A)

Trip Current

(A)

DS(ON)

(mΩ) Auto-Retry Latch Package

eFuse Prevents

Overcurrent

Current (A) / Torque (ft * lb)

3 3

WD F N -10

DF N -10

WD F N -10

Page 23ON Semiconductor

Page 24

Sales and Design Assistance from ON Semiconductor

ON Semiconductor Technical Support

www.onsemi.com/support

ON SEMICONDUCTOR INTERNATIONAL SALES OFFICES

GREATER CHINA Beijing 86-10-8577-8200

FRANCE Paris 33 (0)1 39-26-41-00 GERMANY Munich 49 (0) 89-93-0808-0 INDIA Bangalore 91-98-808-86706 ISRAEL Raanana 972 (0 ) 9-960 9-111 ITALY Milan 39 02 9239311 JAPAN Tokyo 81-3-6880-1777 KOREA Seoul 82-31-786-3700 MALAYSIA Penang 60-4-6463877 SINGAPORE Singapore 65-6484-8603 SLOVAKIA Piestany 421 33 790 2450 UNITED KINGDOM Maidenhead 44 (0) 1628 244326

ON Semiconductor Distribution Partners

Allied Electronics w ww.alliedelec.com (800) 433-5700

ALTIMA Company, Macnica, Inc. www.alt.macnica.co.jp/about/english.html (81) 45 476 215 5

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Newark/Farnell w ww.farnell.com/onsemi ( 800) 4-NEWARK

OS Electronics Co., Ltd. ww w.oselec.com Ja panes e: (81) 3 3255 5985

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Ryosan Company, Limited w ww.ryosan.co.jp/eng (81) 3 38 62 2635

RS Components www.rs-components.c om (44) 153 644 4414

Seg yung Br itestone C o. www.britestone.com ( 82) 2 3218 1511

Serial Microelectronics, HK www.serialsys.com.hk (852 ) 2790 822 0

World Peace Ind ustries Co . www.wpi-group.com (852) 236 5 4860

WT Microelectronic s Co. www.wtmec.com ( 852) 2950 0 820

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Hong Kong 852-2689-0088 Shenzhen 86-755-8209-1128 Shanghai 8 6-21-5131-716 8 Taipei, Taiw an 886 -2-2377-9911

Other L anguages : (81) 3 3255 606 6

For a comprehensive listing of

ON Semiconductor Sales Ofﬁces, Distributors,

and Rep Firms, please visit:

Americas & EMEA: www.onsemi.com/sales China: www.onsemi.cn/sales Japan: www.onsemi.jp/sales

Dec-17

AMERICAS REP FIRMS

Alabama Huntsville e-Components (256) 533-2444

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Connecticut Statewide Paragon Electronic Systems ( 603 ) 6 45 -7630 Florida Statewide e-Components (888) 468-2444 Georgia Atlanta e-Components (888) 468-2444 Illinois Statewide Matrix – Design Technology (952) 400 -1070 Indiana Fishers Bear VAI (317) 570-0707 Iowa Statewide Matrix – Design Technolog y (319) 362-6824 Maine Statewide Paragon Electronic Systems ( 603 ) 6 45 -7630 Maryland Columbia Mechtronics Sales (410) 309- 96 00 Massachusetts Statewide Paragon Electronic Systems ( 603) 645 -7630

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Jericho S.J. Metro (516) 942-3232 Rochester TriTech - Full Line Rep (585) 385-6500

North Carolina Raleigh e-Components (888) 468-2444 North Dakota Statewide Matrix – Design Technology (952 ) 4 00-1070 Ohio Brecksville Bear VAI Technology (440) 526-1991

Puerto Rico Countrywide e-Components (888) 468-2444

Rhode Island Statewide Paragon Electronic Systems ( 603) 645 -7630 South Dakota Statewide Matrix – Design Technology (9 52 ) 400-1070 Vermont Statewide Paragon Electronic Systems (60 3) 645 -7630 Wisconsin Statewide Matrix – Design Technolog y (952 ) 4 00-1070

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